Stacked multi-chip package, process for fabrication of chip structuring package, and process for wire-bonding

Claim 2

A stacked multi-chip package comprising: a substrate; a first chip which is fixed to an upper face of the substrate and include a main surface having a first circuit element formed thereon, the first chip including a collar portion which faces the upper face of the substrate and is configured such that a gap is provided between the upper face of the substrate and the collar portion; and a second chip which includes a main surface having a second circuit element formed thereon, the second chip being disposed in a region below the collar portion and fixed to the substrate such that the main surface of the second chip is disposed without contacting the first chip.

Claim 3

The stacked multi-chip package of claim 1 , wherein a cross-section of the first chip substantially comprises a T shape.

Claim 4

The stacked multi-chip package of claim 1 , further comprising a connection member which electrically connects the second chip with the substrate, and wherein the gap is of a size such that the connection member does not make contact with the collar portion.

Claim 5

The stacked multi-chip package of claim 1 , further comprising an insulation member on a side of the collar portion which faces the upper face of the substrate.

Claim 6

The stacked multi-chip package of claim 3 , wherein the second chip includes an electrode pad to which the connection member is electrically connected, the electrode pad including nickel and gold.

Claim 7

The stacked multi-chip package of claim 5 , wherein the connection member comprises metallic wire which is wired from the substrate to the second chip.

Claim 8

The stacked multi-chip package of claim 1 , wherein the first circuit element comprises a logic device and the second circuit element comprises a storage device.

Claim 9

The stacked multi-chip package of claim 1 , further comprising a third chip interposed between the substrate and the first and second chips, an outline of the third chip being substantially the same size as an outline of the first chip.

Claim 10

The stacked multi-chip package of claim 1 , wherein the first chip and the substrate are electrically connected by metallic wire wired from the first chip to the substrate, and the collar portion has a thickness which is not less than half of a thickness of the first chip.

Claim 11

A stacked multi-chip package comprising: a substrate; a first chip including an upper face which includes a first electrode pad, a lower face whose area is smaller than an area of the upper face, and a side face connecting the upper face and the lower face, the lower face being fixed on the substrate; a first metallic wire electrically connecting the first electrode pad with the substrate; a second chip disposed below the first chip and including an upper face which includes a second electrode pad, the second chip being disposed at a location separated by a predetermined distance from the side face of the first chip; and a second metallic wire electrically connecting the second electrode pad with the substrate, wherein the upper face of the first chip includes a first circuit element connected to the first electrode pad and the upper face of the second chip includes a second circuit element connected to the second electrode pad.

Claim 12

A stacked multi-chip package comprising: a substrate; a first chip including an upper face which includes a first electrode pad, a lower face whose area is smaller than an area of the upper face, and a side face connecting the upper face and the lower face, the lower face being fixed on the substrate; a first metallic wire electrically connecting the first electrode pad with the substrate; a second chip disposed below the first chip and including an upper face which includes a second electrode pad, the second chip being disposed at a location separated by a predetermined distance from the side face of the first chip; and a second metallic wire electrically connecting the second electrode pad with the substrate, wherein the upper face of the first chip includes a first circuit element connected to the first electrode pad and the upper face of the second chip includes a second circuit element connected to the second electrode pad.

Claim 13

The stacked multi-chip package of claim 10 , wherein a cross-section of the first chip substantially comprises a T shape.

Claim 14

The stacked multi-chip package of claim 10 , wherein the second metallic wire includes a peak portion, and a distance from the upper face of the second chip to the side face of the first chip is greater than a distance from the upper face of the second chip to the peak portion.

Claim 15

The stacked multi-chip package of claim 10 , further comprising an insulation member at on the side face of the first chip.

Claim 16

The stacked multi-chip package of claim 10 , wherein the second electrode pad includes nickel and gold.

Claim 17

The stacked multi-chip package of claim 14 , wherein the second metallic wire is wired from the substrate to the second chip.

Claim 18

The stacked multi-chip package of claim 10 , wherein the first circuit element comprises a logic device and the second circuit element comprises a storage device.

Claim 19

The stacked multi-chip package of claim 10 , further comprising a third chip interposed between the substrate and the first and second chips, an outline of the third chip being substantially the same size as a an outline of the first chip.

Claim 20

A stacked multi-chip package comprising: a substrate including a front face; a chip body fixed at cm the front face of the substrate and including an upper portion which has first circuit element thereon, with a gap being formed between the upper portion and the front face of the substrate, and a connecting portion which connects the chip body with the substrate; and a fixed chip fixed at on the front face of the substrate without contacting the chip body, at least a portion of the fixed chip being disposed in the gap, wherein the portion of the fixed chip that is disposed in the gap includes an upper face which opposes the first face portion of the chip body, and the upper face is disposed upward relative to the connecting portion, and wherein the upper portion of the chip body includes the first circuit element connected to a first electrode pad and the upper face of the fixed chip includes a second circuit element connected to a second electrode pad.

Claim 21

A stacked multi-chip package comprising: a substrate including a front face; a chip body fixed at cm the front face of the substrate and including an upper portion which has first circuit element thereon, with a gap being formed between the upper portion and the front face of the substrate, and a connecting portion which connects the chip body with the substrate; and a fixed chip fixed at on the front face of the substrate without contacting the chip body, at least a portion of the fixed chip being disposed in the gap, wherein the portion of the fixed chip that is disposed in the gap includes an upper face which opposes the first face portion of the chip body, and the upper face is disposed upward relative to the connecting portion, and wherein the upper portion of the chip body includes the first circuit element connected to a first electrode pad and the upper face of the fixed chip includes a second circuit element connected to a second electrode pad.

Claim 22

The stacked multi-chip package of claim 18 , wherein the upper portion of the chip body comprises a chip disposed to be separated a predetermined distance above the front face of the substrate; and the connecting portion comprises a spacer disposed between the chip and the substrate.

Claim 23

The stacked multi-chip package of claim 18 , wherein the upper portion of the chip body comprises a collar portion, and the upper collar portion includes an upper face which has the first circuit element thereon.

Claim 24

The stacked multi-chip package of claim 20 , wherein the upper portion and the connecting portion of the chip body is are integrally formed.

Claim 25

The stacked multi-chip package of claim 21 , wherein an elevation cross-section of the chip body substantially comprises a T shape.

Claim 26

The stacked multi-chip package of claim 1 , wherein the second chip is smaller in area than and disposed wholly within the region below the collar portion of the first chip.

Claim 27

The stacked multi-chip package of claim 10 , wherein the second chip is smaller in area than and disposed wholly below the first chip.

Claim 28

The stacked multi-chip package of claim 1 , wherein the second chip is smaller in area than upper portion of the first chip and disposed wholly within the gap.