Patent US7405366B2 successfully refreshed from Google Patents.
US7405366B2
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Interposer and electronic device fabrication method
Assignee: Fujitsu Ltd
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Filing: 2006-01-26
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Granted: 2008-07-29
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Expires: 2026-01-26
Abstract
Abstract An interposer 2 including a base 10 formed of a plurality of resin layers 26, 34, 42, 52, 56 ; a thin-film capacitor 12 buried in the base 10 , including a lower electrode 20 , a capacitor dielectric film 22 and an upper electrode 24 ; a first through-electrode 14 b formed through the base 10 and electrically connected to the upper electrode 24 of the thin-film capacitor 12 ; and a second through-electrode 14 a formed through the base 10 and electrically connected to the lower electrode 20 of the thin-film capacitor 12 , further including: an interconnection 48 buried in the base 10 and electrically connected to the respective upper electrodes 24 of a plurality of the thin-film capacitors 12 , a plurality of the first through-electrodes 14 b being electrically connected to the upper electrodes 24 of said plurality of the thin-film capacitors 12 via the interconnection 48 , and said plurality of the first through-electrodes 14 b being electrically interconnected by the interconnections 48.
Inventors
- 👤 Takeshi Shioga
- 👤 Yoshikatsu Ishizuki
- 👤 John David Baniecki
- 👤 Kazuaki Kurihara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:24
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/30; H01G4/002; H01G4/228; H01G4/232; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/14; H05K1/141; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0179; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2201/096; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/016; H05K2203/0191; H05K3/00; H05K3/007; H05K3/46; H05K3/4602; H10P72/7424; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/90; H10W72/941; H10W72/9415; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/728; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49128; Y10T29/4913; Y10T29/49147; Y10T29/49151; Y10T29/49153; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
167 words
An interposer comprising a base formed of a plurality of resin layers; a thin-film capacitor buried in the base, including a lower electrode, a capacitor dielectric film formed on the lower electrode, and an upper electrode formed on the capacitor dielectric film; a first through-electrode formed through the base and electrically connected to the upper electrode of the thin-film capacitor; and a second through-electrode formed through the base and electrically connected to the lower electrode of the thin-film capacitor, the interposer comprising: a plurality of said thin-film capacitors formed over a first resin layer of said plurality of resin layers, and, a plurality of said first through-electrodes formed through the base, the interposer further comprising: an interconnection formed over a second resin layer of said plurality of resin layers, the second resin layer being formed over said plurality of said thin-film capacitors, said plurality of said first through-electrodes and the upper electrodes of said plurality of said thin-film capacitors are electrically connected each other by the interconnection.
Claim 2
Dependent Claim
167 words
An interposer comprising a base formed of a plurality of resin layers; a thin-film capacitor buried in the base, including a lower electrode, a capacitor dielectric film formed on the lower electrode, and an upper electrode formed on the capacitor dielectric film; a first through-electrode formed through the base and electrically connected to the upper electrode of the thin-film capacitor; and a second through-electrode formed through the base and electrically connected to the lower electrode of the thin-film capacitor, the interposer comprising: a plurality of said thin-film capacitors formed over a first resin layer of said plurality of resin layers, and, a plurality of said first through-electrodes formed through the base, the interposer further comprising: an interconnection formed over a second resin layer of said plurality of resin layers, the second resin layer being formed over said plurality of said thin-film capacitors, said plurality of said first through-electrodes and the upper electrodes of said plurality of said thin-film capacitors are electrically connected each other by the interconnection.
Claim 3
Dependent Claim
21 words
An interposer according to claim 1 , wherein the lower electrodes of said plurality of said thin-film capacitors are formed integrally.
Claim 4
Dependent Claim
21 words
An interposer according to claim 1 , further comprising third through-electrode formed through the base and insulated from the thin-film capacitor.
Claim 5
Dependent Claim
36 words
An interposer according to claim 1 , further comprising an insulating barrier film covering an upper surface, an under surface and a side surface of the thin-film capacitor, for prohibiting the diffusion of hydrogen or water.
Claim 6
Dependent Claim
18 words
An interposer according to claim 4 , wherein the insulating barrier film is formed of an inorganic material.
Claim 7
Dependent Claim
26 words
An interposer according to claim 4 , wherein the insulating barrier film is a amorphous film formed of the same material as the capacitor dielectric film.
Claim 8
Dependent Claim
54 words
An interposer according to claim 4 , wherein an opening is formed in the insulating barrier film down to the upper electrode, a conductive barrier film is formed in the opening, for prohibiting the diffusion of hydrogen or water, and the interconnection is electrically connected to the upper electrode via the conductive barrier film.
Claim 9
Dependent Claim
79 words
An interposer according to claim 4 , wherein an opening for exposing at least the side surface of the lower electrode is formed in the base and the insulating barrier film, a conductive barrier film is formed in the opening, for prohibiting the diffusion of hydrogen or water, the first through-electrode is buried in the opening with the conductive barrier film formed in, and the first through-electrode is electrically connected to the lower electrode via the conductive barrier film.
Claim 10
Dependent Claim
30 words
An interposer according to claim 1 , wherein the resin layer is formed of polyimide resin, epoxy resin, benzocyclobutene resin, bismaleimide-triazine resin, polytetrafluoroethylene resin, acrylic resin or diallyl phthalate resin.
Claim 11
Dependent Claim
34 words
An interposer according to claim 1 , wherein the capacitor dielectric film is formed of a composite oxide containing at least one element of Sr, Ba, Pb, Zr, Bi, Ta, Ti, Mg and Nb.
Claim 12
Dependent Claim
32 words
An interposer according to claim 1 , wherein the lower electrode or the upper electrode is formed of Au, Cr, Cu, W, Pt, Pd, Ru, Ru oxide, Ir, Ir oxide, Pt oxide.
References Cited (Backward Citations)
JPH04211191A
Cited
JPH07176453A
Cited
US5455064A
Cited
JP3014383B2
Cited
US6178082B1
Cited
JP2001035990A
Cited
JP2001068583A
Cited
JP2002083892A
Cited
US6764931B2
Cited
JP2003158239A
Cited
JP2003282827A
Cited
US6998308B2
Cited
US20040231885A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2011-07-29 | 2012-01-28 | 2012-07-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2015-07-29 | 2016-01-28 | 2016-07-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2019-07-29 | 2020-01-28 | 2020-07-29 | $7700.00 | Window Closed / Lapsed |