US20040154722A1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked die module and techniques for forming a stacked die module
Assignee: Individual
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Filing: 2004-02-03
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Granted: —
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Expires: 2024-02-03
Abstract
Abstract A technique for forming die stacks. Specifically, a stacking tip is provided to facilitate the stacking of die in a desired configuration. A first die is picked up by the stacking tip. The first die is coated with an adhesive on the underside of the die. The first die is brought in contact with a second die via the stacking tip. The second die is coupled to the first die via the adhesive on the underside of the first die. The second die is coated with an adhesive coating on the underside of the die. The second die is then brought in contact with a third die via the stacking tip. The third die is coupled to the second die via the adhesive on the underside of the second die, and so forth. Die stacks are formed without being coupled to a substrate. The die stacks may be functionally and/or environmentally tested before attaching the die stack to a substrate.
Inventors
- 👤 Chad Cobbley
- 👤 Timothy Jackson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:27
CPC Classifications
H; H10; H10W; H10W90/00; H10W20/00; H10W20/20; H10P; H10P74/00; H10P74/23; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/20; H10W72/50; H10W72/551; H10W72/60; H10W72/90; H10W72/951; H10W90/20; H10W90/24; H10W90/284; H10W90/297; H10W90/701; H10W90/731; H10W90/732; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T156/00; Y10T156/10
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
44 words
1 . A method of testing semiconductor die comprising the acts of: forming a stack of at least two semiconductor die; and after the stack is formed, testing the semiconductor die in the stack prior to attaching the semiconductor die to a packaging substrate.
Claim 2
Dependent Claim
44 words
1 . A method of testing semiconductor die comprising the acts of: forming a stack of at least two semiconductor die; and after the stack is formed, testing the semiconductor die in the stack prior to attaching the semiconductor die to a packaging substrate.
Claim 3
Dependent Claim
102 words
2 . The method, as set forth in claim 1 , where the act of forming comprises the acts of: a) picking up a first die having a topside and an underside with a die picking tool; b) applying adhesive to the underside of the first die, thereby providing an adhesively coated underside of the first die; and c) without releasing the first die from the die picking tool, picking up a second die having a topside and an underside by placing the adhesively coated underside of the first die against the topside of the second die, thereby forming a die stack.
Claim 4
Dependent Claim
21 words
3 . The method, as set forth in claim 2 , wherein the first die is thicker than the second die.
Claim 5
Dependent Claim
24 words
4 . The method, as set forth in claim 2 , wherein the acts (a), (b), and (c) are performed in the recited order.
Claim 6
Dependent Claim
19 words
5 . The method, as set forth in claim 2 , wherein act (b) is performed before act (a).
Claim 7
Dependent Claim
34 words
6 . The method, as set forth in claim 2 , comprising the act of applying adhesive to the underside of the second die, thereby providing an adhesively coated underside of the second die.
Claim 8
Dependent Claim
52 words
7 . The method, as set forth in claim 6 , comprising the act of without releasing the first die from the picking tool, picking up a third die having a topside and an underside by placing the adhesively coated underside of the second die against the topside of the third die.
Claim 9
Dependent Claim
29 words
8 . The method, as set forth in claim 1 , wherein the act of forming comprises the act of forming a stack of at least three semiconductor die.
Claim 10
Dependent Claim
43 words
9 . The method, as set forth in claim 1 , wherein the act of tesing comprises the act of: after the stack is formed, functionally testing the semiconductor die in the stack prior to attaching the semiconductor die to the packaging substrate.
Claim 11
Dependent Claim
43 words
10 . The method, as set forth in claim 1 , wherein the act of testing comprises the act of: after the stack is formed, environmental testing the semiconductor die in the stack prior to attaching the semiconductor die to the packaging substrate.
Claim 12
Dependent Claim
23 words
11 . The method, as set forth in claim 1 , comprising the act of coupling the tested stack to the packaging substrate.
Claim 13
Dependent Claim
18 words
12 . The method, as set forth in claim 1 , wherein packaging substrate comprises a tape reel.
Claim 14
Dependent Claim
19 words
13 . The method, as set forth in claim 1 , wherein the packaging substrate comprises a film frame.
Claim 15
Dependent Claim
19 words
14 . The method, as set forth in claim 1 , wherein the packaging substrate comprises a gel pack.
Claim 16
Dependent Claim
18 words
15 . The method, as set forth in claim 1 , wherein the packaging substrate comprises a wafer.
Claim 17
Dependent Claim
63 words
16 . The method, as set forth in claim 1 , comprising the acts of: applying a first adhesive between each of the at least two semiconductor die, the first adhesive being curable at a first temperature; and applying a second adhesive between the stack and the packaging substrate, the second adhesive being curable at a second temperature lower than the first temperature.
Claim 18
Dependent Claim
21 words
17 . The method, as set forth in claim 1 , wherein the act of forming comprises forming a shingle stack.
Claim 19
Dependent Claim
30 words
18 . The method, as set forth in claim 11 , comprising the act of using the tested stack coupled to the packaging substrate to form an integrated circuit package.
Claim 20
Dependent Claim
29 words
19 . The method, as set forth in claim 18 , comprising the act of electrically coupling the integrated circuit package to a processor to form an electronic system.
Claim 21
Dependent Claim
26 words
20 . The method, as set forth in claim 1 , wherein at least one of the at least two semiconductor die comprises a memory die.
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