US7291924B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip chip stacked package
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2004-07-29
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Granted: 2007-11-06
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Expires: 2024-07-29
Abstract
Abstract A flip chip stacked package mainly comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires and a supporter. The supporter is attached to the lower surface of the carrier via an adhesive and covers the opening of the carrier. Thus, the lower chip can be disposed in the opening. In addition, the lower chip is electrically flip-chip bonded to the upper chip via the bumps and electrically connected to the carrier via the bonding wires. Accordingly, the heat generated from the lower chip can be transmitted to outside via the supporter. Furthermore, the upper chip is directly exposed to outside so that the capability of the heat dissipation will be enhanced.
Inventors
- 👤 Sung-Fei Wang
- 👤 Ming-Lun Ho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:35
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/859; H10W74/00; H10W90/20; H10W90/291; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
181 words
A flip chip stacked package, comprising: a carrier having an upper surface, a lower surface and an opening passing through the upper surface and the lower surface; a heat dissipation supporter disposed below the surface of the carrier and covering the opening; a lower chip disposed above the supporter and accommodated in the opening; a plurality of bonding wires electrically connected to the lower chip and the carrier; an upper chip having an active surface facing the lower chip, wherein the lower chip is smaller than the upper chip in size, and the upper chip covers the opening; a plurality of bumps electrically connected to the upper chip and the lower chip, wherein the bumps form a gap between the active surface of the upper chip and the lower chip to prevent the bonding wires from contacting the active surface of the upper chip; and an adhesive interposed between the lower chip and the heat dissipation supporter and the carrier and the heat dissipation supporter, wherein the heat dissipation supporter is not electrically connected to the lower chip and the carrier.
Claim 2
Dependent Claim
181 words
A flip chip stacked package, comprising: a carrier having an upper surface, a lower surface and an opening passing through the upper surface and the lower surface; a heat dissipation supporter disposed below the surface of the carrier and covering the opening; a lower chip disposed above the supporter and accommodated in the opening; a plurality of bonding wires electrically connected to the lower chip and the carrier; an upper chip having an active surface facing the lower chip, wherein the lower chip is smaller than the upper chip in size, and the upper chip covers the opening; a plurality of bumps electrically connected to the upper chip and the lower chip, wherein the bumps form a gap between the active surface of the upper chip and the lower chip to prevent the bonding wires from contacting the active surface of the upper chip; and an adhesive interposed between the lower chip and the heat dissipation supporter and the carrier and the heat dissipation supporter, wherein the heat dissipation supporter is not electrically connected to the lower chip and the carrier.
Claim 3
Dependent Claim
30 words
The flip chip stacked package of claim 1 , further comprising a plurality of dams located at the periphery of the opening and connecting the upper chip and the carrier.
Claim 4
Dependent Claim
34 words
The flip chip stacked package of claim 2 , wherein the carrier further comprises a plurality of contacts formed on the upper surface and located between the periphery of the opening and the dams.
Claim 5
Dependent Claim
17 words
The flip chip stacked package of claim 2 , wherein the dams are made of B-stage epoxy.
Claim 6
Dependent Claim
18 words
The flip chip stacked package of claim 1 , wherein the heat dissipation supporter is a metal plate.
Claim 7
Dependent Claim
18 words
The flip chip stacked package of claim 1 , wherein the heat dissipation supporter is a copper plate.
Claim 8
Dependent Claim
18 words
The flip chip stacked package of claim 1 , wherein the heat dissipation supporter is a silicon chip.
Claim 9
Dependent Claim
18 words
The flip chip stacked package of claim 1 , wherein the heat dissipation supporter is a dummy chip.
Claim 10
Dependent Claim
22 words
The flip chip stacked package of claim 1 , wherein the heat dissipation supporter entirely cover the lower surface of the carrier.
Claim 11
Dependent Claim
28 words
The flip chip stacked package of claim 9 , further comprising solder balls attached on the upper surface of the carrier and not located under the upper chip.
