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Patent EP0446868A1 successfully refreshed from Google Patents.
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EP0446868A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Tape carrier having improved test pads

Assignee: Toshiba Corp
•
Filing: 1991-03-12
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Granted: —
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Expires: 2011-03-12
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Abstract

Abstract A tape carrier body (1) is provided with a mounting portion (3) on which a semiconductor integrated circuit (4) is mounted and a plurality of test pads (7) which are disposed away from the mounting portion (3). The semiconductor integrated circuit (4) is provided with a power supply pad (5a) to which a supply voltage is applied and a plurality of signal pads (5) for inputting and outputting signals, the number of the test pads (7) being larger than the total number of the power supply pad (5a) and the signal pads (5). The signal pads (5) of the semiconductor integrated circuit (4) and the test pads (7) of the tape carrier body are connected by outer leads (8). The power supply pad (5a) of the semiconductor integrated circuit (4) and the outside test pad of the test pads of the tape carrier body are connected by an outer lead (8o).

Inventors

  • 👤 Akito C/O Intellectual Property Division Yoshida

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 12:25
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 194 words
A tape carrier characterized by comprising: a tape carrier body (1) having a mounting portion (3) on which a semiconductor integrated circuit (4) is mounted and a plurality of test pads (7) which are disposed away from said mounting portion (3) and to which said semiconductor integrated circuit (4) is connected, said semiconductor integrated circuit being provided with a power supply pad (5b) to which a supply voltage is applied and a plurality of signal pads (5) for inputting and outputting signals and the number of said test pads (7) of said tape carrier body being larger than the total number of said power supply pad (5b) and said signal pads (5) of said semiconductor integrated circuit; first leads (8) having their first ends connected to said signal pads (5) of said semiconductor integrated circuit (4) and their second ends connected to said test pads (7) of said tape carrier body; and a second lead (8o) having its first end connected to said power supply pad (5b) of said semiconductor integrated circuit (4) and its second end connected to an outside test pad (7n) of said test pads (7) of said tape carrier body.
Claim 2
Dependent Claim 34 words
A tape carrier according to claim 1, characterized in that said second end of said second lead (8o) is connected to a plurality of test pads (7) which are disposed close to one another.
Claim 3
Dependent Claim 24 words
A tape carrier according to claim 1, characterized in that said second end of said second lead (8o) is wider than said first end.
Claim 4
Dependent Claim 36 words
A tape carrier according to claim 1, characterized in that said second end of said second lead (8o) is connected to the outermost test pad (7n) of said test pads (7) of said tape carrier body.
Claim 5
Dependent Claim 54 words
A tape carrier according to claim 1, characterized in that said semiconductor integrated circuit (4) has a power supply terminal (5b) for test, and a third lead (11) is further provided which connects said power supply terminal (5b) to the outermost test pad (7n) of said test pads (7) of said tape carrier body.
Claim 6
Dependent Claim 43 words
A tape carrier according to claim 5, characterized in that said mounting portion (3) is formed on said tape carrier body (1) through slits (6) and tie bars (2), and said third lead (11) is disposed on one of said tie bars (2).

References Cited (Backward Citations)

EP0293838A2 Cited
EP0311513A2 Cited
EP0324244A2 Cited

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