US5925930A
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC contacts with palladium layer and flexible conductive epoxy bumps
Assignee: Micron Technology Inc
•
Filing: 1996-05-21
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Granted: 1999-07-20
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Expires: 2016-05-21
Abstract
Abstract An apparatus and method for forming a substrate having a palladium metal layer over at least one contact point of the substrate and having a flexible conductive polymer bump, preferably a two-stage epoxy, on the palladium plated contact point. The present invention also relates to assemblies comprising one or more of these substrates.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:28
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10; H10P; H10P14/00; H10P14/40; H10P14/46; H10W; H10W70/00; H10W70/099; H10W72/00; H10W72/01; H10W72/012; H10W72/20; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10954; H05K2201/10977; H05K2201/10984; H05K3/22; H05K3/24; H05K3/244; H10W72/019; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/251; H10W72/253; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
40 words
A semiconductor device comprising: a substrate having at least one electrical contact point; a layer of palladium on said at least one substrate contact point; and an unset, conductive polymer bump disposed on at least one of said palladium layer.
Claim 2
Dependent Claim
40 words
A semiconductor device comprising: a substrate having at least one electrical contact point; a layer of palladium on said at least one substrate contact point; and an unset, conductive polymer bump disposed on at least one of said palladium layer.
Claim 3
Dependent Claim
14 words
The semiconductor of claim 1, wherein said conductive polymer bump comprises a two-stage epoxy.
Claim 4
Dependent Claim
23 words
The semiconductor of claim 1, wherein said layer of palladium is applied to said at least one substrate contact point by electroless plating.
Claim 5
Dependent Claim
12 words
The semiconductor of claim 1, wherein said substrate comprises a silicon wafer.
Claim 6
Dependent Claim
13 words
The semiconductor of claim 1, wherein said substrate comprises a printed circuit board.
Claim 7
Dependent Claim
24 words
The semiconductor of claim 1, wherein said substrate is a semiconductor chip wherein said at least one substrate contact point comprises a bond pad.
Claim 8
Dependent Claim
13 words
The semiconductor of claim 1, wherein said conductive polymer bump includes palladium therein.
Claim 9
Dependent Claim
90 words
A semiconductor assembly, said assembly comprising: a plurality of substrates, each substrate of said plurality of substrates having at least one electrical contact point thereon; at least one of said plurality of substrates having a layer of palladium on said at least one substrate contact point; and an unset, conductive polymer bump forming an electrical contact between said at least one palladium layered contact point of said one substrate of said plurality of substrates and said at least one electrical contact point of another substrate of said plurality of substrates.
Claim 10
Dependent Claim
90 words
A semiconductor assembly, said assembly comprising: a plurality of substrates, each substrate of said plurality of substrates having at least one electrical contact point thereon; at least one of said plurality of substrates having a layer of palladium on said at least one substrate contact point; and an unset, conductive polymer bump forming an electrical contact between said at least one palladium layered contact point of said one substrate of said plurality of substrates and said at least one electrical contact point of another substrate of said plurality of substrates.
Claim 11
Dependent Claim
15 words
The semiconductor assembly of claim 8, wherein said conductive polymer bump comprises a two-stage epoxy.
Claim 12
Dependent Claim
24 words
The semiconductor assembly of claim 8, wherein said layer of palladium is applied to said at least one substrate contact point by electroless plating.
Claim 13
Dependent Claim
23 words
The semiconductor assembly of claim 8, wherein said palladium layered contact point containing substrate of said plurality of substrates comprises a silicon wafer.
Claim 14
Dependent Claim
24 words
The semiconductor assembly of claim 8, wherein said palladium layered contact point containing substrate of said plurality of substrates comprises a printed circuit board.
Claim 15
Dependent Claim
34 words
The semiconductor assembly of claim 8, wherein said palladium layered contact point containing substrate of said plurality of substrates comprises a semiconductor chip wherein said at least one contact point comprises a bond pad.
Claim 16
Dependent Claim
13 words
The semiconductor assembly of claim 8, wherein said conductive polymer bump includes palladium.
Claim 17
Dependent Claim
80 words
A semiconductor assembly, said assembly comprising: a printed circuit board having at least one electrical contact point thereon; a semiconductor substrate having at least one electrical contact point thereon; a layer of palladium on said at least one contact point of said semiconductor substrate; and an unset, conductive polymer bump forming an electrical contact between said at least one palladium layered contact point of said semiconductor substrate and said at least one electrical contact point of said printed circuit board.
Claim 18
Dependent Claim
80 words
A semiconductor assembly, said assembly comprising: a printed circuit board having at least one electrical contact point thereon; a semiconductor substrate having at least one electrical contact point thereon; a layer of palladium on said at least one contact point of said semiconductor substrate; and an unset, conductive polymer bump forming an electrical contact between said at least one palladium layered contact point of said semiconductor substrate and said at least one electrical contact point of said printed circuit board.
Claim 19
Dependent Claim
15 words
The semiconductor assembly of claim 15, wherein said conductive polymer bump comprises a two-stage epoxy.
Claim 20
Dependent Claim
27 words
The semiconductor assembly of claim 15, wherein said layer of palladium is applied to said at least one contact point of said semiconductor substrate by electroless plating.
Claim 21
Dependent Claim
14 words
The semiconductor assembly of claim 15, wherein said semiconductor substrate comprises a silicon wafer.
Claim 22
Dependent Claim
28 words
The semiconductor assembly of claim 15, wherein said semiconductor substrate comprises a semiconductor chip and wherein said at least one palladium layered contact point comprises a bond pad.
Claim 23
Dependent Claim
13 words
The semiconductor assembly of claim 15, wherein said conductive polymer bump includes palladium.
Claim 24
Dependent Claim
81 words
A semiconductor assembly comprising: a printed circuit board having at least one electrical contact thereon having a layer of palladium thereon; a semiconductor substrate having at least one electrical contact thereon having a layer of palladium thereon; and an unset, conductive polymer bump forming an electrical contact between said at least one contact having a layer of palladium thereon of said semiconductor substrate and said at least one electrical contact having a layer of palladium thereon of said printed circuit board.
Claim 25
Dependent Claim
81 words
A semiconductor assembly comprising: a printed circuit board having at least one electrical contact thereon having a layer of palladium thereon; a semiconductor substrate having at least one electrical contact thereon having a layer of palladium thereon; and an unset, conductive polymer bump forming an electrical contact between said at least one contact having a layer of palladium thereon of said semiconductor substrate and said at least one electrical contact having a layer of palladium thereon of said printed circuit board.
Claim 26
Dependent Claim
15 words
The semiconductor assembly of claim 21, wherein said conductive polymer bump comprises a two-stage epoxy.
Claim 27
Dependent Claim
39 words
The semiconductor assembly of claim 21, wherein said layers of palladium are applied to said at least one electrical contact of said semiconductor substrate and said at least one electrical contact of said printed circuit board by electroless plating.
Claim 28
Dependent Claim
14 words
The semiconductor assembly of claim 21, wherein said semiconductor substrate comprises a silicon wafer.
Claim 29
Dependent Claim
29 words
The semiconductor assembly of claim 21, wherein said semiconductor substrate comprises a semiconductor chip and wherein said at least one contact of said semiconductor substrate comprises a bond pad.
Claim 30
Dependent Claim
13 words
The semiconductor assembly of claim 21, wherein said conductive polymer bump includes palladium.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-19 | 2003-01-18 | 2003-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-19 | 2007-01-18 | 2007-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-19 | 2011-01-18 | 2011-07-20 | $7700.00 | Window Closed / Lapsed |