Cathode sputtering apparatus including precision temperature control of substrate

Claim 1

IN A SPUTTERING DEVICE FOR DEPOSITINF THIN FILMS OF HIGHLY UNIFORM CHARACTERISTICS, SAID SPUTTERING DEVICE INCLUDING A VACUUM CHAMBER, A CATHODE ELECTRODE HAVING A DISCHARGE SURFACE TO BE IMPACE EVAPORATED, A SUBSTRATE, AN ANODE ELECTRODE, SAID ELECTRODES BEING ARRANGED WITHIN SAID CHAMBER, EMANS TO EVACATE SAID CHAMBER AND IMPOSE WITHIN SAID CHAMBER A SUITABLE PRESSURE OF IONIZABLE GAS, AND MEANS TO ESTABLISH A SUITABLE ANODE-CATHODE POTENTIAL DIFFERENCE TO THEREBY INVOKE AN ABNORMAL GLOW DISCHARGE WHEREBY SAID DISCHARGE SURFACE IS IMPACT EVAPORATED AND DEPOSITED ON SAID SUBSTRATE, AN APPARATUS FOR CONTROLLING THE TEMPERATURE OF THE FILM DURING DEPOSITION THEREOF, COMPRISING: SUBSTRATE MOUNTING MEANS FOR MOUNTING SAID SUBSTRATE WITHIN SAID CHAMBER, AND THERMALLY INTERCONNECTED WITH SAID SUBSTRATE; A TEMPERATURE SENSING ELEMENT FOR SENSING THE TEMPERATURE OF SAID SUBSTRATRE AND PROVIDING AN ELECTRICAL CHARACTERSITIC WHICH IS DEPENDENT UPON SAID TEMPERATURE; MEANS FOR HEATING SAID SUBSTRATE MOUNTING MEANS; MEANS FOR CONVECTION COOLING THE INTERIOR OF SAID SUBSTRATE MOUNTING MEANS; AND MEANS CONNECTED TO THE OUTPUT OF SAID TEMPERATURE SENSING MEANS FOR OPERATING, EACH FOR A SELECTED TIME PERIOD, SAID HEATING MEANS AND SAID COOLING MEANS IN RESPONSE TO SAID CHARACTERISTIC OF SAID TEMPERATURE SENSING MEANS, WHEREBY SAID FILM IS MAINTAINED PRECISELY UNIFORM AT A PRESCRIBED TEMPERATURE.