Patent US5586323A successfully refreshed from Google Patents.
Patent EP0101299A1 successfully refreshed from Google Patents.
EP0101299A1
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Corrosion resistant aluminum electronic material
Assignee: Hitachi Ltd
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Filing: 1983-08-10
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Granted: —
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Expires: 2003-08-10
Abstract
Abstract A corrosion-resistant aluminum material comprising an alloy containing aluminum as the principal component and, in addition, a small amount of a noble metal, the content of said noble metal being equal to or less than that at the eutectic point having the primary crystals of aluminum. As the noble metal, there is contained at least one metal selected from Pt, Pd, Rh, lr, Os, Ru, Au and Ag. Said material is used for ball-bonding wire and distributing film in a semiconductor device, and the like.
Inventors
- 👤 Jin Onuki
- 👤 Masateru Suwa
- 👤 Masahiro Koizumi
- 👤 Osamu Asai
- 👤 Katsumi Suzuki
- 👤 Ryo Hiraga
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-30 15:11
CPC Classifications
C; C22; C22C; C22C21/00; H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/01; H10W72/015; H10W72/01551; H10W72/071; H10W72/0711; H10W72/07141; H10W72/073; H10W72/075; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07541; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
75 words
A corrosion-resistant aluminum electronic material comprising an alloy containing aluminum as the principal component characterized by, in addition, an amount of a noble metal, the content of said noble metal being equal to or less than that at the eutectic point having the primary crystal of aluminum, and the average diameter of particles comprising said noble metal or a compound composed of said noble metal and aluminum in the alloy being 1 µm or less.
Claim 2
Dependent Claim
75 words
A corrosion-resistant aluminum electronic material comprising an alloy containing aluminum as the principal component characterized by, in addition, an amount of a noble metal, the content of said noble metal being equal to or less than that at the eutectic point having the primary crystal of aluminum, and the average diameter of particles comprising said noble metal or a compound composed of said noble metal and aluminum in the alloy being 1 µm or less.
Claim 3
Dependent Claim
46 words
A corrosion-resistant aluminum electronic material according to claim 1, wherein said noble metal is at least one metal selected from the group consisting of platinum, palladium, rhodium, iridium, osmium, ruthenium, gold and silver, and the content of said aluminum is at least 90 percent by weight.
Claim 4
Dependent Claim
33 words
A corrosion-resistant aluminum electronic material according to claim 1 or claim 2, wherein the content of said noble metal is 0.01 to 10 percent by weight and the remainder consists substantially of aluminum.
Claim 5
Dependent Claim
30 words
A corrosion-resistant aluminum electronic material according to claim 2, wherein the content of said noble metal is 0.05 to 3 percent by weight and the remainder consists substantially of aluminum.
Claim 6
Dependent Claim
48 words
A corrosion-resistant aluminum electronic material according to any one of the preceding claims wherein said alloy contains, in addition, an amount of silicon, the contents of said noble metal and silicon being equal to or less than those of the eutectic composition having the primary crystal of aluminum.
Claim 7
Dependent Claim
68 words
A corrosion-resistant aluminum electronic material according to any one of the preceding claims wherein said aluminum alloy is in the form of a fine wire, which is a ball-bonding wire, a ball formed of said fine wire at the tip of the wire being bonded to a distributing film formed on a semiconductor element and the other end of the wire being bonded to an external lead terminal.
Claim 8
Dependent Claim
34 words
A corrosion-resistant aluminum electronic material according to any one of claims 1 to 5 wherein said aluminum alloy is a distributing film forming the connecting terminal of a semiconductor to an external lead wire.
Claim 9
Dependent Claim
79 words
A semiconductor device having a semiconductor element (3), a distributing film (8) arranged on said element, a fine metal wire (1) bonded to said distributing film, and a lead frame (4) bonded with the other end of said fine wire, said semiconductor element and fine wire being covered with a synthetic resin (12), characterised in that at least one of said fine wire and said distributing film comprises a material according to any one of claims 1 to 5.
Claim 10
Dependent Claim
15 words
A semiconductor device according to claim 8, wherein said synthetic resin is an epoxy resin.
Claim 11
Dependent Claim
33 words
A semiconductor device according to claim 8 or claim 9 wherein a ball formed of said fine wire at the tip of said fine metal wire is solid-phase bonded to said distributing film.
Claim 12
Dependent Claim
34 words
A semiconductor device according to any one of claims 8 to 10 wherein said fine metal wire is of a material according to any one of claims 1 to 5 and is incompletely annealed.
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