Patent US3886650A successfully refreshed from Google Patents.
US3886650A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for precrimping solder rings on electrical terminal posts
Assignee: TE Connectivity Corp
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Filing: 1974-05-02
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Granted: 1975-06-03
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Expires: 1994-05-02
Abstract
Abstract A strip of heated terminal posts are attached to a common carrier and a vertically positioned ribbon of solder are supplied simultaneously to a first pair of rollers which presses the heated terminal posts into the edge of, but not through, the vertically positioned solder ribbon. Next, the strip of terminal posts, with the solder ribbon attached, is passed through a second set of rollers which crimp the solder ribbon together midway between terminal posts to force the solder further around the terminal posts, thereby ensuring that the same amount of solder will flow around each terminal post when the terminal posts are gang inserted in a printed circuit board and the solder melted.
Inventors
- 👤 Robert Franklin Cobaugh
- 👤 James Ray Coller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 15:44
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; H; H01; H01R; H01R43/00; H01R43/02; H01R43/0235; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K2201/10613; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/04; H05K2203/0415; H05K3/3447; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49204; Y10T29/49208; Y10T29/49826; Y10T29/49908; Y10T29/49915; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/532; Y10T29/53209
Claims Analysis
Total Claims: 39
Claim 1
Independent Claim
78 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal posts to a temperature adequate to melt solder; and transporting the heated terminal posts and a ribbon of solder simultaneously between a first pair of rollers having a perimetric profile constructed to press the heated terminals into the edge of, but not through, the solder ribbon which is positioned vertically with respect to said heated terminal posts.
Claim 2
Independent Claim
78 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal posts to a temperature adequate to melt solder; and transporting the heated terminal posts and a ribbon of solder simultaneously between a first pair of rollers having a perimetric profile constructed to press the heated terminals into the edge of, but not through, the solder ribbon which is positioned vertically with respect to said heated terminal posts.
Claim 3
Dependent Claim
29 words
A method in accordance with claim 1 and further comprising the step of: storing the carrier held terminal posts with the solder ribbon attached thereto in a storage means.
Claim 4
Dependent Claim
35 words
A method in accordance with claim 1 and further comprising the step of coating at least one side of the solder ribbon with solder flux to facilitate soldering the terminal posts in a substrate board.
Claim 5
Dependent Claim
83 words
A method in accordance with claim 1 comprising, after said transporting step, the further step of: passing the carrier held terminal posts with the solder ribbon attached thereto through a second pair of rollers having a circumferential surface constructed to crimp the solder ribbon between the terminal posts to force the solder further around said terminal posts to ensure an equal distribution of solder around each terminal post when the terminal posts are gang inserted in a circuit board and the solder reflowed.
Claim 6
Dependent Claim
25 words
A method in accordance with claim 4 in which the step of crimping the solder ribbon between the terminal posts completely severs the solder ribbon.
Claim 7
Independent Claim
74 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal postS to a temperature adequate to melt solder; pressing the heated terminal posts into the edge of a ribbon of solder by means of a first pair of rollers having a perimetric profile constructed to receive therebetween the heated terminals and solder ribbon which is vertically positioned with respect to said terminal posts.
Claim 8
Independent Claim
74 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal postS to a temperature adequate to melt solder; pressing the heated terminal posts into the edge of a ribbon of solder by means of a first pair of rollers having a perimetric profile constructed to receive therebetween the heated terminals and solder ribbon which is vertically positioned with respect to said terminal posts.
Claim 9
Dependent Claim
55 words
A method in accordance with claim 6 comprising the further step of: crimping the solder ribbon between said terminal posts to force the solder further around the terminal posts and to ensure a substantially equal distribution of solder around each terminal post when the terminal posts are gang inserted in a circuit board and heated.
Claim 10
Dependent Claim
25 words
A method in accordance with claim 7 in which the step of crimping the solder ribbon between the terminal posts completely severs the solder ribbon.
Claim 11
Dependent Claim
35 words
A method in accordance with claim 7 and further comprising the step of coating at least one side of the solder ribbon with solder flux to facilitate soldering the terminal posts in a substrate board.
Claim 12
Dependent Claim
30 words
A method in accordance with claim 6 comprising the further step of: winding the carrier held strip of terminal posts with the solder ribbon attached thereto upon a take-up reel.
