US7067927B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Die with integral pedestal having insulated walls
Assignee: National Semiconductor Corp
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Filing: 2005-01-31
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Granted: 2006-06-27
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Expires: 2025-01-31
Abstract
Abstract A variety of techniques and structures are described that integrate an insulated pedestal into the back surface of integrated circuit dice. The die has an insulated integral pedestal formed therein that acts as a spacer. The pedestal has a footprint that is smaller than the total footprint of the die so that a portion of the active region of the die overhangs the pedestal. The geometry of the pedestal may be widely varied and in some embodiments, multiple pedestals may be provided on the stacked die. In another aspect, the pedestals are formed at the wafer level such that the pedestals are defined in the back surface of the wafer. Often, the thickness of the pedestals will be thicker than the portions of the wafer outside the pedestal areas. The described dice are particularly well suited for use in stacked die packages.
Inventors
- 👤 Shahram Mostafazadeh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:09
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/117; H10W; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W90/811; H10W72/00; H10W72/01; H10W72/013; H10W72/01331; H10W90/701; H10W90/731; H10W90/732; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
175 words
An integrated circuit package comprising: a first die having an active surface; a first set of connectors that electrically connect I/O pads exposed on the active surface of the first die to a carrier; and a second die stacked on the first die, the second die having a pedestal and an active region, the pedestal being integrally formed with the active region and including sidewalls, the pedestal having a smaller footprint than a footprint of the second die so that portions of a bottom surface of the second die are recessed relative to a bottom surface of the pedestal, and wherein the pedestal is mounted on the active surface of the first die, the die including an electrically insulating layer that covers at least portions of the sidewalls of the pedestal, wherein the insulating layer only coats and covers portions of the second die and does not encapsulate any portions of the first set of connectors, whereby the insulating layer helps prevent connectors in the first set of connectors from electrically communicating with the pedestal.
Claim 2
Dependent Claim
175 words
An integrated circuit package comprising: a first die having an active surface; a first set of connectors that electrically connect I/O pads exposed on the active surface of the first die to a carrier; and a second die stacked on the first die, the second die having a pedestal and an active region, the pedestal being integrally formed with the active region and including sidewalls, the pedestal having a smaller footprint than a footprint of the second die so that portions of a bottom surface of the second die are recessed relative to a bottom surface of the pedestal, and wherein the pedestal is mounted on the active surface of the first die, the die including an electrically insulating layer that covers at least portions of the sidewalls of the pedestal, wherein the insulating layer only coats and covers portions of the second die and does not encapsulate any portions of the first set of connectors, whereby the insulating layer helps prevent connectors in the first set of connectors from electrically communicating with the pedestal.
Claim 3
Dependent Claim
34 words
An integrated circuit package as recited in claim 1 wherein the electrically insulating layer covers all of the sidewalls of the pedestal and all recessed portions of the bottom surface of the second die.
Claim 4
Dependent Claim
63 words
An integrated circuit package as recited in claim 1 wherein: the recessed portions of the bottom surface of the second die includes a ledge region that extends entirely around the pedestal; and the footprint of the second die is at least as large as a footprint of the first die and the ledge overhangs portions of all of the first set of connectors.
Claim 5
Dependent Claim
50 words
An integrated circuit package as recited in claim 1 further comprising: a second set of connectors that electrically connect I/O pads exposed on an active surface of the second die to the carrier; and an encapsulant that encapsulates the connectors and at least portions of the first and second dice.
Claim 6
Dependent Claim
28 words
An integrated circuit package as recited in claim 1 wherein the second die has a plurality of distinct pedestals that are each integrally formed with the active region.
Claim 7
Dependent Claim
22 words
An integrated circuit package as recited in claim 5 wherein a bonding wire is positioned in a gap formed between adjacent pedestals.
Claim 8
Dependent Claim
31 words
An integrated circuit package as recited in claim 1 wherein the carrier is selected from the group consisting of a lead frame and a substrate having conductive traces and contacts thereon.
Claim 9
Dependent Claim
23 words
An integrated package as recited in claim 1 wherein the pedestal constitutes more than half of the total thickness of the second die.
Claim 10
Dependent Claim
31 words
An integrated package as recited in claim 1 wherein the insulating layer is formed from a material selected from the group consisting of: polyimide; benzocyclobutene (BCB); silicon dioxide and silicon nitride.
