USRE32942E
Expired / Lapsed
US
⏱️ 0.0 years remaining
Low thermal expansivity and high thermal conductivity substrate
Assignee: Olin Corp
•
Filing: 1986-05-15
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Granted: 1989-06-06
•
Expires: 2006-05-15
Abstract
Abstract A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20×10 -7 to about 50×10 -7 in/in/°C. Second material particles having a coefficient of thermal expansion in the range of about 100×10 -7 to about 200×10 -7 in/in/°C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1×10 -7 to about 50×10 -7 in/in/°C.
Inventors
- 👤 Sheldon H. Butt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:12
CPC Classifications
C; C22; C22C; C22C32/00; B; B22; B22F; B22F1/00; B22F1/09; B32; B32B; B32B15/00; B32B15/01; B32B15/16; C04; C04B; C04B26/00; C04B26/02; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/05; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257; C04B2111/00; C04B2111/00474; C04B2111/00844; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0215; H05K2201/06; H05K2201/068; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12014; Y10T428/12028; Y10T428/12049; Y10T428/12181; Y10T428/12493; Y10T428/125; Y10T428/12514; Y10T428/12528; Y10T428/24; Y10T428/24942; Y10T428/31504; Y10T428/31678
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
98 words
A composite adapted to be a substrate for an electronic application, comprising a mixture of: first material particles having a coefficient of thermal expansion in the range of about -20×10 -7 to about 50×10 -7 in/in/°C.; second material particles mixed with said first material particles having a coefficient of thermal expansion in the range of about 100×10 -7 to about .[.200.]. .Iadd.274.Iaddend.×10 -7 in/in/°C.; and a bonding agent to adhere the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1×10 -7 to about 50×10 -7 in/in/°C.
Claim 2
Dependent Claim
98 words
A composite adapted to be a substrate for an electronic application, comprising a mixture of: first material particles having a coefficient of thermal expansion in the range of about -20×10 -7 to about 50×10 -7 in/in/°C.; second material particles mixed with said first material particles having a coefficient of thermal expansion in the range of about 100×10 -7 to about .[.200.]. .Iadd.274.Iaddend.×10 -7 in/in/°C.; and a bonding agent to adhere the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1×10 -7 to about 50×10 -7 in/in/°C.
Claim 3
Dependent Claim
24 words
A composite as in claim 1 wherein said composite has a thermal conductivity in the range of about 65 to 230 BTU/ft/ft 2 /hr/°F.
Claim 4
Dependent Claim
25 words
A composite as in claim 2 wherein said first material are particles selected from the group consisting of silica, ceramics, glass, metals and metal alloys.
Claim 5
Dependent Claim
13 words
A composite as in claim 3 wherein said first material is a ceramic.
Claim 6
Dependent Claim
13 words
A composite as in claim 3 wherein said first material is a silica.
Claim 7
Dependent Claim
13 words
A composite as in claim 3 wherein said first material is a glass.
Claim 8
Dependent Claim
20 words
A composite as in claim 1 wherein said bonding agent fills the interstices between the first and second material particles.
Claim 9
Dependent Claim
14 words
A composite as in claim 3 wherein said first material is a metal alloy.
Claim 10
Dependent Claim
14 words
A composite as in claim 8 wherein said first material is a nickel-iron alloy.
Claim 11
Dependent Claim
14 words
A composite as in claim 8 wherein said first material is an iron-nickel-copper alloy.
Claim 12
Dependent Claim
12 words
A composite as in claim 8 wherein said first material is molybdenum.
Claim 13
Dependent Claim
21 words
A composite as in claim 3 wherein said second material is selected from the group consisting of metals and metal alloys.
Claim 14
Dependent Claim
12 words
A composite as in claim 12 wherein said second material is copper.
Claim 15
Dependent Claim
14 words
A composite as in claim 12 wherein said second material is a copper alloy.
Claim 16
Dependent Claim
12 words
A composite as in claim 12 wherein said second material is aluminum.
Claim 17
Dependent Claim
14 words
A composite as in claim 12 wherein said second material is an aluminum alloy.
Claim 18
Dependent Claim
23 words
A composite as in claim 12 wherein said bonding agent is selected from the group consisting of glasses, organic adhesives, ceramics and metals.
Claim 19
Dependent Claim
12 words
A composite as in claim 17 wherein said composite is a strip.
Claim 20
Dependent Claim
21 words
A composite as in claim 18 further including a metallic foil bonded to at least one surface of the composite strip.
Claim 21
Dependent Claim
26 words
A composite as in claim 18 further including a continuous layer of low melting temperature glass coating on at least one surface of the composite stip.
Claim 22
Dependent Claim
12 words
A composite as in claim 17 wherein said bonding agent is glass.
Claim 23
Dependent Claim
14 words
A composite as in claim 17 wherein said bonding agent is an organic adhesive.
Claim 24
Dependent Claim
13 words
A composite as in claim 17 wherein said bonding agent is a ceramic.
Claim 25
Dependent Claim
14 words
A composite as in claim 17 wherein said bonding agent is a metal. .Iadd.
Claim 26
Dependent Claim
177 words
A composite adapted to be a substrate for an electronic application, comprising a mixture of: first material particles having a coefficient of thermal expansion in the range of about -20×10 -7 to about 50×10 -7 in/in/°C.; second material particles mixed with said first material particles having a coefficient of thermal expansion in the range of about 100×10 -7 to about 274×10 -7 in/in/°C.; and a bonding agent to adhere the first and second material particles into a coherent composite having a coefficient of thermal expansion of about 1×10 -7 in/in/°C. to about 274×10 -7 in/in/°C..Iaddend. .Iadd.26. The composite as in claim 25 wherein said first material are particles selected from the group consisting of silica, ceramics, glass, metals and metal alloys..Iaddend. .Iadd.27. The composite as in claim 26 wherein said first material comprises a ceramic..Iaddend. .Iadd.28. The composite as in claim 26 wherein said first material comprises a silica..Iaddend. .Iadd.29. The composite as in claim 26 wherein said first material comprises a glass..Iaddend. .Iadd.30. The composite as in claim 26 wherein said first material comprises a metal
Claim 27
Dependent Claim
133 words
alloy..Iaddend. .Iadd.31. The composite as in claim 26 further comprising said second material being selected from the group consisting of metals and metal alloys..Iaddend. .Iadd.32. The composite as in claim 31 further comprising said second material being copper..Iaddend. .Iadd.33. The composite as in claim 31 further comprising said second material being a copper alloy..Iaddend. .Iadd.34. The composite as in claim 31 further comprising said second material being aluminum..Iaddend. .Iadd.35. The composite as in claim 31 further comprising said second material being an aluminum alloy..Iaddend. .Iadd.36. The composite as in claim 31 further including said bonding agent being selected from the group consisting of glasses, organic adhesives, ceramics and metals..Iaddend. .Iadd.37. The composite as in claim 36 further including said bonding agent being a glass..Iaddend. .Iadd.38. The composite as in claim 36 further including
Claim 28
Dependent Claim
37 words
said bonding agent being an organic adhesive..Iaddend. .Iadd.39. The composite as in claim 36 further including said bonding agent being a ceramic..Iaddend. .Iadd.40. The composite as in claim 36 further including said bonding agent being a metal..Iaddend.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-05 | 1992-12-05 | 1993-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-05 | 1996-12-05 | 1997-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-05 | 2000-12-05 | 2001-06-06 | $7700.00 | Window Closed / Lapsed |