Process and laminate for the manufacture of through-hole plated electric printed-circuit boards

Claim 2

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: (a) producing through holes in a board or sheet of metal, said holes being distributed in a regular pattern over the surface of the board; (b) coating the entire surface of both sides of said board, including all hole walls, with a layer of insulating material; (c) after step b, coating the entire surface of said layer of insulating material with a conductive metal layer; (d) covering the metal layer imagewise by a stencil according to a desired pattern to produce conductive and non-conductive portions on the printed-circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed circuit board; and (e) subsequently selectively removing said conductive metal layer by etching to produce said non-conductive portions and to produce said second holes; wherein said board or sheet of metal allows heat dissipation.

Claim 3

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: (a) producing through holes in a board, web or layer of insulating material, said holes being distributed in a regular pattern over the surface of the board; (b) after step a), coating the entire surface of both sides of said board, including all hole walls, with a conductive metal layer; (c) covering the metal layer imagewise by a stencil according to a desired pattern wherein the pattern of said stencil covers the conductive portions on the printed-circuit board to produce conductive and non-conductive portions on the printed-circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed circuit board; and (d) subsequently selectively removing the portions of said conductive metal layer uncovered by said stencil by etching to produce said non-conductive portions and to produce said second holes.

Claim 4

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: (a) producing through holes in a board, web or layer of insulating material, said holes being distributed in a regular pattern over the surface of the board; (b) after step a), coating the entire surface of both sides of said board, including all hole walls, with a conductive metal layer; (c) covering the metal layer imagewise by a stencil according to a desired pattern wherein the pattern of said stencil covers the conductive portions on the printed-circuit board to produce conductive and non-conductive portions on the printed-circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed circuit board; and (d) subsequently selectively removing the portions of said conductive metal layer uncovered by said stencil by etching to produce said non-conductive portions and to produce said second holes.

Claim 5

A process as claimed in claim 2, wherein said first holes are covered by said stencil.

Claim 6

A process as claimed in claim 3, wherein at least a portion of said second holes are covered by said stencil and wherein said stencil leaves an annular uncovered portion around each of said covered second holes, wherein said conductive metal underlying the portions of said second holes covered by said stencil allows heat dissipation.

Claim 7

A process as claimed in claim 1, wherein said conductive portions include circuit portions and non-circuit portions, and wherein said covering step comprises covering said non-circuit portions and leaving an uncovered portion surrounding each of said non-circuit portions, wherein said conductive metal underlying said covered non-circuit portions allows heat dissipation.

Claim 8

A process as claimed in claim 1, wherein the pattern of said stencil leaves uncovered said conductive parts and said first holes, and further comprising, before step (d), the steps of selectively reinforcing the uncovered parts by metal deposition thereon, and removing said stencil, whereby the unreinforced metal layer is selectively removed by said etching.

Claim 9

A process as claimed in claim 6, wherein said second holes are covered by said covering step and the metal layer on the hole walls is selectively removed by said etching.

Claim 10

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: (a) producing through holes in a board, web or layer of insulating material, said holes being distributed in a regular pattern over the surface of the board; (b) after step a), coating the entire surface of both sides of said board, including all hole walls, with a conductive metal layer; (c) covering the metal layer imagewise by a stencil according to a desired pattern to produce conductive and non-conductive portions on the printed-circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed circuit board; and (d) subsequently selectively removing said conductive metal layer by etching to produce said non-conductive portions and to produce said second holes, wherein said conductive portions include circuit portions and non-circuit portions, and wherein said covering step comprises covering a portion surrounding each of said non-circuit portions, wherein said conductive metal underlying said covered non-circuit portions allows heat dissipation.

Claim 11

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: (a) producing through holes in a board, web or layer of insulating material, said holes being distributed in a regular pattern over the surface of the board; (b) after step a), coating the entire surface of both sides of said board, including all hole walls, with a conductive metal layer; (c) covering the metal layer imagewise by a stencil according to a desired pattern to produce conductive and non-conductive portions on the printed-circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed circuit board; and (d) subsequently selectively removing said conductive metal layer by etching to produce said non-conductive portions and to produce said second holes, wherein said conductive portions include circuit portions and non-circuit portions, and wherein said covering step comprises covering a portion surrounding each of said non-circuit portions, wherein said conductive metal underlying said covered non-circuit portions allows heat dissipation.

Claim 12

A process as claimed in claim 1, wherein said coating step comprises forming an adhesive layer on the surface of the insulating material, treating said adhesive layer with an oxidizing agent, and activating the surface of the adhesive layer to permit deposition of the conductive metal layer.

