Abstract A connector post or pin is disclosed which is particularly suitable for use with printed circuit board assemblies. The post includes a coined portion which is designed to permit the pin to be easily inserted into holes of a predetermined size in printed circuit boards, and to increase the quality of a solder joint between the post and the printed circuit board. A solder stripe is placed on each post in the coined region to facilitate soldering of the posts to conductive portions of the printed circuit board. The posts are attached in groups to break-away carrier strips to aid in the rapid assembly of large numbers of posts to printed circuit boards. The posts may also include provisions for coupling them to multilayered printed circuit assemblies. A method of fabricating the coined post is also disclosed which converts a post with normally an interference fit in a printed circuit board aperture to a post which is freely received in the aperture together with masses of solder adhered to said post.
A method of converting an interference fit electrical connection between an elongated post of polyhedral cross-section and sharp corner edges and a plating lined aperture provided in a printed circuit board, comprising: coining a selected portion of said post to remove said sharp corner edges from said selected portion, depositing a mass of solder adhered to and encircling said selected portion in a band configuration, said coining step further including the step of forming generally planar surfaces on said selected portion of said post in place of said removed sharp corner edges, said solder adhered to and covering said planar surfaces, inserting said post in said plating lined aperture, registering said coined selected portion of said post in said plating lined aperture and creating an interference fit of said solder band in said plating lined aperture, and heating said solder band to rEflow said solder and create a void free solder joint internally of said plating lined aperture and in substantial encircling relationship with said post, said solder joint filling voids and imperfections in the plating of said plating lined aperture and reflowing to relieve stresses in said printed circuit board.
Claim 2
Independent Claim
191 words
A method of converting an interference fit electrical connection between an elongated post of polyhedral cross-section and sharp corner edges and a plating lined aperture provided in a printed circuit board, comprising: coining a selected portion of said post to remove said sharp corner edges from said selected portion, depositing a mass of solder adhered to and encircling said selected portion in a band configuration, said coining step further including the step of forming generally planar surfaces on said selected portion of said post in place of said removed sharp corner edges, said solder adhered to and covering said planar surfaces, inserting said post in said plating lined aperture, registering said coined selected portion of said post in said plating lined aperture and creating an interference fit of said solder band in said plating lined aperture, and heating said solder band to rEflow said solder and create a void free solder joint internally of said plating lined aperture and in substantial encircling relationship with said post, said solder joint filling voids and imperfections in the plating of said plating lined aperture and reflowing to relieve stresses in said printed circuit board.
Claim 3
Dependent Claim
61 words
The method of claim 1, and further including the step of: initially slicing said plating of said plating lined aperture upon insertion of said post uncoined sharp corner edges in said aperture, said solder upon reflow filling the sliced portions of said plating lined aperture to create a void free solder joint fixedly retaining said post in said plating lined aperture.