Patent US7639284B2 successfully refreshed from Google Patents.
Patent US7768795B2 successfully refreshed from Google Patents.
US7768795B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic circuit device, electronic device using the same, and method for manufacturing the same
Assignee: Panasonic Corp
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Filing: 2005-08-31
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Granted: 2010-08-03
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Expires: 2025-08-31
Abstract
Abstract Electronic circuit device ( 100 ) is structured so that a substrate module unit that are formed by stacking substrate modules made of a first resin sheet with electronic component ( 190 ) embedded thereinto is inserted into housing ( 150 ) including connecting terminal ( 120 ), control circuit ( 130 ), and first wiring pattern ( 140 ), where the substrate modules are connected to each other electrically and mechanically. This electronic circuit device ( 100 ) dispenses with a mother substrate. Further, with slimming down of a substrate module, a substrate module unit with a large number of substrate modules stacked can be loaded in a limited packaging space, thus mounting greater storage capacity and higher functionality.
Inventors
- 👤 Daisuke Sakurai
- 👤 Masahiro Ono
- 👤 Kazuhiro Nishikawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:32
CPC Classifications
H; H10; H10W; H10W90/00; G; G11; G11C; G11C5/00; G11C5/02; G11C5/04; H10W72/00; H10W72/01; H10W72/0198; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K1/185; H05K1/189; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W70/62; H10W70/65; H10W70/67; H10W70/688; H10W72/851; H10W72/874; H10W90/10; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W99/00
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
121 words
An electronic circuit device, comprising: a control circuit; a housing having a connecting terminal and a first wiring pattern; and a substrate module unit formed by embedding an electronic component into a first resin sheet so as to expose an electrode terminal of the electronic component, by integrally stacking a plurality of substrate modules having a second wiring pattern connecting to the electrode terminal, on a surface of the first resin sheet through a second resin sheet, and by connecting the second wiring patterns between the different substrate modules to each other through a through conductor, wherein the substrate module unit is inserted into the housing, and wherein the first wiring pattern of the housing is connected to the through conductor.
Claim 2
Dependent Claim
121 words
An electronic circuit device, comprising: a control circuit; a housing having a connecting terminal and a first wiring pattern; and a substrate module unit formed by embedding an electronic component into a first resin sheet so as to expose an electrode terminal of the electronic component, by integrally stacking a plurality of substrate modules having a second wiring pattern connecting to the electrode terminal, on a surface of the first resin sheet through a second resin sheet, and by connecting the second wiring patterns between the different substrate modules to each other through a through conductor, wherein the substrate module unit is inserted into the housing, and wherein the first wiring pattern of the housing is connected to the through conductor.
Claim 3
Dependent Claim
38 words
The electronic circuit device of claim 1 , wherein the electronic component is a joint electronic component formed by integrally bonding first surfaces of two electronic components with electrode terminals formed on second surfaces of the electronic components.
Claim 4
Dependent Claim
22 words
The electronic circuit device of claim 1 , wherein the control circuit is connected to the first wiring pattern of the housing.
Claim 5
Dependent Claim
19 words
The electronic circuit device of claim 1 , wherein the control circuit is loaded on the substrate module unit.
Claim 6
Dependent Claim
33 words
The electronic circuit device of claim 1 , wherein the electronic component is made of a semiconductor memory, and wherein the control circuit is made of a semiconductor element controlling the semiconductor memory.
Claim 7
Dependent Claim
12 words
An electronic device using the electronic circuit device of claim 5 .
Claim 8
Dependent Claim
152 words
An electronic circuit device, comprising: a control circuit; a housing having a connecting terminal and a first wiring pattern; and a substrate module unit formed by embedding a joint electronic component formed by bonding first surfaces of two electronic components with electrode terminals formed near two sides facing each other on second surfaces of the electronic components, with positions of the electrode terminals displaced from each other, into a first resin sheet so as to expose surfaces of the electrode terminals, and by integrally stacking a plurality of substrate modules having a second wiring pattern connecting to the electrode terminal, on a surface of the first resin sheet, and by connecting the second wiring patterns between the different substrate modules to each other through a through conductor, wherein the substrate module unit is inserted into the housing, and wherein the first wiring pattern of the housing is connected to the through conductor.
Claim 9
Dependent Claim
152 words
An electronic circuit device, comprising: a control circuit; a housing having a connecting terminal and a first wiring pattern; and a substrate module unit formed by embedding a joint electronic component formed by bonding first surfaces of two electronic components with electrode terminals formed near two sides facing each other on second surfaces of the electronic components, with positions of the electrode terminals displaced from each other, into a first resin sheet so as to expose surfaces of the electrode terminals, and by integrally stacking a plurality of substrate modules having a second wiring pattern connecting to the electrode terminal, on a surface of the first resin sheet, and by connecting the second wiring patterns between the different substrate modules to each other through a through conductor, wherein the substrate module unit is inserted into the housing, and wherein the first wiring pattern of the housing is connected to the through conductor.
Claim 10
Dependent Claim
22 words
The electronic circuit device of claim 7 , wherein the control circuit is connected to the first wiring pattern of the housing.
