Patent US3834015A successfully refreshed from Google Patents.
US3834015A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming electrical connections
Assignee: Lanteris Space LLC
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Filing: 1973-01-29
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Granted: 1974-09-10
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Expires: 1993-01-29
Abstract
Abstract A method of manufacturing printed circuit boards of the type having a plurality of contact pins projecting from one side thereof and adapted for use as wire-wrap terminals connecting board-carried wiring to external circuits. The method includes the steps of immersing the pins and adjacent board regions in molten solder to connect the pins to the circuits carried by the board, followed by immersing the end regions of the pins in molten solder while vibrating the boards to remove excess solder from the end portions of the pins.
Inventors
- 👤 Renzo S Di
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:12
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0669; B23K3/0684; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10189; H05K2201/10227; H05K2201/10287; H05K2203/00; H05K2203/02; H05K2203/0292; H05K2203/04; H05K2203/0445; H05K3/22; H05K3/222; H05K3/3465; H05K3/3468; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
174 words
In the manufacture of circuit boards of the type having a plurality of closely spaced contact pins projecting from one side thereof in substantial parallelism and in regions of similarly closely spaced terminal means for circuit elements to which solder connections are to be made, and which pins have base portions soldered to said terminal means and free end portions adapted for use as wire-wrap terminals connecting such boardcarried circuit elements to external wiring circuits, an improved method for immersion soldering said pin base portions to said terminal means while leaving the free ends of said pins substantially devoid of solder protrusions detrimental to the formation of wire-wrap connections, comprising the steps of: immersing said pins in a bath of molten solder to the level of said terminal means, to solder-bond the pins to the terminal means; immersing free end portions only of said pins in a bath of molten solder; and removing said pin end portions from the bath and vibrating said pins to remove excess molten solder from said free end portions.
Claim 2
Dependent Claim
174 words
In the manufacture of circuit boards of the type having a plurality of closely spaced contact pins projecting from one side thereof in substantial parallelism and in regions of similarly closely spaced terminal means for circuit elements to which solder connections are to be made, and which pins have base portions soldered to said terminal means and free end portions adapted for use as wire-wrap terminals connecting such boardcarried circuit elements to external wiring circuits, an improved method for immersion soldering said pin base portions to said terminal means while leaving the free ends of said pins substantially devoid of solder protrusions detrimental to the formation of wire-wrap connections, comprising the steps of: immersing said pins in a bath of molten solder to the level of said terminal means, to solder-bond the pins to the terminal means; immersing free end portions only of said pins in a bath of molten solder; and removing said pin end portions from the bath and vibrating said pins to remove excess molten solder from said free end portions.
Claim 3
Dependent Claim
21 words
The method according to claim 1, and characterized in that said pins are vibrated generally in the direction of their lengths.
Claim 4
Dependent Claim
29 words
The method according to claim 2, and characterized in that said step of vibrating said pins is carried out as said pin end regions emerge from said solder bath.
Claim 5
Dependent Claim
21 words
The method according to claim 3, and further characterized in that immersion of said pins is effected using wave soldering techniques.
Claim 6
Dependent Claim
19 words
The method according to claim 1, and characterized in that said pins are immersed in a wave of solder.
Claim 7
Dependent Claim
32 words
The method according to claim 1, and characterized in that said pins are immersed in a wave of solder, while said circuit board is moved laterally to immerse said pins and terminals.
Claim 8
Dependent Claim
23 words
The method according to claim 6, and characterized further in that said board is moved laterally at a rate of about 1 ft./min.
Claim 9
Dependent Claim
32 words
The method according to claim 6, and characterized in that said board is supported in frame means, and vibrations are imparted to said board and pins through vibration of the frame means.
Claim 10
Dependent Claim
203 words
In the manufacture of circuit boards of the type having a plurality of closely spaced contact pins projecting from one side thereof in substantial parallelism and in regions of similarly closely spaced terminal means for circuit elements to which solder connections are to be made, and which pins have base portions soldered to said terminal means and free end portions adapted for use as wire-wrap terminals connecting such boardcarried circuit elements to external wiring circuits, an improved method for immersion soldering said pin base portions to said terminal means while leaving the free ends of said pins substantially devoid of solder protrusions detrimental to the formation of wire-wrap connections, comprising the steps of: immersing said pins in a bath of molten solder to the level of said terminal means, followed by removal of said pins from said bath to solder-bond the pins to the terminal means; immersing free end portions only of said pins in said bath of molten solder to melt residual solder on said end portions; removing said free end portions of said pins from said bath; and vibrating said pins while said residual solder is molten to reduce any lateral extent of such molten solder from said free end portions.
Claim 11
Dependent Claim
203 words
In the manufacture of circuit boards of the type having a plurality of closely spaced contact pins projecting from one side thereof in substantial parallelism and in regions of similarly closely spaced terminal means for circuit elements to which solder connections are to be made, and which pins have base portions soldered to said terminal means and free end portions adapted for use as wire-wrap terminals connecting such boardcarried circuit elements to external wiring circuits, an improved method for immersion soldering said pin base portions to said terminal means while leaving the free ends of said pins substantially devoid of solder protrusions detrimental to the formation of wire-wrap connections, comprising the steps of: immersing said pins in a bath of molten solder to the level of said terminal means, followed by removal of said pins from said bath to solder-bond the pins to the terminal means; immersing free end portions only of said pins in said bath of molten solder to melt residual solder on said end portions; removing said free end portions of said pins from said bath; and vibrating said pins while said residual solder is molten to reduce any lateral extent of such molten solder from said free end portions.
Claim 12
Dependent Claim
21 words
The method according to claim 9, and characterized in that said pins are vibrated generally in the direction of their lengths.
Claim 13
Dependent Claim
32 words
The method according to claim 10, and characteRized in that said pins are immersed in a wave of solder, while said circuit board is moved laterally to immerse said pins and terminals.
Claim 14
Dependent Claim
32 words
The method according to claim 11, and characterized in that said board is supported in frame means, and vibrations are imparted to said board and pins through vibration of the frame means.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-09-09 | 1978-03-11 | 1978-09-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-09-09 | 1982-03-11 | 1982-09-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-09-09 | 1986-03-11 | 1986-09-10 | $7700.00 | Window Closed / Lapsed |