Package for microwave semiconductor device

Claim 2

A package for holding a semi-conductor device having an input, output and common terminal comprising: a. an electrically conductive header having a pedestal depending upwardly from said header and being integral therewith; b. a first thermally conductive member having an aperture therethrough coupled to said pedestal, the pedestal of said header being intermediate said aperture and the outer edges of said first thermally conductive member, said first thermally conductive member having transverse depressions on the outer surface thereof on opposite sides of said aperture; c. first and second metallized regions disposed on said first thermally conductive member opposite said header, said first metallized region being adjacent one of said depressions and extending to the edge of said aperture, said second metallized region being adjacent the other of said depressions and extending to the edge of said aperture to the vicinity of said first metallized region, said first and second metallized regions being electrically isolated from each other; d. a second thermally conductive member coupled to said first thermally conductive member; e. third and fourth metallized regions disposed on said second thermally conductive member aligned wiTh and adjacent said first and second metallized regions respectively, said third and fourth metallized regions extending above and being accessible as the input and output terminals of the semiconductor device when said first and second thermally conductive members are coupled to one another; and f. a third thermally conductive member having central and outer metallized regions, said third thermally conductive members being coupled to said header, said outer metallized region being in contact with said header to provide the common terminal, said central metallized region for receiving the semiconductor device.

Claim 3

A package as defined in claim 1 including strip line contact leads connected to said third and fourth metallized regions within said depressions.

Claim 4

A package as defined in claim 1 wherein said first, second and third thermally conductive members are fabricated from a ceramic.

Claim 5

A package as defined in claim 3 wherein said third thermally conductive member is fabricated from beryllia.

Claim 6

A package as defined in claim 1 including a microwave device mounted upon the central metallized region of said third thermally conductive member and a cap hermetically coupled to said second thermally conductive member over the aperture through said second thermally conductive member.

Claim 7

A package for a microwave device having an input, output and common terminals comprising: a. an electrically conductive header having a pedestal extending upwardly from said header and being integral therewith; b. a first thermally conductive member having top, bottom and side surfaces and an aperture therethrough, the bottom surface of said first thermally conductive member being coupled to the pedestal of said header, and having depressions in the side surfaces on opposite sides of said apertures, said pedestal being intermediate said aperture and said side surfaces; c. first and second metallized layers disposed on the top surface of said first thermally conductive member, said first metallized layer being adjacent one of said depressions and extending to said aperture, said second metallized layer being adjacent the other of said depressions and extending about the periphery of the aperture to the vicinity of said first metallized layer, said first and second metallized layer being electrically isolated from each other; d. a second thermally conductive member having top and bottom surface and an aperture therethrough circumscribing the aperture through said first thermally conductive member, the bottom surface of said second thermally conductive member being connected to the top surface of said first thermally conductive member; e. third and fourth metallized layers disposed on the bottom surface of said second thermally conductive member adjacent said first and second metallized layers respectively, said third and fourth metallized layers each extending about one of said depressions; f. strip line contact leads connected to each of the third and fourth metallized layers within said depression; g. a third metallized thermally conductive member having top, bottom and side surfaces having a central metallized layer on the top surface thereof for receiving the microwave device and an outer metallized layer bounding said central metallized layer and extending about the side and bottom surfaces thereof, the bottom surface of said third metallized thermally conductive member being connected to the pedestal of said header; and h. means for connecting the regions of said microwave device to said first, second and outer metallized layers.

Claim 8

A package for a microwave device having an input, output and common terminals comprising: a. an electrically conductive header having a pedestal extending upwardly from said header and being integral therewith; b. a first thermally conductive member having top, bottom and side surfaces and an aperture therethrough, the bottom surface of said first thermally conductive member being coupled to the pedestal of said header, and having depressions in the side surfaces on opposite sides of said apertures, said pedestal being intermediate said aperture and said side surfaces; c. first and second metallized layers disposed on the top surface of said first thermally conductive member, said first metallized layer being adjacent one of said depressions and extending to said aperture, said second metallized layer being adjacent the other of said depressions and extending about the periphery of the aperture to the vicinity of said first metallized layer, said first and second metallized layer being electrically isolated from each other; d. a second thermally conductive member having top and bottom surface and an aperture therethrough circumscribing the aperture through said first thermally conductive member, the bottom surface of said second thermally conductive member being connected to the top surface of said first thermally conductive member; e. third and fourth metallized layers disposed on the bottom surface of said second thermally conductive member adjacent said first and second metallized layers respectively, said third and fourth metallized layers each extending about one of said depressions; f. strip line contact leads connected to each of the third and fourth metallized layers within said depression; g. a third metallized thermally conductive member having top, bottom and side surfaces having a central metallized layer on the top surface thereof for receiving the microwave device and an outer metallized layer bounding said central metallized layer and extending about the side and bottom surfaces thereof, the bottom surface of said third metallized thermally conductive member being connected to the pedestal of said header; and h. means for connecting the regions of said microwave device to said first, second and outer metallized layers.

Claim 9

A package as defined in claim 6 including a microwave device mounted upon the central metallized layer and a cap hermetically coupled to said second thermally conductive member over the aperture therethrough.

Claim 10

A package as defined in claim 6 wherein said means for connecting comprises interlaced, stitch bonded leads.

Claim 11

A package as defined in claim 6 wherein said first, second and thirD thermally conductive members are fabricated from a ceramic.

Claim 12

A package as defined in claim 9 wherein said third thermally conductive member is fabricated from beryllia.