Claim 13
Independent Claim
138 words
A method for placing a ring of solder at least part way around each of a plurality of terminal posts secured to a common carrier and comprising: heating said terminal posts to a temperature adequate to melt solder; passing said carrier held heated terminal posts between a pair of rollers; simultaneously passing a ribbon of solder between said rollers with said ribbon of solder being positioned vertically with respect to each of said terminal posts simultaneously passed between said rollers; pressing said heated terminal posts into said vertically positioned solder posts as they simultaneously pass between said pair of rollers; and passing said carrier held terminal posts with the attached vertically positioned solder ribbon between a second pair of rollers which crimp the solder ribbon between terminal posts to force the solder more completely around the terminal posts.
Claim 14
Independent Claim
138 words
A method for placing a ring of solder at least part way around each of a plurality of terminal posts secured to a common carrier and comprising: heating said terminal posts to a temperature adequate to melt solder; passing said carrier held heated terminal posts between a pair of rollers; simultaneously passing a ribbon of solder between said rollers with said ribbon of solder being positioned vertically with respect to each of said terminal posts simultaneously passed between said rollers; pressing said heated terminal posts into said vertically positioned solder posts as they simultaneously pass between said pair of rollers; and passing said carrier held terminal posts with the attached vertically positioned solder ribbon between a second pair of rollers which crimp the solder ribbon between terminal posts to force the solder more completely around the terminal posts.
Claim 15
Independent Claim
57 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal posts to a temperature adequate to melt solder; and pressing the heated terminal posts into the edge of, but not through, a ribbon of solder which is positioned vertically with respect to said heated terminal posts.
Claim 16
Independent Claim
57 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal posts to a temperature adequate to melt solder; and pressing the heated terminal posts into the edge of, but not through, a ribbon of solder which is positioned vertically with respect to said heated terminal posts.
Claim 17
Independent Claim
57 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal posts to a temperature adequate to melt solder; and pressing the heated terminal posts into the edge of, but not through, a ribbon of solder which is positioned vertically with respect to said heated terminal posts.
Claim 18
Independent Claim
57 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: heating the terminal posts to a temperature adequate to melt solder; and pressing the heated terminal posts into the edge of, but not through, a ribbon of solder which is positioned vertically with respect to said heated terminal posts.
Claim 19
Dependent Claim
35 words
A method in accordance with claim 12 and further comprising the step of coating at least one side of the solder ribbon with solder flux to facilitate soldering the terminal posts in a substrate board.
Claim 20
Dependent Claim
46 words
A method in accordance with claim 12 comprising the further step of: crimping the solder ribbon between the terminal posts to force the solder further around the terminal posts to ensure a substantially equal distribution of solder around each terminal post when the solder is melted.
Claim 21
Independent Claim
142 words
An apparatus for placing solder rings at least partially around elongated contacts secured to a common carrier strip and comprising: heating means for heating said elongated contacts sufficiently to melt solder; a first pair of roller means having parallel axes and positioned so that their cylindrical surfaces face each other in the plane joining said two axes thereof; a ribbon of solder; means for supplying said carrier held elongated contacts and said ribbon of solder between said first pair of roller means; said first pair of rollers having the cylindrical surfaces constructed to receive said ribbon of solder and said strip of elongated terminals in a plane and to press said heated elongated terminals into the edge of, but not through, said ribbon of solder as said elongated terminals and said ribbon of solder pass between said first pair of roller means.
Claim 22
Independent Claim
142 words
An apparatus for placing solder rings at least partially around elongated contacts secured to a common carrier strip and comprising: heating means for heating said elongated contacts sufficiently to melt solder; a first pair of roller means having parallel axes and positioned so that their cylindrical surfaces face each other in the plane joining said two axes thereof; a ribbon of solder; means for supplying said carrier held elongated contacts and said ribbon of solder between said first pair of roller means; said first pair of rollers having the cylindrical surfaces constructed to receive said ribbon of solder and said strip of elongated terminals in a plane and to press said heated elongated terminals into the edge of, but not through, said ribbon of solder as said elongated terminals and said ribbon of solder pass between said first pair of roller means.
Claim 23
Dependent Claim
104 words
An apparatus in accordance with claim 15 further comprising: a second pair of roller means having parallel axes and positioned with Their cylindrical surfaces facing each other in the plane passing through said two axes; means for supplying said carrier held elongated contacts with the attached ribbon of solder between said second pair of rollers; said second pair of rollers having their cylindrical surfaces constructed to crimp the solder ribbon between adjacent elongated contacts to force the solder further around said elongated terminals and to ensure that substantially equal amounts of solder will be distributed around each elongated terminal when said solder is melted.
