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Method of forming a thin monocrystalline layer of a semiconductor material on a substrate

Assignee: Koninklijke Philips NV
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Filing: 1988-11-24
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Granted: —
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Expires: 2008-11-24
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Abstract

Abstract A methof of forming a thin monocrystalline layer of a semiconductor material on an insulator, said method comprising depositing a thin polycrystalline or amorphous layer of a semiconductor material on an insulating substrate to form a layered structure and focusing beams from two lamps on the layer of semiconductor material. According to the invention the center of said beams coincide to form a line image on said layer, the power distribution of said layer being such as to provide a narrow melt zone in said layer of semiconductor material at the center of the line image surrounded by two narrow heated zones, the temperature of said narrow heated zones being below the temperature of said melt zone and said narrow heated zone having a temperature differential of from 2-10°C/mm decreases from said melt zone while scanning said layered structure relative to said line image and heating said substrate to a temperature below the temperature of said heated zone. Thus the formation sub-grain boundaries is prevented.

Inventors

  • 👤 Subramanian Ramesh

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 03:57
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/20; H10P14/32; H10P14/3202; H10P14/3238; H10P14/38; H10P14/3802; H10P14/29; H10P14/2901; H10P14/2902; H10P14/2905; H10P14/2921; H10P14/2922; H10P14/34; H10P14/3402; H10P14/3404; H10P14/3411; H10P14/3451; H10P14/3452; H10P14/3458; H10P14/382

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 157 words
A method of forming a thin monocrystalline layer of a semiconductor material on an insulator, said method comprising depositing a thin polycrystalline or amorphous layer of a semiconductor material on an insulating substrate to form a layered structure and focusing beams from two lamps on the layer of semiconductor material characterized in that the center of said beams coincide to form a line image on said layer, the power distribution of said layer being such as to provide a narrow melt zone in said layer of semiconductor material at the center of the line image surrounded by two narrow heated zones, the temperature of said narrow heated zones being nelow the temperature of said melt zone and said narrow heated zone having a temperature differential of from 2-10°C/mm decreases from said melt zone while scanning said layered structure relative to said line image and heating said substrate to a temperature below the temperature of said heated zone.
Claim 2
Independent Claim 157 words
A method of forming a thin monocrystalline layer of a semiconductor material on an insulator, said method comprising depositing a thin polycrystalline or amorphous layer of a semiconductor material on an insulating substrate to form a layered structure and focusing beams from two lamps on the layer of semiconductor material characterized in that the center of said beams coincide to form a line image on said layer, the power distribution of said layer being such as to provide a narrow melt zone in said layer of semiconductor material at the center of the line image surrounded by two narrow heated zones, the temperature of said narrow heated zones being nelow the temperature of said melt zone and said narrow heated zone having a temperature differential of from 2-10°C/mm decreases from said melt zone while scanning said layered structure relative to said line image and heating said substrate to a temperature below the temperature of said heated zone.
Claim 3
Dependent Claim 13 words
The method of Claim 1 characterized in that the semiconductor material is silicon.
Claim 4
Dependent Claim 12 words
The method of Claim 2 characterized in that the substrate is glass.
Claim 5
Dependent Claim 16 words
The method of Claim 3 characterized in that the substrate is heated to its annealing point.
Claim 6
Dependent Claim 13 words
The method of Claim 2 characterized in that the substrate is monocrystalline silicon.
Claim 7
Dependent Claim 17 words
The method of Claim 5 characterized in that the substrate is heated to a temperature of 1000°C-1250°C.
Claim 8
Dependent Claim 15 words
The method of Claim 6 characterized in that the substrate is heated to about 1100°C.
Claim 9
Dependent Claim 32 words
The method of Claim 2 characterized in that the melt zone is less than about 200-800um in width and the width of each of the narrow heated zones is about 2mm wide.
Claim 10
Dependent Claim 18 words
The method of Claim 7 characterized in that the width of the melt zone is from about 400-500µm.

References Cited (Backward Citations)

EP0124261A1 Cited
EP0257917A2 Cited

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