Abstract There is disclosed offset top ejection apparatus for use in vapor deposition chambers which provides a uniform contaminationfree layer on top of a spinning susceptor plate. The uniformity of the layer is assured by providing an offset downwardly pointing nozzle which is off-centered from the revolving susceptor and from which the deposited material emanates. The arrangement of apertures and the taper of the conical nozzle defines the extent and uniformity of the resulting layer in the offset configuration. Off-setting an ejection nozzle permits a larger area to be uniformly coated resulting in a higher yield for semiconductor wafers carried by the rotating susceptor plate and on which are deposited a layer of dielectric, passivation or other material.
Apparatus for vapor deposition of a layer of material on a plurality of substrates comprising: a sealed chamber; a rotatable support in said sealed chamber; a susceptor having a central opening and connected to said rotatable support for carrying the plurality of substrates; a frusto-conical ejection nozzle; feed means extending through said opening and connected to said frusto-conical ejection nozzle and to said sealed chamber for supporting and feeding a plurality of gaseous vapors into said frusto-conical ejection nozzle, said frusto-conical ejection nozzle being offset with respect to the center of said susceptor and being directed at said susceptor; and said feed means including an outer conduit connected to the smaller end of the frusto-conical ejection nozzle and an inner conduit concentrically arranged with respect to said outer conduit and extending further into said frusto-conical ejection nozzle than said outer conduit by a predetermined distance selected to prevent formation of particles wherein vapor of a first type ejected from said inner conduit is reflected from the occluded portion of said face plate and is mixed with vapor of a second type ejected from said outer conduit; and a face plate connected to said frusto-conical ejection nozzle at the larger end thereof, said face plate having a plurality of apertures therein, a central portion of said face plate being occluded.
Claim 2
Dependent Claim
219 words
Apparatus for vapor deposition of a layer of material on a plurality of substrates comprising: a sealed chamber; a rotatable support in said sealed chamber; a susceptor having a central opening and connected to said rotatable support for carrying the plurality of substrates; a frusto-conical ejection nozzle; feed means extending through said opening and connected to said frusto-conical ejection nozzle and to said sealed chamber for supporting and feeding a plurality of gaseous vapors into said frusto-conical ejection nozzle, said frusto-conical ejection nozzle being offset with respect to the center of said susceptor and being directed at said susceptor; and said feed means including an outer conduit connected to the smaller end of the frusto-conical ejection nozzle and an inner conduit concentrically arranged with respect to said outer conduit and extending further into said frusto-conical ejection nozzle than said outer conduit by a predetermined distance selected to prevent formation of particles wherein vapor of a first type ejected from said inner conduit is reflected from the occluded portion of said face plate and is mixed with vapor of a second type ejected from said outer conduit; and a face plate connected to said frusto-conical ejection nozzle at the larger end thereof, said face plate having a plurality of apertures therein, a central portion of said face plate being occluded.
Claim 3
Dependent Claim
29 words
The apparatus as recited in claim 1 wherein said apertures in said face plate are arranged to form an outer ring of apertures and an inner ring of apertures.