Patent US3801225A successfully refreshed from Google Patents.
Patent US2932594A successfully refreshed from Google Patents.
US2932594A
Expired / Lapsed
US
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Method of making surface alloy junctions in semiconductor bodies
Assignee: RCA Corp
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Filing: 1956-09-17
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Granted: 1960-04-12
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Expires: 1976-09-17
Abstract
No abstract record available.
Inventors
- 👤 Charles W Mueller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:07
CPC Classifications
H; H10; H10P; H10P95/00; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
112 words
IN THE SURFACE ALLOYING OF IMPURITY PELLETS TO MONOXRYSTALLINE SEMICONDUCTOR WAFERS, THE IMPROVEMENT COMPRISING FIRST SOLDERING THE PELLET TO THE DESIRED SITE ON A SURFACE OF SAID WATER BY CONTACTING SAID PELLET TO SAID WAFER AND HEATING THE ASSEMBLY IN A REDUCING ATMOSPHERE TO A TEMPERATURE AT WHICH THE PELLET ADHERES TO THE WAFER BUT BELOW THE TEMPERATURE AT WHICH THE PELLET APPRECIABLY DISSOLVES THE WAFER MATERIAL, THEN ALLOYING SAID PELLET TO SAID WAFER BY RAPIDLY HEATING SAID ASSEMBLY AT A RATE OF OVER 1,000*C. PER MINUTE IN A SLIGHTLY OXIDIZING ATMOSPHERE TO A PREDETERMINED TEMPERATURE AT WHICH THE PELLET MATERIAL DISSOLVES THE WAFER MATERIAL, THEREAFTER COOLING SAID ASSEMBLY TO ROOM TEMPERATURE.
Claim 2
Dependent Claim
112 words
IN THE SURFACE ALLOYING OF IMPURITY PELLETS TO MONOXRYSTALLINE SEMICONDUCTOR WAFERS, THE IMPROVEMENT COMPRISING FIRST SOLDERING THE PELLET TO THE DESIRED SITE ON A SURFACE OF SAID WATER BY CONTACTING SAID PELLET TO SAID WAFER AND HEATING THE ASSEMBLY IN A REDUCING ATMOSPHERE TO A TEMPERATURE AT WHICH THE PELLET ADHERES TO THE WAFER BUT BELOW THE TEMPERATURE AT WHICH THE PELLET APPRECIABLY DISSOLVES THE WAFER MATERIAL, THEN ALLOYING SAID PELLET TO SAID WAFER BY RAPIDLY HEATING SAID ASSEMBLY AT A RATE OF OVER 1,000*C. PER MINUTE IN A SLIGHTLY OXIDIZING ATMOSPHERE TO A PREDETERMINED TEMPERATURE AT WHICH THE PELLET MATERIAL DISSOLVES THE WAFER MATERIAL, THEREAFTER COOLING SAID ASSEMBLY TO ROOM TEMPERATURE.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1963-04-12 | 1963-10-12 | 1964-04-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1967-04-12 | 1967-10-12 | 1968-04-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1971-04-12 | 1971-10-12 | 1972-04-12 | $7700.00 | Window Closed / Lapsed |