Patent USRE33108E successfully refreshed from Google Patents.
USRE33108E
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for preparing a printed circuit board
Assignee: Nippon Paint Co Ltd
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Filing: 1988-11-16
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Granted: 1989-11-07
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Expires: 2008-11-16
Abstract
Abstract The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.
Inventors
- 👤 Katsukiyo Ishikawa
- 👤 Kanji Nishijima
- 👤 Mamoru Seio
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 18:55
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/02; H05K3/06; H05K3/061; H05K3/064; G; G03; G03F; G03F7/00; G03F7/16; G03F7/164; H05K2203/00; H05K2203/13; H05K2203/1333; H05K2203/135; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
139 words
A method for preparing a printed circuit board with plated-through-holes, comprising: providing a plated board with a number of plated-through-holes, forming a positive working photoresist on said plated board, exposing said photoresist through a positive mask of circuit pattern placed on said photoresist to an actinic radiation, developing said photoresist on said plated board with an aqueous or a semi-aqueous alkaline solution, thereby removing the exposed area and form an etching resist, subjecting said resist to an etching to remove copper metal covered with the exposed photoresist on said plated board, and finally removing said resist still remaining on the unexposed area of said plated board, which is characterized in that the formation of said positive working photoresist is carried out by an electrodeposition process with an anionic or cationic electrodeposition bath containing quinonediazide sulfonic ester bearing acrylic copolymer.
Claim 2
Independent Claim
139 words
A method for preparing a printed circuit board with plated-through-holes, comprising: providing a plated board with a number of plated-through-holes, forming a positive working photoresist on said plated board, exposing said photoresist through a positive mask of circuit pattern placed on said photoresist to an actinic radiation, developing said photoresist on said plated board with an aqueous or a semi-aqueous alkaline solution, thereby removing the exposed area and form an etching resist, subjecting said resist to an etching to remove copper metal covered with the exposed photoresist on said plated board, and finally removing said resist still remaining on the unexposed area of said plated board, which is characterized in that the formation of said positive working photoresist is carried out by an electrodeposition process with an anionic or cationic electrodeposition bath containing quinonediazide sulfonic ester bearing acrylic copolymer.
Claim 3
Dependent Claim
133 words
A method according to claim 1, wherein the quinonediazide sulfonic ester bearing anionic acrylic copolymer comprises a copolymer (A) of (a) monoolefinic unsaturated compound or conjugated diolefinic hydrocarbon, (b) unsaturated compound represented by the formula: ##STR6## in which n is an integer of 1 to 3; R 1 is hydrogen atom or methyl group; R 2 is hydrogen atom, alkyl having 1 to 5 carbon atoms, alkoxy or nitro group; R 3 is hydrogen atom, ##STR7## (c) unsaturated compound having at least one acidic group selected from the group consisting of α,β-ethylenically unsaturated carboxylic acids, polymerizable organic sulfonic acids, polymerizable organophosphoric acids, and salts thereof, or a mixture of said copolymer (A) and other quinonediazide sulfonic ester (B), the content of said copolymer (A) being 5% by weight or more of said mixture.
Claim 4
Dependent Claim
84 words
A method according to claim 1, wherein the quinonediazide sulfonic ester bearing cationic acrylic copolymer (C) of (a) monoolefinic unsaturated compound or conjugated diolefinic hydrocarbon, (b) unsaturated compound represented by the formula: ##STR8## in which R 1 , R 2 , R 3 and n are as defined above, and (c) unsaturated compound having amino group, or a mixture of said copolymer (C) and other quinonediazide sulfonic ester (B), the content of said copolymer (C) being 5% by weight or more of said mixture.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-11-06 | 1993-05-08 | 1993-11-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-11-06 | 1997-05-08 | 1997-11-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-11-06 | 2001-05-08 | 2001-11-07 | $7700.00 | Window Closed / Lapsed |