US7129569B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Large die package structures and fabrication method therefor
Assignee: Stats Chippac Pte Ltd
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Filing: 2004-04-30
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Granted: 2006-10-31
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Expires: 2024-04-30
Abstract
Abstract A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
Inventors
- 👤 Jeffrey D. Punzalan
- 👤 Jose Alvin Caparas
- 👤 Jae Hun Ku
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 18:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10D; H10D62/00; H10D62/10; H10D62/117; H10W70/411; H10W70/415; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W90/811; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/131; H10W74/142; H10W90/701; H10W90/721; H10W90/726; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
78 words
A method for fabricating large die package structures, comprising: electrically insulating at least portions of the leadtips of at least a plurality of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; electrically connecting the die to at least a plurality of the leadfingers; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises attaching the die to a die paddle on the leadframe.
Claim 2
Independent Claim
78 words
A method for fabricating large die package structures, comprising: electrically insulating at least portions of the leadtips of at least a plurality of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; electrically connecting the die to at least a plurality of the leadfingers; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises attaching the die to a die paddle on the leadframe.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein electrically insulating further comprises insulating with a non-conductive material located between the leadtips and the die.
Claim 4
Dependent Claim
17 words
The method of claim 1 further comprising forming notches in the leadtips for receiving the die therein.
Claim 5
Independent Claim
85 words
A method for fabricating large die package structures, comprising: electrically insulating at least portions of the leadtips of at least a plurality of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; electrically connecting the die to at least a plurality of the leadfingers; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises supporting the die on a flip chip that is located on the leadframe and electrically connected thereto.
Claim 6
Independent Claim
85 words
A method for fabricating large die package structures, comprising: electrically insulating at least portions of the leadtips of at least a plurality of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; electrically connecting the die to at least a plurality of the leadfingers; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises supporting the die on a flip chip that is located on the leadframe and electrically connected thereto.
Claim 7
Independent Claim
74 words
A method for fabricating large die package structures, comprising: electrically insulating the leadtips of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; wire bonding the die to the leadfingers to electrically connect the die thereto; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises attaching the die to a die paddle on the leadframe with a conductive adhesive.
Claim 8
Independent Claim
74 words
A method for fabricating large die package structures, comprising: electrically insulating the leadtips of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; wire bonding the die to the leadfingers to electrically connect the die thereto; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises attaching the die to a die paddle on the leadframe with a conductive adhesive.
Claim 9
Dependent Claim
22 words
The method of claim 5 wherein electrically insulating further comprises insulating with a non-conductive film located between the leadtips and the die.
Claim 10
Dependent Claim
17 words
The method of claim 5 further comprising etching notches in the leadtips for receiving the die therein.
Claim 11
Independent Claim
77 words
A method for fabricating large die package structures, comprising: electrically insulating the leadtips of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; wire bonding the die to the leadfingers to electrically connect the die thereto; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises supporting the die on a flip chip that is located on the leadframe and electrically connected thereto.
Claim 12
Independent Claim
77 words
A method for fabricating large die package structures, comprising: electrically insulating the leadtips of leadfingers of a leadframe; positioning a die on the electrically insulated leadtips; wire bonding the die to the leadfingers to electrically connect the die thereto; encapsulating at least a portion of the leadframe and die in a mold compound; and wherein positioning the die further comprises supporting the die on a flip chip that is located on the leadframe and electrically connected thereto.
Claim 13
Dependent Claim
80 words
A large die package structure, comprising: a leadframe having leadfingers and a die paddle; leadtips on the leadfingers; at least portions of the leadtips of at least a plurality of the leadfingers being electrically insulated; a die positioned on the electrically insulated leadtips and attached to the die paddle on the leadframe; the die being electrically connected to at least a plurality of the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
Claim 14
Dependent Claim
80 words
A large die package structure, comprising: a leadframe having leadfingers and a die paddle; leadtips on the leadfingers; at least portions of the leadtips of at least a plurality of the leadfingers being electrically insulated; a die positioned on the electrically insulated leadtips and attached to the die paddle on the leadframe; the die being electrically connected to at least a plurality of the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
Claim 15
Dependent Claim
22 words
The structure of claim 9 wherein the leadfingers are electrically insulated with a non-conductive material located between the leadtips and the die.
Claim 16
Dependent Claim
16 words
The structure of claim 9 further comprising notches in the leadtips for receiving the die therein.
Claim 17
Dependent Claim
86 words
A large die package structure, comprising: a leadframe having leadfingers; leadtips on the leadfingers; at least portions of the leadtips of at least a plurality of the leadfingers being electrically insulated; a flip chip that is located on the leadframe and electrically connected thereto; a die positioned on the electrically insulated leadtips and supported on the flip chip; the die being electrically connected to at least a plurality of the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
Claim 18
Dependent Claim
86 words
A large die package structure, comprising: a leadframe having leadfingers; leadtips on the leadfingers; at least portions of the leadtips of at least a plurality of the leadfingers being electrically insulated; a flip chip that is located on the leadframe and electrically connected thereto; a die positioned on the electrically insulated leadtips and supported on the flip chip; the die being electrically connected to at least a plurality of the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
Claim 19
Dependent Claim
66 words
A large die package structure, comprising: a leadframe having leadfingers and a die paddle; leadtips on the leadfingers; the leadtips of the leadfingers being electrically insulated; a die positioned on the electrically insulated leadtips and attached to the die paddle on the leadframe; wirebonds electrically connecting the die to the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
Claim 20
Dependent Claim
66 words
A large die package structure, comprising: a leadframe having leadfingers and a die paddle; leadtips on the leadfingers; the leadtips of the leadfingers being electrically insulated; a die positioned on the electrically insulated leadtips and attached to the die paddle on the leadframe; wirebonds electrically connecting the die to the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
Claim 21
Dependent Claim
22 words
The structure of claim 13 wherein the leadfingers are electrically insulated with a non-conductive material located between the leadtips and the die.
Claim 22
Dependent Claim
16 words
The structure of claim 13 further comprising notches in the leadtips for receiving the die therein.
Claim 23
Dependent Claim
72 words
A large die package structure, comprising: a leadframe having leadfingers; leadtips on the leadfingers; the leadtips of the leadfingers being electrically insulated; a flip chip that is located on the leadframe and electrically connected thereto; a die positioned on the electrically insulated leadtips and supported on the flip chip; wirebonds electrically connecting the die to the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
Claim 24
Dependent Claim
72 words
A large die package structure, comprising: a leadframe having leadfingers; leadtips on the leadfingers; the leadtips of the leadfingers being electrically insulated; a flip chip that is located on the leadframe and electrically connected thereto; a die positioned on the electrically insulated leadtips and supported on the flip chip; wirebonds electrically connecting the die to the leadfingers; and a mold compound encapsulating at least a portion of the leadframe and the die.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-10-30 | 2010-05-01 | 2010-10-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-10-30 | 2014-05-01 | 2014-10-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-10-30 | 2018-05-01 | 2018-10-31 | $7700.00 | Window Closed / Lapsed |