US3726007A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Component side printed circuit soldering
Assignee: Lockheed Martin Corp
•
Filing: 1971-02-02
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Granted: 1973-04-10
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Expires: 1991-02-02
Abstract
Abstract A method of securing at least one multilead electronic component upon a supporting medium in an electrically correct manner, involving the leads of the component to a large extent disposed on the same side of the supporting medium or board as the component, with the component itself being passed through molten solder during the soldering of the component leads to the circuitry of the supporting medium. Because the necessity of through holes in the supporting medium is thus essentially eliminated, the practice of my method can result in the manufacture of circuit boards having an extremely high component density, with this method also making possible the use of wave solder techniques, and therefore the production of high density circuit boards and the like in a very rapid manner. A novel circuit board is also taught herein, involving at least one multilead component placed on a supporting medium with its lead terminations to a large extent located on the same side of the supporting medium as the component itself. Single sided as well as double sided boards of high density can be made in this manner.
Inventors
- 👤 J Keller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 20:17
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0653; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B23K2101/00; B23K2101/36; B23K2101/42; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/15; H05K2203/1581; H05K3/303; H05K3/305; H05K3/341; H05K3/3421; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
87 words
A method of securing electronic components upon a supporting medium or substrate comprising the steps of placing at least one component having a plurality of leads upon a first surface of the supporting medium, with the leads being disposed in electricallycorrect positions and to a large extent terminating on said first surface, and passing said first surface through molten solder to effect the soldering of the leads to appropriate locations on said supporting medium, and at the same time the component is contacted by the molten solder.
Claim 2
Independent Claim
87 words
A method of securing electronic components upon a supporting medium or substrate comprising the steps of placing at least one component having a plurality of leads upon a first surface of the supporting medium, with the leads being disposed in electricallycorrect positions and to a large extent terminating on said first surface, and passing said first surface through molten solder to effect the soldering of the leads to appropriate locations on said supporting medium, and at the same time the component is contacted by the molten solder.
Claim 3
Dependent Claim
26 words
The method as defined in claim 1 in which said component is to be secured to a supporting medium in the form of a wiring board.
Claim 4
Dependent Claim
33 words
The method as defined in claim 1 in which said component is an integrated circuit flatpack that is to be secured to a supporting medium in the form of a printed circuit board.
Claim 5
Dependent Claim
19 words
The method as defined in claim 1 in which said component is to be secured to a terminal board.
Claim 6
Dependent Claim
23 words
The method as defined in claim 1 in which said component is to be secured to a thick film or thin film substrate.
Claim 7
Dependent Claim
20 words
The method as defined in claim 1 in which said component is a discrete device whose exterior is largely ceramic.
Claim 8
Dependent Claim
20 words
The method as defined in claim 1 in which said component is a discrete device whose exterior is largely metallic.
Claim 9
Dependent Claim
20 words
The method as defined in claim 1 in which said component is a discrete device whose exterior is largely plastic.
Claim 10
Dependent Claim
24 words
The method as defined in claim 1 in which said component is a discrete device whose exterior is formed from a combination of materials.
Claim 11
Dependent Claim
19 words
The method as defined in claim 1 in which said molten solder is in the form of a wave.
Claim 12
Dependent Claim
39 words
The method as defined in claim 1 in which at least one component is disposed on each surface of said supporting medium, with each surFace being passed through molten solder in order to effect the soldering of lead terminations.
Claim 13
Independent Claim
119 words
A method of securing electrical components onto a component board in the electrically correct manner, comprising the steps of placing at least one component body having a number of leads on a first surface of the board, said leads to a large extent terminating on said first surface rather than on the opposite surface, passing said board into a wave of molten solder such that a soldering of the lead terminations to appropriate locations on said first surface of the board is effected, with said solder wave at the same time also contacting said electrical component body, whereby few if any connections between said component and the board need to be made on said opposite surface of said board.
Claim 14
Independent Claim
119 words
A method of securing electrical components onto a component board in the electrically correct manner, comprising the steps of placing at least one component body having a number of leads on a first surface of the board, said leads to a large extent terminating on said first surface rather than on the opposite surface, passing said board into a wave of molten solder such that a soldering of the lead terminations to appropriate locations on said first surface of the board is effected, with said solder wave at the same time also contacting said electrical component body, whereby few if any connections between said component and the board need to be made on said opposite surface of said board.
Claim 15
Dependent Claim
49 words
The method as defined in claim 12 in which at least one component is also to be secured to the other or second surface of said board, involving therefore the additional step of passing said second surface through the molten solder to effect the soldering of its lead terminations.
Claim 16
Independent Claim
123 words
A method of electrically attaching electrical components to a circuit board without it being necessary to predrill the board comprising the steps of placing on one side of the board, at least one electrical component having a plurality of leads, positioning the leads of said component in contact with various circuit locations on said board, passing said board in contact with molten solder to accomplish the soldering of the leadS to the circuit locations, said molten solder at the same time being in contact with said electrical component, said soldering thus taking place on the same side of the board as said component, and making it unnecessary to accomplish the passing of the leads through the board for the creation of solder joints.
Claim 17
Independent Claim
123 words
A method of electrically attaching electrical components to a circuit board without it being necessary to predrill the board comprising the steps of placing on one side of the board, at least one electrical component having a plurality of leads, positioning the leads of said component in contact with various circuit locations on said board, passing said board in contact with molten solder to accomplish the soldering of the leadS to the circuit locations, said molten solder at the same time being in contact with said electrical component, said soldering thus taking place on the same side of the board as said component, and making it unnecessary to accomplish the passing of the leads through the board for the creation of solder joints.
Claim 18
Dependent Claim
35 words
The method as defined in claim 14 in which a large plurality of components are arrayed on said first surface of said board, with the absence of predrilled holes making possible a great circuit density.
Claim 19
Dependent Claim
20 words
The method as defined in claim 15 in which a large plurality of components are arrayed on both board surfaces.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-04-09 | 1976-10-09 | 1977-04-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-04-09 | 1980-10-09 | 1981-04-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-04-09 | 1984-10-09 | 1985-04-10 | $7700.00 | Window Closed / Lapsed |