Claim 13

A process as claimed in claim 1, wherein the surface of the board of insulating material consists essentially of an insulating material.

Claim 14

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: imagewise covering a metal layer on the surface of a board of insulating material which has through-holes distributed in a regular pattern over the surface thereof and a coating of a conductive metal layer over the entire surface of both sides of the board, including all hole walls, said covering being accomplished by a stencil according to a desired pattern to produce conductive and non-conductive portions on the printed-circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed circuit board, and subsequently selectively removing said conductive metal layer by etching to produce said non-conductive portions and to produce said second holes.

Claim 15

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: imagewise covering a metal layer on the surface of a board of insulating material which has through-holes distributed in a regular pattern over the surface thereof and a coating of a conductive metal layer over the entire surface of both sides of the board, including all hole walls, said covering being accomplished by a stencil according to a desired pattern to produce conductive and non-conductive portions on the printed-circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed circuit board, and subsequently selectively removing said conductive metal layer by etching to produce said non-conductive portions and to produce said second holes.

Claim 16

A process as claimed in claim 11, wherein the pattern of said stencil covers the conductive portions on the printed circuit board, and the portions uncovered by said stencil are removed in said etching step.

Claim 17

A process as claimed in claim 12, wherein said first holes are covered by said stencil.

Claim 18

A process as claimed in claim 13, wherein at least a portion of said second holes are covered by said stencil and wherein said stencil leaves an annular uncovered portion around each of said covered second holes, wherein said conductive metal underlying the portions of said second holes covered by said stencil allows heat dissipation.

Claim 19

A process as claimed in claim 11, wherein said conductive portions include circuit portions and non-circuit portions, and wherein said covering step comprises covering said non-circuit portions and leaving an uncovered portion surrounding each of said non-circuit portions, wherein said conductive metal underlying said covered non-circuit portions allows heat dissipation.

Claim 20

A process as claimed in claim 11, wherein the pattern of said stencil leaves uncovered said conductive parts and said first holes, and further comprising before said removing step the steps of selectively reinforcing the unconverted parts by metal deposition thereon, and removing said stencil, whereby the unreinforced metal layer is selectively removed by said etching.

Claim 21

A process as claimed in claim 16, wherein said second holes are covered by said covering step and the metal layer on the hole walls is selectively removed by said etching.

Claim 22

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: imagewise covering a metal layer on the surface of a board of insulating material which has through-holes distributed in a regular pattern over the surface thereof and a coating of a conductive metal layer over the entire surface of both sides of the board, including all hole walls, said covering being accomplished by a stencil according to a desired pattern to produce conductive and non-conductive portions on the printed circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed-circuit board; and subsequently selectively removing said conductive metal layer by etching to produce said non-conductive portions and to produce said second holes, wherein said conductive portions include circuit portions and non-circuit portions, and wherein said covering step comprises covering a portion surrounding each of said non-circuit portions, and wherein said conductive metal underlying said covered non-circuit portions allows heat dissipation.

Claim 23

A process for the manufacture of a through-hole plated electric printed-circuit board, comprising the steps of: imagewise covering a metal layer on the surface of a board of insulating material which has through-holes distributed in a regular pattern over the surface thereof and a coating of a conductive metal layer over the entire surface of both sides of the board, including all hole walls, said covering being accomplished by a stencil according to a desired pattern to produce conductive and non-conductive portions on the printed circuit board, whereby said holes are selectively covered to produce a set of first holes which are to act as conductive connections in the printed-circuit board and a set of second holes which do not act as conductive connections in the printed-circuit board; and subsequently selectively removing said conductive metal layer by etching to produce said non-conductive portions and to produce said second holes, wherein said conductive portions include circuit portions and non-circuit portions, and wherein said covering step comprises covering a portion surrounding each of said non-circuit portions, and wherein said conductive metal underlying said covered non-circuit portions allows heat dissipation.

Claim 24

A process as claimed in claim 11, wherein said coating step comprises forming an adhesive layer on the surface of the insulating material, treating said adhesive layer with an oxidizing agent, and activating the surfaceof the adhesive layer to permit deposition of the conductive metal layer.

Claim 25

A process as claimed in claim 11, wherein the surface of the board of insulating material consists essentially of an insulating material.

Claim 26

A process as claimed in claim 11, wherein said through-holes are distributed in a standard pattern universally suitable for production of circuit-boards having different circuit configurations.