Claim 24
Independent Claim
176 words
An apparatus for placing solder rings at least partially around terminal posts which are secured to a common carrier strip and comprising: a heating means; means for supplying said terminal posts to said heating means where said terminal posts are heated sufficiently to melt solder; a first pair of roller means having parallel axes and positioned so that their cylindrical surfaces face each other in the plane joining said parallel axis; a ribbon of solder; means for passing said carrier held terminal posts and said ribbon of solder between said first pair of roller means; said first pair of roller means having cooperative perimetric profiles constructed to receive said ribbon of solder with the plane of said ribbon positioned substantially normal to said axes and further constructed to receive said carrier held strip of terminal posts in a plane substantially parallel to said axes and to press said heated terminal posts into the edge of said ribbon of solder as said terminal posts and said ribbon of solder pass between said first pair of roller means.
Claim 25
Independent Claim
176 words
An apparatus for placing solder rings at least partially around terminal posts which are secured to a common carrier strip and comprising: a heating means; means for supplying said terminal posts to said heating means where said terminal posts are heated sufficiently to melt solder; a first pair of roller means having parallel axes and positioned so that their cylindrical surfaces face each other in the plane joining said parallel axis; a ribbon of solder; means for passing said carrier held terminal posts and said ribbon of solder between said first pair of roller means; said first pair of roller means having cooperative perimetric profiles constructed to receive said ribbon of solder with the plane of said ribbon positioned substantially normal to said axes and further constructed to receive said carrier held strip of terminal posts in a plane substantially parallel to said axes and to press said heated terminal posts into the edge of said ribbon of solder as said terminal posts and said ribbon of solder pass between said first pair of roller means.
Claim 26
Dependent Claim
104 words
An apparatus in accordance with claim 17 further comprising: a second pair of roller means having parallel axes and positioned with their cylindrical surfaces facing each other in the plane joining said two axes together; means for supplying said carrier held terminal posts with the attached ribbon of solder between said second pair of rollers; said second pair of rollers having cooperative perimetric profiles constructed to crimp the solder ribbon between adjacent terminal posts to force the solder further around the terminal posts and to ensure that substantially equal amounts of solder will be distributed around each terminal post when said solder is melted.
Claim 27
Independent Claim
144 words
An apparatus for positioning solder rings at least partially around elongated contacts secured to a common carrier strip and comprising: heating means for heating said elongated contacts sufficiently to melt solder; a first pair of surfaces positioned to face each other; a ribbon of solder; means for positioning said carrier held terminal posts and said ribbon of solder between said first pair of surfaces with the plane of said solder ribbon being substantially normal to said surfaces and to said terminal posts; said first pair of surfaces being configured to press said heated terminal posts into the edge of, but not through, said ribbon of solder so that said ribbon of solder becomes attached to said elongated contacts; and driving means for supplying continuously connected sections of said ribbon of solder and said carrier held strip of contacts between said first pair of surfaces.
Claim 28
Independent Claim
144 words
An apparatus for positioning solder rings at least partially around elongated contacts secured to a common carrier strip and comprising: heating means for heating said elongated contacts sufficiently to melt solder; a first pair of surfaces positioned to face each other; a ribbon of solder; means for positioning said carrier held terminal posts and said ribbon of solder between said first pair of surfaces with the plane of said solder ribbon being substantially normal to said surfaces and to said terminal posts; said first pair of surfaces being configured to press said heated terminal posts into the edge of, but not through, said ribbon of solder so that said ribbon of solder becomes attached to said elongated contacts; and driving means for supplying continuously connected sections of said ribbon of solder and said carrier held strip of contacts between said first pair of surfaces.
Claim 29
Dependent Claim
85 words
An apparatus in accordance with claim 19 further comprising: a second pair of surfaces positioned to face each other; means for supplying said carrier held terminal posts with the attached ribbon of solder between said second pair of surfaces; said second pair of surfaces being configured to crimp the solder ribbon between adjacent terminal posts to force the solder further around the terminal posts and to ensure that substantially equal amounts of solder will be distributed around each terminal post when said solder is melted.
