EP0311513A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Film segment having integrated circuit chip bonded thereto and fixture therefor
Assignee: Fujitsu Ltd
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Filing: 1988-10-04
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Granted: —
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Expires: 2008-10-04
Abstract
Abstract A film segment (10) has a flexible beam lead frame formed thereon, to which an IC chip (24) is adapted to be bound in a wireless manner. The film segment having a rectangular shape is provided with at least two positioning perforations (26) formed therein, each of which is adapted to receive and fit a positioning pin element, the positioning perforations (26) being located along one of the diagonal lines of said film segment (10) and in the vicinity of said flexible beam lead frame. The fixture is held by a fixture having a window (34) encompassing the positioning perforations. The film segment can be positioned for testing the IC chip (24) at a given test position with respect to the fixture by inserting the positioning pin elements into the positioning perforations (26) through said window.
Inventors
- 👤 Tatsuya Fujitsu Todoroki-Ryo 222 Miyazaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 21:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
232 words
A film segment for carrying with an integrated circuit chip, comprising: a film segment body having a rectangular shape with four sides and a plurality of sprocket perforations formed therein, said sprocket perforations being located close to two opposing edges of the four side edges of said film segment body and being in parallel with the two opposing side edges thereof; said film segment body having an opening formed in a center portion thereof; a lead pattern including a plurality of lead elements formed on said film segment body, said lead elements each including an outer portion secured to said film segment body and an inner portion extending into the interior zone of said central opening, the integrated circuit chip being bonded to the inner portions of said lead elements so that the integrated circuit chip is substantially disposed within the interior zone of said central opening; said lead pattern including a plurality of conductor pads which are electrically connected to said lead elements, respectively, said conductor pads being formed in rows on a zone of said film segment body which is set around said central opening and inside of said sprocket perforations; and said film segment body having at least two positioning perforations formed therein, which are disposed in the vicinity of said conductor pads so that each of said positioning perforations are included in the rows of said conductor pads.
Claim 2
Dependent Claim
232 words
A film segment for carrying with an integrated circuit chip, comprising: a film segment body having a rectangular shape with four sides and a plurality of sprocket perforations formed therein, said sprocket perforations being located close to two opposing edges of the four side edges of said film segment body and being in parallel with the two opposing side edges thereof; said film segment body having an opening formed in a center portion thereof; a lead pattern including a plurality of lead elements formed on said film segment body, said lead elements each including an outer portion secured to said film segment body and an inner portion extending into the interior zone of said central opening, the integrated circuit chip being bonded to the inner portions of said lead elements so that the integrated circuit chip is substantially disposed within the interior zone of said central opening; said lead pattern including a plurality of conductor pads which are electrically connected to said lead elements, respectively, said conductor pads being formed in rows on a zone of said film segment body which is set around said central opening and inside of said sprocket perforations; and said film segment body having at least two positioning perforations formed therein, which are disposed in the vicinity of said conductor pads so that each of said positioning perforations are included in the rows of said conductor pads.
Claim 3
Dependent Claim
102 words
A fixture for holding the film segment as set forth in claim 1, comprising: a fixture body having a recess formed therein for receiving the film segment; said fixture body having window formed in the bottom of said recess; at least two protrusions projecting from a marginal zone of the bottom of said recess for engaging with the sprocket perforations upon receiving the film segment in said recess; and said window being sized so as to encompass the positioning perforations and the conductor pads formed in and on the film segment body and said window being smaller than said film segment body.
References Cited (Backward Citations)
No citation records indexed.
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