Claim 11
Dependent Claim
19 words
The electronic circuit device of claim 7 , wherein the control circuit is loaded on the substrate module unit.
Claim 12
Dependent Claim
33 words
The electronic circuit device of claim 7 , wherein the electronic component is made of a semiconductor memory, and wherein the control circuit is made of a semiconductor element controlling the semiconductor memory.
Claim 13
Independent Claim
132 words
A method for manufacturing an electronic circuit device comprising: forming a connecting terminal, a control circuit, and a first wiring pattern, in a housing; forming a substrate module unit by integrally stacking a plurality of substrate modules having an electronic component with an electrode terminal formed on a first surface thereof, a first resin sheet with the electronic component embedded thereinto so as to expose a surface of the electrode terminal, a second wiring pattern connecting to the electrode terminal exposed at a surface of the first resin sheet, and a through conductor connecting the second wiring patterns, through a second resin sheet, wherein the substrate module unit is connected with the through conductor; and connecting the through conductor of the substrate module unit to the first wiring pattern of the housing.
Claim 14
Independent Claim
132 words
A method for manufacturing an electronic circuit device comprising: forming a connecting terminal, a control circuit, and a first wiring pattern, in a housing; forming a substrate module unit by integrally stacking a plurality of substrate modules having an electronic component with an electrode terminal formed on a first surface thereof, a first resin sheet with the electronic component embedded thereinto so as to expose a surface of the electrode terminal, a second wiring pattern connecting to the electrode terminal exposed at a surface of the first resin sheet, and a through conductor connecting the second wiring patterns, through a second resin sheet, wherein the substrate module unit is connected with the through conductor; and connecting the through conductor of the substrate module unit to the first wiring pattern of the housing.
Claim 15
Dependent Claim
47 words
The method for manufacturing the electronic circuit device of claim 11 , wherein the electronic component is a joint electronic component formed by integrally bonding together first surfaces of the electronic components, with two electronic components with electrode terminals formed on second surfaces thereof as a pair.
Claim 16
Dependent Claim
114 words
The method for manufacturing an electronic circuit device of claim 12 , wherein the forming a substrate module unit integrally forms a substrate module unit by folding a composite resin sheet formed continuously with a plurality of substrate modules having the first resin sheet with the joint electronic component embedded thereinto, the second wiring pattern connecting to the electrode terminal exposed at a surface of the first resin sheet, the second resin sheet covering the second wiring pattern, and the through conductor that connects to the second wiring pattern and that is exposed at a surface of the second resin sheet, for each substrate module, so that the joint electronic components face each other.
Claim 17
Dependent Claim
57 words
The method for manufacturing an electronic circuit device of claim 12 , wherein the joint electronic component is made of a semiconductor memory; and wherein surfaces opposite to those with electrode terminals formed thereon, of two pieces of wafers are mutually faced, the semiconductor memories on the wafers are aligned, bonded together, and then cut off collectively.
Claim 18
Independent Claim
150 words
A method for manufacturing an electronic circuit device comprising: forming a connecting terminal, a control circuit, and a first wiring pattern, in a housing; forming a substrate module unit by integrally stacking a plurality of substrate modules having a joint electronic component formed by integrally bonding first surfaces of two electronic components with electrode terminals formed near two sides facing each other on second surfaces of the electronic components, with positions of the electrode terminals displaced from each other, a first resin sheet with the joint electronic component embedded thereinto so as to expose the electrode terminals, and a second wiring pattern connecting to the electrode terminal exposed at a surface of the first resin sheet, wherein the second wiring patterns between the different substrate modules are connected through a through conductor; and connecting the through conductor of the substrate module unit to the first wiring pattern of the housing.
Claim 19
Independent Claim
150 words
A method for manufacturing an electronic circuit device comprising: forming a connecting terminal, a control circuit, and a first wiring pattern, in a housing; forming a substrate module unit by integrally stacking a plurality of substrate modules having a joint electronic component formed by integrally bonding first surfaces of two electronic components with electrode terminals formed near two sides facing each other on second surfaces of the electronic components, with positions of the electrode terminals displaced from each other, a first resin sheet with the joint electronic component embedded thereinto so as to expose the electrode terminals, and a second wiring pattern connecting to the electrode terminal exposed at a surface of the first resin sheet, wherein the second wiring patterns between the different substrate modules are connected through a through conductor; and connecting the through conductor of the substrate module unit to the first wiring pattern of the housing.
Claim 20
Dependent Claim
105 words
The method for manufacturing an electronic circuit device of claim 15 , wherein the forming a substrate module unit integrally forms a substrate module unit by folding a composite resin sheet formed continuously with a plurality of substrate modules having the first resin sheet with the joint electronic component embedded thereinto, the second wiring pattern connecting to the electrode terminal exposed at a surface of the first resin sheet, and the through conductor that connects to the second wiring pattern and that is exposed at a surface of the first resin sheet, for each substrate module, so that the joint electronic components face each other.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2013-08-02 | 2014-02-01 | 2014-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2017-08-02 | 2018-02-01 | 2018-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2021-08-02 | 2022-02-01 | 2022-08-03 | $7700.00 | Window Closed / Lapsed |