Hermetic ceramic power package for high frequency solid state device

Claim 1

In an hermetic power package for a high frequency solid state element employing a conductive stud the improvement comprising an insulating base of beryllium ceramics, said base being adapted to support said solid state element and fixedly secured to the top surface of said stud without an intervening discrete member, an insulating member of alumina ceramics separated from said insulating base and enclosing the outside of the base in a noncontacting manner, said insulating member having a thickness greater than that of the insulating base so that the top surface thereof extends above the top surface of said insulating base, said insulating member of alumina ceramic fixedly secured to the top surface of said stud of high purity copper without an intervening discrete member, an electrical conducting area formed on the top surface of said insulating member, an insulating housing of alumina ceramics formed integrally with said insulating member on the top surface thereof and in part over said electrical conducting area, said insulating housing configured to expose said electrical conducting area whereby said electrical conducting area passes through said integrally formed insulating member and insulating housing, and an air tight cap adapted to be hermetically sealed to said insulating housing whereby an hermetically sealed enclosure is formed by said insulating member, said insulating housing, said cap on said stud with said electrical conducting area enabling electrical interconnection to said solid state element in said enclosure.