Patent US1384760A successfully refreshed from Google Patents.
Patent US4024631A successfully refreshed from Google Patents.
US4024631A
Expired / Lapsed
US
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Printed circuit board plating process
Assignee: Xerox Corp
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Filing: 1975-11-24
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Granted: 1977-05-24
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Expires: 1995-11-24
Abstract
Abstract A process for manufacturing printed circuit boards wherein a layer of Nickel is plated atop a layer of copper in a pattern corresponding to a desired circuit configuration. The Nickel is used as an etch resist to remove copper from the board in the non-conductive areas. Subsequently, the Nickel is chemically activated such that it will accept a coating of solder particularly at the connection points and in the through-holes.
Inventors
- 👤 Alphonso W. Castillero
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 14:22
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K1/00; H05K1/02; H05K1/11; H05K1/117; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2203/00; H05K2203/03; H05K2203/0392; H05K2203/04; H05K2203/044; H05K3/28; H05K3/3473; H05K3/40; H05K3/42; H05K3/425; H05K3/427; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
65 words
A method for producing printed circuit boards comprising: (a) preparing the board with exposed copper in the circuit pattern desired, (b) plating nickel over the exposed copper, (c) etching away any copper not covered by nickel, (d) applying a solder mask to expose only nickel areas to be covered with solder, (e) activating the nickel to accept solder, and (f) applying solder to the nickel.
Claim 2
Independent Claim
65 words
A method for producing printed circuit boards comprising: (a) preparing the board with exposed copper in the circuit pattern desired, (b) plating nickel over the exposed copper, (c) etching away any copper not covered by nickel, (d) applying a solder mask to expose only nickel areas to be covered with solder, (e) activating the nickel to accept solder, and (f) applying solder to the nickel.
Claim 3
Dependent Claim
35 words
A method as set forth in claim 1 wherein activating the nickel comprises treating the nickel with a solution consisting of a solution of a chloride of a metal, hydrochloric acid and a wetting agent.
Claim 4
Dependent Claim
22 words
A method as set forth in claim 2 wherein said solution of a chloride of metal is a solution of palladium chloride.
Claim 5
Dependent Claim
22 words
A method as set forth in claim 2 wherein said solution of a chloride of metal is a solution of zinc chloride.
Claim 6
Dependent Claim
22 words
A method as set forth in claim 2 wherein said solution of a chloride of metal is a solution of stannous chloride.
Claim 7
Dependent Claim
39 words
A method as set forth in claim 2 wherein said solution comprises from 10% to 22% by weight hydrochloric acid, 1.5% to 3.5% by weight anhydrous stannous chloride, and the remainder of the solution water and a wetting agent.
Claim 8
Dependent Claim
20 words
A method as set forth in claim 6 wherein the solution further comprises 1% to 2% by weight palladium chloride.
Claim 9
Dependent Claim
27 words
A method as set forth in claim 6 wherein the board is immersed in the solution for 15 to 60 seconds at a temperature of 22±2° C.
Claim 10
Dependent Claim
29 words
A method as set forth in claim 2 wherein said solution comprises 10% by weight hydrochloric acid, 1.5% by weight anhydrous stannous chloride, and 88.5% water and wetting agents.
Claim 11
Dependent Claim
31 words
A method as set forth in claim 9 wherein said solution further comprises 1.0% by weight palladium chloride and the water and wetting agent comprise 87.5% by weight of the solution.
Claim 12
Dependent Claim
27 words
A method as set forth in claim 10 wherein the board is immersed in the solution for 50 to 60 seconds at a temperature of 22±2° C.
Claim 13
Dependent Claim
29 words
A method as set forth in claim 2 wherein said solution comprises 17% by weight hydrochloric acid, 2.5% by weight anhydrous stannous chloride and 80.5% water and wetting agent.
Claim 14
Dependent Claim
31 words
A method as set forth in claim 12 wherein said solution further comprises 0.5% by weight palladium chloride and the water and wetting agents comprise 80% by weight of the solution.
Claim 15
Dependent Claim
27 words
A method as set forth in claim 13 wherein said board is immersed in the solution for 25 to 35 seconds at a temperature of 22±2° C.
Claim 16
Dependent Claim
31 words
A method as set forth in claim 2 wherein said solution comprises 22% by weight hydrochloric acid, 3.5% by weight anhydrous stannous chloride and 74.5% by weight water and wetting agent.
