US3553824A
Expired / Lapsed
US
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Process for eliminating icicle-like formations on soldered circuit substrates
Assignee: AT&T Inc
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Filing: 1968-05-09
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Granted: 1971-01-12
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Expires: 1988-05-09
Abstract
Abstract THE ICICLE-LIKE FORMATIONS OF SOLDER WHICH ARE PRODUCED IN CONVENTIONAL SOLDERING PROCESSES, WHEN A CIRCUIT CARRIED ON A SUBSTRATE IS SUBJECTED TO AN UNDERLYING SOLDER BATH, ARE SUBSTANTIALLY REDUCED IN SIZE BY INVERTING THE CIRCUIT TO AN UPWARDLY FACING ORIENTATION, COATING IT WITH A FLUX (EITHER BEFORE OR AFTER THE INVERSION) AND SUBJECTING THE FLUXED SOLDERED SURFACE TO AN INFRA-RED OR OTHER RADIANT HEAT SORCE RADIATING SUFFICIENT HEAT TO MELT THE ICICLES.
Inventors
- 👤 Edward D Kozelnicky
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 12:33
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K1/00; B23K1/08; B23K1/085; H05K3/3494; H05K2203/00; H05K2203/04; H05K2203/0445; H05K2203/11; H05K2203/1105; H05K3/3447; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49155; Y10T29/49204; Y10T29/49224
Claims Analysis
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-01-11 | 1974-07-13 | 1975-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-01-11 | 1978-07-13 | 1979-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-01-11 | 1982-07-13 | 1983-01-12 | $7700.00 | Window Closed / Lapsed |