Photosensitive etching composition
Abstract
Abstract A method of forming patterns on a semiconductor element is disclosed comprising the steps of (a) depositing a coating of silicon nitride, borosilicate glass, or phosphosilicate glass on the surface of a semiconductor substrate, (b) applying a photosensitive etching solution layer to the coating and drying it, (c) irradiating the substrate with ultraviolet radiation through a photomask having a required pattern to decompose the photosensitive solution and etch the coating, and (d) removing the photosensitive solution, the decomposed material, and the reaction product of the decomposed material and the coating with an organic solvent. The photosensitive etching solution consists of a compound which may be decomposed by light to a material which etches the coating, or a compound obtained from the reaction between the photodecomposed material and other material in the solution which etches said coating.
Inventors
- 👤 Gyoji Suzuki
- 👤 Takeshi Tomotsu
Bibliographic Details
Claims Analysis
Total Claims: 4References Cited (Backward Citations)
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