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US2932594A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making surface alloy junctions in semiconductor bodies

Assignee: RCA Corp
•
Filing: 1956-09-17
•
Granted: 1960-04-12
•
Expires: 1976-09-17
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Abstract

No abstract record available.

Inventors

  • 👤 Charles W Mueller

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 13:38
CPC Classifications
H; H10; H10P; H10P95/00; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 112 words
IN THE SURFACE ALLOYING OF IMPURITY PELLETS TO MONOXRYSTALLINE SEMICONDUCTOR WAFERS, THE IMPROVEMENT COMPRISING FIRST SOLDERING THE PELLET TO THE DESIRED SITE ON A SURFACE OF SAID WATER BY CONTACTING SAID PELLET TO SAID WAFER AND HEATING THE ASSEMBLY IN A REDUCING ATMOSPHERE TO A TEMPERATURE AT WHICH THE PELLET ADHERES TO THE WAFER BUT BELOW THE TEMPERATURE AT WHICH THE PELLET APPRECIABLY DISSOLVES THE WAFER MATERIAL, THEN ALLOYING SAID PELLET TO SAID WAFER BY RAPIDLY HEATING SAID ASSEMBLY AT A RATE OF OVER 1,000*C. PER MINUTE IN A SLIGHTLY OXIDIZING ATMOSPHERE TO A PREDETERMINED TEMPERATURE AT WHICH THE PELLET MATERIAL DISSOLVES THE WAFER MATERIAL, THEREAFTER COOLING SAID ASSEMBLY TO ROOM TEMPERATURE.
Claim 2
Dependent Claim 112 words
IN THE SURFACE ALLOYING OF IMPURITY PELLETS TO MONOXRYSTALLINE SEMICONDUCTOR WAFERS, THE IMPROVEMENT COMPRISING FIRST SOLDERING THE PELLET TO THE DESIRED SITE ON A SURFACE OF SAID WATER BY CONTACTING SAID PELLET TO SAID WAFER AND HEATING THE ASSEMBLY IN A REDUCING ATMOSPHERE TO A TEMPERATURE AT WHICH THE PELLET ADHERES TO THE WAFER BUT BELOW THE TEMPERATURE AT WHICH THE PELLET APPRECIABLY DISSOLVES THE WAFER MATERIAL, THEN ALLOYING SAID PELLET TO SAID WAFER BY RAPIDLY HEATING SAID ASSEMBLY AT A RATE OF OVER 1,000*C. PER MINUTE IN A SLIGHTLY OXIDIZING ATMOSPHERE TO A PREDETERMINED TEMPERATURE AT WHICH THE PELLET MATERIAL DISSOLVES THE WAFER MATERIAL, THEREAFTER COOLING SAID ASSEMBLY TO ROOM TEMPERATURE.

References Cited (Backward Citations)

US2733390A Cited
US2785095A Cited
US2748325A Cited
US2836520A Cited
US2877147A Cited
US2761800A Cited
US2825667A Cited
US2836523A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1963-04-12 1963-10-12 1964-04-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1967-04-12 1967-10-12 1968-04-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1971-04-12 1971-10-12 1972-04-12 $7700.00 Window Closed / Lapsed

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