Claim 30
Independent Claim
135 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: forming notches in a ribbon of solder; positioning the individual terminal posts of a Carrier held strip of terminal posts in said notches in said notched solder ribbon and with the plane of the solder ribbon substantially normal to the direction of the terminal posts; and passing the assembly comprising the carrier held terminal posts positioned in the notches in the solder ribbon through a pair of rollers having a perimetric profile constructed to crimp the solder ribbon between the terminal posts to force sections of the solder ribbon around said terminal posts to ensure an equal distribution of solder around each terminal post when the terminal posts are gang inserted in a circuit board and heated.
Claim 31
Independent Claim
135 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: forming notches in a ribbon of solder; positioning the individual terminal posts of a Carrier held strip of terminal posts in said notches in said notched solder ribbon and with the plane of the solder ribbon substantially normal to the direction of the terminal posts; and passing the assembly comprising the carrier held terminal posts positioned in the notches in the solder ribbon through a pair of rollers having a perimetric profile constructed to crimp the solder ribbon between the terminal posts to force sections of the solder ribbon around said terminal posts to ensure an equal distribution of solder around each terminal post when the terminal posts are gang inserted in a circuit board and heated.
Claim 32
Independent Claim
135 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: forming notches in a ribbon of solder; positioning the individual terminal posts of a Carrier held strip of terminal posts in said notches in said notched solder ribbon and with the plane of the solder ribbon substantially normal to the direction of the terminal posts; and passing the assembly comprising the carrier held terminal posts positioned in the notches in the solder ribbon through a pair of rollers having a perimetric profile constructed to crimp the solder ribbon between the terminal posts to force sections of the solder ribbon around said terminal posts to ensure an equal distribution of solder around each terminal post when the terminal posts are gang inserted in a circuit board and heated.
Claim 33
Independent Claim
135 words
A method for placing solder rings on terminal posts secured to a common carrier comprising the steps of: forming notches in a ribbon of solder; positioning the individual terminal posts of a Carrier held strip of terminal posts in said notches in said notched solder ribbon and with the plane of the solder ribbon substantially normal to the direction of the terminal posts; and passing the assembly comprising the carrier held terminal posts positioned in the notches in the solder ribbon through a pair of rollers having a perimetric profile constructed to crimp the solder ribbon between the terminal posts to force sections of the solder ribbon around said terminal posts to ensure an equal distribution of solder around each terminal post when the terminal posts are gang inserted in a circuit board and heated.
Claim 34
Dependent Claim
35 words
A method in accordance with claim 21 and further comprising the step of coating at least one side of the solder ribbon with solder flux to facilitate soldering the terminal posts in a substrate board.
Claim 35
Dependent Claim
25 words
A method in accordance with claim 21 in which the step of crimping the solder ribbon between the terminal posts completely severs the solder ribbon.
Claim 36
Independent Claim
118 words
A method for placing solder rings on terminal posts secured to a common carrier at predetermined spacing therealong and comprising the steps of: forming notches in the edge of a ribbon of solder at predetermined points along the length thereof corresponding to said predetermined spacing between the said terminal posts; bringing together the terminal posts and the notched solder ribbon in substantially normal planes so that the individual terminal posts fit into the notches of said solder ribbon; and passing the ribbon with the terminal posts positioned in the notches thereof through a pair of rollers constructed to crimp the solder ribbon between the terminal posts to force a section of the solder ribbon around each terminal post.
Claim 37
Independent Claim
118 words
A method for placing solder rings on terminal posts secured to a common carrier at predetermined spacing therealong and comprising the steps of: forming notches in the edge of a ribbon of solder at predetermined points along the length thereof corresponding to said predetermined spacing between the said terminal posts; bringing together the terminal posts and the notched solder ribbon in substantially normal planes so that the individual terminal posts fit into the notches of said solder ribbon; and passing the ribbon with the terminal posts positioned in the notches thereof through a pair of rollers constructed to crimp the solder ribbon between the terminal posts to force a section of the solder ribbon around each terminal post.
Claim 38
Dependent Claim
35 words
A method in accordance with claim 24 and further comprising the step of coating at least one side of the solder ribbon with solder flux to facilitate soldering the terminal posts in a substrate board.
Claim 39
Dependent Claim
25 words
A method in accordance with claim 24 in which the step of crimping the solder ribbon between the terminal posts completely severs the solder ribbon.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-06-02 | 1978-12-02 | 1979-06-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-06-02 | 1982-12-02 | 1983-06-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-06-02 | 1986-12-02 | 1987-06-03 | $7700.00 | Window Closed / Lapsed |