Claim 17
Dependent Claim
31 words
A method as set forth in claim 15 wherein said solution further comprises 2.0% by weight palladium chloride and the water and wetting agent comprise 72.5% by weight of the solution.
Claim 18
Dependent Claim
27 words
A method as set forth in claim 16 wherein the board is immersed in the solution for 15 to 25 seconds at a temperature of 22±2° C.
Claim 19
Independent Claim
69 words
A method of producing a printed circuit board comprising: (a) coating a board with copper, (b) drilling through-holes in said board, (c) plating the through-holes with copper, (d) laminating an etch-resist on said board in the form of a desired circuit, (e) plating the circuit with nickel, (f) etching the excess copper from the board, (g) activating the nickel to accept solder, and (h) coating the nickel with solder.
Claim 20
Independent Claim
69 words
A method of producing a printed circuit board comprising: (a) coating a board with copper, (b) drilling through-holes in said board, (c) plating the through-holes with copper, (d) laminating an etch-resist on said board in the form of a desired circuit, (e) plating the circuit with nickel, (f) etching the excess copper from the board, (g) activating the nickel to accept solder, and (h) coating the nickel with solder.
Claim 21
Dependent Claim
35 words
A method as set forth in claim 18 wherein activating the nickel comprises treating the nickel with a solution consisting of a solution of a chloride of a metal, hydrochloric acid and a wetting agent.
Claim 22
Dependent Claim
22 words
A method as set forth in claim 19 wherein said solution of a chloride of metal is a solution of palladium chloride.
Claim 23
Dependent Claim
22 words
A method as set forth in claim 19 wherein said solution of a chloride of metal is a solution of zinc chloride.
Claim 24
Dependent Claim
22 words
A method as set forth in claim 19 wherein said solution of a chloride of metal is a solution of stannous chloride.
Claim 25
Dependent Claim
39 words
A method as set forth in claim 19 wherein said solution comprises from 10% to 22% by weight hydrochloric acid, 1.5% to 3.5% by weight anhydrous stannous chloride, and the remainder of the solution water and a wetting agent.
Claim 26
Dependent Claim
20 words
A method as set forth in claim 23 wherein the solution further comprises 1% to 2% by weight palladium chloride.
Claim 27
Dependent Claim
27 words
A method as set forth in claim 23 wherein the board is immersed in the solution for 15 to 60 seconds at a temperature of 22±2° C.
Claim 28
Dependent Claim
29 words
A method as set forth in claim 19 wherein said solution comprises 10% by weight hydrochloric acid, 1.5% by weight anhydrous stannous chloride, and 88.5% water and wetting agents.
Claim 29
Dependent Claim
31 words
A method as set forth in claim 26 wherein said solution further comprises 1.0% by weight palladium chloride and the water and wetting agent comprise 87.5% by weight of the solution.
Claim 30
Dependent Claim
27 words
A method as set forth in claim 27 wherein the board is immersed in the solution for 50 to 60 seconds at a temperature of 22±2° C.
Claim 31
Dependent Claim
28 words
A method as set forth in claim 19 wherein said solution comprises 17% by weight hydrochloric acid, 2.5% weight anhydrous stannous chloride and 80.5% water and wetting agent.
Claim 32
Dependent Claim
31 words
A method as set forth in claim 29 wherein said solution further comprises 0.5% by weight palladium chloride and the water and wetting agents comprise 80% by weight of the solution.
Claim 33
Dependent Claim
27 words
A method as set forth in claim 30 wherein said board is immersed in the solution for 25 to 35 seconds at a temperature of 22±2° C.
Claim 34
Dependent Claim
31 words
A method as set forth in claim 19 wherein said solution comprises 22% by weight hydrochloric acid, 3.5% by weight anhydrous stannous chloride and 74.5% by weight water and wetting agent.
Claim 35
Dependent Claim
31 words
A method as set forth in claim 32 wherein said solution further comprises 2:0% by weight palladium chloride and the water and wetting agent comprise 72.5% by weight of the solution.
Claim 36
Dependent Claim
27 words
A method as set forth in claim 33 wherein the board is immersed in the solution for 15 to 25 seconds at a temperature of 22±2° C.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-05-23 | 1980-11-22 | 1981-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-05-23 | 1984-11-22 | 1985-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-05-23 | 1988-11-22 | 1989-05-24 | $7700.00 | Window Closed / Lapsed |