Claim 12
Dependent Claim
30 words
The flip chip stacked package of claim 1 , wherein the heat dissipation supporter partially covers the lower surface of the carrier and exposes the lower surface of the carrier.
Claim 13
Dependent Claim
21 words
The flip chip stacked package of claim 11 , further comprising solder balls attached on the lower surface of the carrier.
Claim 14
Dependent Claim
17 words
The flip chip stacked package of claim 1 , further comprising an underfill filled in the opening.
Claim 15
Dependent Claim
31 words
The flip chip stacked package of claim 13 , wherein the underfill further encapsulates the upper chip, the lower chip, the heat dissipation supporter and the upper surface of the carrier.
Claim 16
Dependent Claim
217 words
A flip chip stacked package comprising: a carrier having an upper surface, a lower surface and an opening passing through the upper surface and the lower surface; a heat dissipation supporter disposed below the surface of the carrier and covering the opening; a lower chip disposed above the supporter and accommodated in the opening; a plurality of bonding wires electrically connected to the lower chip and the carrier; an upper chip having an active surface facing the lower chip, wherein the lower chip is smaller than the upper chip in size, and the upper chip covers the opening; a plurality of bumps electrically connecting the upper chip and the lower chip; wherein the bumps form a gap between the active surface of the upper chip and the lower chip to prevent the bonding wires from contacting the active surface of the upper chip; a plurality of dams located at the periphery of the opening and connecting the upper chip and the carrier, wherein the dams form a gap between the active surface of the upper chip and the lower chip; and an adhesive interposed between the lower chip and the heat dissipation supporter and the carrier and the heat dissipation supporter, wherein the heat dissipation supporter is not electrically connected to the lower chip and the carrier.
Claim 17
Dependent Claim
217 words
A flip chip stacked package comprising: a carrier having an upper surface, a lower surface and an opening passing through the upper surface and the lower surface; a heat dissipation supporter disposed below the surface of the carrier and covering the opening; a lower chip disposed above the supporter and accommodated in the opening; a plurality of bonding wires electrically connected to the lower chip and the carrier; an upper chip having an active surface facing the lower chip, wherein the lower chip is smaller than the upper chip in size, and the upper chip covers the opening; a plurality of bumps electrically connecting the upper chip and the lower chip; wherein the bumps form a gap between the active surface of the upper chip and the lower chip to prevent the bonding wires from contacting the active surface of the upper chip; a plurality of dams located at the periphery of the opening and connecting the upper chip and the carrier, wherein the dams form a gap between the active surface of the upper chip and the lower chip; and an adhesive interposed between the lower chip and the heat dissipation supporter and the carrier and the heat dissipation supporter, wherein the heat dissipation supporter is not electrically connected to the lower chip and the carrier.
Claim 18
Dependent Claim
22 words
The flip chip stacked package of claim 15 , wherein the heat dissipation supporter entirely covers the lower surface of the carrier.
Claim 19
Dependent Claim
24 words
The flip chip stacked package of claim 16 , further comprising a plurality of solder balls attached on the upper surface of the carrier.
Claim 20
Dependent Claim
30 words
The flip chip stacked package of claim 15 , wherein the heat dissipation supporter partially covers the lower surface of the carrier and exposes the lower surface of the carrier.
Claim 21
Dependent Claim
24 words
The flip chip stacked package of claim 18 , further comprising a plurality of solder balls attached on the lower surface of the carrier.
Claim 22
Dependent Claim
17 words
The flip chip stacked package of claim 15 , further comprising an underfill filled in the opening.
Claim 23
Dependent Claim
31 words
The flip chip stacked package of claim 20 , wherein the underfill further encapsulates the upper chip, the lower chip, the heat dissipation supporter and the upper surface of the carrier.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2010-11-05 | 2011-05-07 | 2011-11-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2014-11-05 | 2015-05-07 | 2015-11-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2018-11-05 | 2019-05-07 | 2019-11-06 | $7700.00 | Window Closed / Lapsed |