Claim 11
Dependent Claim
31 words
An integrated package as recited in claim 1 wherein the insulating layer is formed by a process selected from the group consisting of: spin coating; spraying; screen printing and vapor deposition.
Claim 12
Dependent Claim
111 words
A semiconductor device comprising a die having an active surface, a bottom surface, an active region, a pedestal on the bottom surface and an electrical insulating layer, the pedestal being integrally formed with the active region and including sidewalls, and the electrical insulating layer being arranged to cover at least portions of the sidewalls of the pedestal, wherein the insulating layer only coats and covers portions of the die and does not encapsulate any other structures, whereby the insulated pedestal has a smaller footprint than a total footprint of the die so that portions of the bottom surface of the die are recessed relative to a bottom surface of the pedestal.
Claim 13
Dependent Claim
111 words
A semiconductor device comprising a die having an active surface, a bottom surface, an active region, a pedestal on the bottom surface and an electrical insulating layer, the pedestal being integrally formed with the active region and including sidewalls, and the electrical insulating layer being arranged to cover at least portions of the sidewalls of the pedestal, wherein the insulating layer only coats and covers portions of the die and does not encapsulate any other structures, whereby the insulated pedestal has a smaller footprint than a total footprint of the die so that portions of the bottom surface of the die are recessed relative to a bottom surface of the pedestal.
Claim 14
Dependent Claim
24 words
A semiconductor device as recited in claim 11 wherein the insulating layer further covers the recessed portions of the bottom surface of the die.
Claim 15
Dependent Claim
20 words
A semiconductor device as recited in claim 12 wherein the insulating layer further covers the bottom surface of the pedestal.
Claim 16
Dependent Claim
27 words
An integrated circuit package as recited in claim 11 wherein the die has a plurality of distinct pedestals that are each integrally formed with the active region.
Claim 17
Dependent Claim
35 words
An integrated circuit package as recited in claim 14 wherein the pedestals are arranged in one from the group consisting of: a two dimensional array of posts; and an array of substantially parallel elongated pedestals.
Claim 18
Dependent Claim
33 words
An integrated circuit package as recited in claim 11 wherein the pedestal has a footprint that is selected from the group consisting of: substantial rectangular with rounded corners, substantially oval and substantially circular.
Claim 19
Dependent Claim
23 words
An integrated package as recited in claim 11 wherein the pedestals constitute more than half of the total thickness of the second die.
Claim 20
Dependent Claim
31 words
An integrated package as recited in claim 11 wherein the insulating layer is formed from a material selected from the group consisting of: polyimide; benzocyclobutene (BCB); silicon dioxide and silicon nitride.
Claim 21
Dependent Claim
31 words
An integrated package as recited in claim 11 wherein the insulating layer is formed by a process selected from the group consisting of: spin coating; spraying; screen printing and vapor deposition.
Claim 22
Dependent Claim
92 words
An integrated circuit wafer comprising a multiplicity of dice as: each die having an active surface, a bottom surface, an active region and a pedestal on the bottom surface, the pedestal being integrally formed with the active region and including sidewalls; and an electrically insulating layer that covers at least portions of the sidewalls of the pedestal, whereby the insulated pedestal has a smaller footprint than a total footprint of the die so that portions of the bottom surface of the die are recessed relative to a bottom surface of the pedestal.
Claim 23
Dependent Claim
92 words
An integrated circuit wafer comprising a multiplicity of dice as: each die having an active surface, a bottom surface, an active region and a pedestal on the bottom surface, the pedestal being integrally formed with the active region and including sidewalls; and an electrically insulating layer that covers at least portions of the sidewalls of the pedestal, whereby the insulated pedestal has a smaller footprint than a total footprint of the die so that portions of the bottom surface of the die are recessed relative to a bottom surface of the pedestal.
Claim 24
Dependent Claim
30 words
A wafer as recited in claim 20 wherein the insulating layer is formed from a material selected from the group consisting of: polyimide; benzocyclobutene (BCB); silicon dioxide and silicon nitride.
Claim 25
Dependent Claim
32 words
An integrated package as recited in claim 20 wherein the insulating layer is formed by a process selected from the group consisting of: spin coating; spraying; screen printing; vapor deposition and dispensing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-06-26 | 2009-12-26 | 2010-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-06-26 | 2013-12-26 | 2014-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-06-26 | 2017-12-26 | 2018-06-27 | $7700.00 | Window Closed / Lapsed |