Simplified housing structure including a heat sink for a semiconductor unit

Claim 1

A simple, low-cost housing structure for a semiconductor component or integrated circuit, in particular for insertion thereof into a layer circuit arrangement or conductor board, comprising a metal base plate of good heat conductivity, forming the bottom of the structure, and having a bottom and a top face, and upon the top face of which the semiconductor component is disposed, the latter being provided with upwardly extending contact elements, plastic foil means provided with individual metal films disposed above and contacting the respective contact elements, said metal films extending from the respective contact elements laterally outward relative thereto, and then downwardly to the base plate, with each metal film being insulated from the base plate by a plastic film, the contacted semiconductor component, and adjacent side of the base plate being protected by a plastic mass covering the same, to rigidly maintain said base plate, semiconductor component and metal contacting films in assembled relation thereby forming a unitary structure insertible in a cooperable circuit arrangement or conductor board, with said metal films directly connectible thereto for effecting the electrical connection of said semiconductor component or integrated circuit.