US7064420B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit leadframe with ground plane
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-05-23
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Granted: 2006-06-20
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Expires: 2023-05-23
Abstract
Abstract A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at least two different layers. At least one force release and stress relief structure is incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.
Inventors
- 👤 Byung Joon Han
- 👤 Byung Hoon Ahn
- 👤 Zheng Zheng
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 22:54
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/411; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
75 words
A leadframe for a semiconductor package, comprising: signal and ground leads; a ground plane configured for direct connection to ground wires from a die; a frame paddle; supports connecting the signal and ground leads, ground plane, and frame paddle in at least two different layers; and at least one force release and stress relief structure incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.
Claim 2
Dependent Claim
75 words
A leadframe for a semiconductor package, comprising: signal and ground leads; a ground plane configured for direct connection to ground wires from a die; a frame paddle; supports connecting the signal and ground leads, ground plane, and frame paddle in at least two different layers; and at least one force release and stress relief structure incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.
Claim 3
Dependent Claim
30 words
The leadframe of claim 1 wherein the force release and stress relief structure further comprises at least one slot formed in the ground plane substantially adjacent a support connected thereto.
Claim 4
Dependent Claim
37 words
The leadframe of claim 1 wherein the force release and stress relief structure further comprises at least one link of reduced transverse extent formed in the ground plane near at least one of the supports connected thereto.
Claim 5
Dependent Claim
35 words
The leadframe of claim 3 wherein the force release and stress relief link further comprises a structure selected from the group consisting of Z-links, W-links, necks, slim linkages, open rings, holes, and a combination thereof.
Claim 6
Dependent Claim
26 words
The leadframe of claim 1 wherein the force release and stress relief structure further comprises a region of narrowed transverse extent formed in a ground lead.
Claim 7
Dependent Claim
17 words
The leadframe of claim 5 wherein the region of narrowed transverse extent further comprises a box slot.
Claim 8
Dependent Claim
26 words
The leadframe of claim 1 wherein the force release and stress relief structure further comprises supports connected symmetrically to the ground plane on opposite sides thereof.
Claim 9
Dependent Claim
16 words
The leadframe of claim 7 wherein the supports further comprise downsets connected to the ground plane.
Claim 10
Dependent Claim
14 words
The leadframe of claim 1 wherein the ground plane further comprises a bonding ring.
Claim 11
Dependent Claim
12 words
The leadframe of claim 1 wherein the ground plane further comprises tabs.
Claim 12
Dependent Claim
133 words
A semiconductor package, comprising: a leadframe having: signal and ground leads; a ground plane connected to a plurality of the pound leads; a frame paddle; supports connecting the signal and ground leads, ground plane, and frame paddle in at least three different layers; and force release and stress relief structures incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein; a semiconductor die located on the frame paddle; an adhesive securing the semiconductor die to the frame paddle; at least one ground wire connected between the semiconductor die and the ground plane; at least one signal wire connected between the semiconductor die and at least one of the signal leads; and an encapsulating body formed substantially around the leadframe, wires, and semiconductor die.
Claim 13
Dependent Claim
133 words
A semiconductor package, comprising: a leadframe having: signal and ground leads; a ground plane connected to a plurality of the pound leads; a frame paddle; supports connecting the signal and ground leads, ground plane, and frame paddle in at least three different layers; and force release and stress relief structures incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein; a semiconductor die located on the frame paddle; an adhesive securing the semiconductor die to the frame paddle; at least one ground wire connected between the semiconductor die and the ground plane; at least one signal wire connected between the semiconductor die and at least one of the signal leads; and an encapsulating body formed substantially around the leadframe, wires, and semiconductor die.
Claim 14
Dependent Claim
25 words
The package of claim 11 wherein the force release and stress relief structures further comprise slots formed in the ground plane adjacent supports connected thereto.
Claim 15
Dependent Claim
30 words
The package of claim 11 wherein the force release and stress relief structures further comprise links of reduced transverse extent formed in the ground plane near the supports connected thereto.
Claim 16
Dependent Claim
34 words
The package of claim 13 wherein the force release and stress relief links further comprise structures selected from the group consisting of Z-links, W-links, necks, slim linkages, open rings, holes, and a combination thereof.
Claim 17
Dependent Claim
25 words
The package of claim 11 wherein the force release and stress relief structures further comprise regions of narrowed transverse extent formed in the ground leads.
Claim 18
Dependent Claim
16 words
The package of claim 15 wherein the regions of narrowed transverse extent further comprise box slots.
Claim 19
Dependent Claim
26 words
The package of claim 11 wherein the force release and stress relief structures further comprise supports connected symmetrically to the ground plane on opposite sides thereof.
Claim 20
Dependent Claim
16 words
The package of claim 17 wherein the supports further comprise downsets connected to the ground plane.
Claim 21
Dependent Claim
14 words
The package of claim 11 wherein the ground plane further comprises a bonding ring.
Claim 22
Dependent Claim
12 words
The package of claim 11 wherein the ground plane further comprises tabs.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-06-19 | 2009-12-19 | 2010-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-06-19 | 2013-12-19 | 2014-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-06-19 | 2017-12-19 | 2018-06-20 | $7700.00 | Window Closed / Lapsed |