US4023258A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing semiconductor diodes for use in millimeter-wave circuits
Assignee: AT&T Inc
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Filing: 1976-03-05
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Granted: 1977-05-17
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Expires: 1996-03-05
Abstract
Abstract A new method of semiconductor diode processing is described in which the resulting diode chips have an ohmic contact on four side faces of the chip. This is accomplished by cutting notches in the back side of a semiconductor slice before processing and by breaking the slice along the notches after fabricating the diodes on the front side of the slice. The new diode chip has a smaller series resistance than conventional millimeter-wave structures, and it can be readily bonded or soldered to millimeter-wave thin film circuits.
Inventors
- 👤 Eric Robert Carlson
- 👤 Arno Allan Penzias
- 👤 Martin Victor Schneider
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 11:54
CPC Classifications
H; H10; H10D; H10D8/00; H10D8/60; H10P; H10P52/00; H10P54/00; Y; Y10; Y10S; Y10S257/00; Y10S257/926
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
174 words
A method of manufacturing millimeter-wave semiconductor diodes from a semiconductor wafer having an epitaxial layer and an insulating layer on the front surface of the wafer comprising the steps of notching the back surface of the semiconductor wafer in a grid-like pattern with the notches extending to a depth of approximately one-half the thickness of the semiconductor wafer thereby creating side surfaces in said wafer which are substantially flat and perpendicular to the front surface of said wafer, plating the back surface of the said semiconductor wafer including the walls created by said notching step with a conductive material, heating the semiconductor wafer to alloy the material on the back plated surface and walls of said notches, fabricating a plurality of diodes on the front surface of the semiconductor wafer with at least one diode for each of the areas created by said grid-like pattern at a point in time subsequent to heating the semiconductor wafer, and thereafter separating the semiconductor wafer along the notches in order to create a plurality of individual chips.
Claim 2
Independent Claim
174 words
A method of manufacturing millimeter-wave semiconductor diodes from a semiconductor wafer having an epitaxial layer and an insulating layer on the front surface of the wafer comprising the steps of notching the back surface of the semiconductor wafer in a grid-like pattern with the notches extending to a depth of approximately one-half the thickness of the semiconductor wafer thereby creating side surfaces in said wafer which are substantially flat and perpendicular to the front surface of said wafer, plating the back surface of the said semiconductor wafer including the walls created by said notching step with a conductive material, heating the semiconductor wafer to alloy the material on the back plated surface and walls of said notches, fabricating a plurality of diodes on the front surface of the semiconductor wafer with at least one diode for each of the areas created by said grid-like pattern at a point in time subsequent to heating the semiconductor wafer, and thereafter separating the semiconductor wafer along the notches in order to create a plurality of individual chips.
Claim 3
Dependent Claim
72 words
A process as defined in claim 1 for manufacturing semiconductor diodes wherein the step of fabricating a plurality of diodes includes the steps of creating holes in the insulating layer in order to expose the epitaxial layer in a plurality of locations over the front surface of the semiconductor wafer and depositing a conductive metal in the holes of said insulating layer in order to create rectifying contacts with said epitaxial layer.
Claim 4
Dependent Claim
63 words
A method for manufacturing semiconductor diodes as defined in claim 2 wherein the step of creating holes in said insulating layer includes the steps of coating the insulating layer with a photoresist material, exposing said photoresist material to suitable radiation through a mask having a plurality of darkened areas, developing said photoresist material, and dissolving the unexposed photoresist material with a suitable solvent.
Claim 5
Independent Claim
165 words
A method of manufacturing millimeter-wave semiconductor diodes from a semiconductor wafer having a back surface and a front surface with an epitaxial layer comprising the steps of depositing an insulating layer on the front surface of said semiconductor wafer, cutting notches in the back surface of said semiconductor wafer in a grid-like pattern to a depth of approximately one-half the thickness of the semiconductor wafer thereby sectioning the semiconductor wafer into a plurality of individual, unseparated chips having side surfaces that are substantially flat and perpendicular to the front surface of said wafer, plating the back surface of said semiconductor wafer including the walls created by said notches with a metallic conductor, heating the semiconductor wafer so as to alloy the metal plating to the semiconductor material, fabricating diodes on the front surface of said semiconductor wafer at a point in time subsequent to heating the semiconductor wafer, and thereafter separating the semiconductor wafer into individual chips along the lines created by said grid-like pattern.
Claim 6
Independent Claim
165 words
A method of manufacturing millimeter-wave semiconductor diodes from a semiconductor wafer having a back surface and a front surface with an epitaxial layer comprising the steps of depositing an insulating layer on the front surface of said semiconductor wafer, cutting notches in the back surface of said semiconductor wafer in a grid-like pattern to a depth of approximately one-half the thickness of the semiconductor wafer thereby sectioning the semiconductor wafer into a plurality of individual, unseparated chips having side surfaces that are substantially flat and perpendicular to the front surface of said wafer, plating the back surface of said semiconductor wafer including the walls created by said notches with a metallic conductor, heating the semiconductor wafer so as to alloy the metal plating to the semiconductor material, fabricating diodes on the front surface of said semiconductor wafer at a point in time subsequent to heating the semiconductor wafer, and thereafter separating the semiconductor wafer into individual chips along the lines created by said grid-like pattern.
Claim 7
Dependent Claim
97 words
A method of manufacturing semiconductor diodes as defined in claim 4 wherein the step of fabricating diodes on the front surface includes the steps of coating said insulating layer with a photoresist material, exposing said photoresist material to suitable radiation through a mask having a plurality of darkened areas, developing said photoresist material, dissolving the unexposed photoresist material so as to expose a plurality of areas on said insulating layer, etching said exposed insulating layer to expose a plurality of areas on said epitaxial layer, and depositing a metallic conductor on the areas of exposed epitaxial layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-05-16 | 1980-11-15 | 1981-05-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-05-16 | 1984-11-15 | 1985-05-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-05-16 | 1988-11-15 | 1989-05-17 | $7700.00 | Window Closed / Lapsed |