US7786573B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaging chip having interconnection electrodes directly connected to plural wafers
Assignee: Samsung Electronics Co Ltd
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Filing: 2006-07-06
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Granted: 2010-08-31
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Expires: 2026-07-06
Abstract
Abstract A packaging chip formed with plural wafers. The packaging chip includes plural wafers stacked in order and plural interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers. At least one or more of the plural wafers mounts a predetermined circuit device thereon. Further, at least one or more wafers of the plural wafers have a cavity of a predetermined size. Meanwhile, the packaging chip further includes plural pads independently arranged on the upper surface of the uppermost wafer one another and electrically connected to the plural interconnection electrodes respectively. Accordingly, the present invention can enhance the performance and reliability of a packaging chip and improve fabrication yield.
Inventors
- 👤 Min-seog Choi
- 👤 Kae-dong Back
- 👤 In-Sang Song
- 👤 Woon-bae Kim
- 👤 Byung-Gil Jeong
- 👤 Kyu-dong Jung
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:41
CPC Classifications
H; H10; H10W; H10W90/00; H10W20/00; H10W20/01; H10W20/021; H10W20/023; H10W20/0234; H10W20/20; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/0538; H03H9/0547; H10W90/20; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W99/00
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
94 words
A packaging chip, comprising: plural wafers which are stacked; and plural first and second interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers; wherein each interconnection electrode extends directly from the upper surface of the uppermost wafer to the upper surfaces of the different wafers, respectively, and a first plurality of interconnection electrodes do not penetrate through the wafer to which they are connected, and a second plurality of interconnection electrodes penetrate through the wafer to which they are connected.
Claim 2
Dependent Claim
94 words
A packaging chip, comprising: plural wafers which are stacked; and plural first and second interconnection electrodes directly connecting the plural wafers from an upper surface of an uppermost wafer of the plural wafers to the other wafers; wherein each interconnection electrode extends directly from the upper surface of the uppermost wafer to the upper surfaces of the different wafers, respectively, and a first plurality of interconnection electrodes do not penetrate through the wafer to which they are connected, and a second plurality of interconnection electrodes penetrate through the wafer to which they are connected.
Claim 3
Dependent Claim
27 words
The packaging chip as claimed in claim 1 , wherein at least one or more wafers of the plural wafers have a cavity of a predetermined size.
Claim 4
Dependent Claim
26 words
The packaging chip as claimed in claim 1 , wherein at least one or more of the plural wafers has a predetermined circuit device mounted thereon.
Claim 5
Dependent Claim
40 words
The packaging chip as claimed in claim 1 , further comprising plural pads independently arranged on the upper surface of the uppermost wafer, each of the plural pads is electrically connected to at least one of the plural interconnection electrodes.
Claim 6
Dependent Claim
19 words
The packaging chip as claimed in claim 1 , wherein the plural wafers are stacked in a predetermined order.
Claim 7
Dependent Claim
46 words
The packaging chip as claimed in claim 1 , wherein the wafers each have a different diameter, and wherein the wafers are arranged in a coaxial line in order of diameter size, such that a predetermined area of each of the plural wafers is externally exposed.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2013-08-30 | 2014-03-01 | 2014-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2017-08-30 | 2018-03-01 | 2018-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2021-08-30 | 2022-03-01 | 2022-08-31 | $7700.00 | Window Closed / Lapsed |