EP0706213A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Single layer leadframe design with groundplane capability
Assignee: International Business Machines Corp
•
Filing: 1995-07-20
•
Granted: —
•
Expires: 2015-07-20
Abstract
Abstract A method of making an electronic package. The method includes the step providing a leadframe of a single layer of material. The leadframe includes a semiconductor chip support, a plurality of signal leads, and a common ground portion substantially surrounding the chip support portion. A semiconductor chip having a plurality of signal sites and a plurality of ground sites is positioned on the semiconductor chip support of the leadframe. Selected ones of the signal sites of the semiconductor chip are selectively electrically connected to respective ones of the signal leads of the leadframe and selective ones of the ground sites of the semiconductor chip are selectively electrically connected to the common ground portion of the leadframe. Each of the signal leads of the leadframe are electrically isolated from each other and from the common ground portion of the leadframe.
Inventors
- 👤 Steven Joel Diffenderfer
- 👤 Hussain Shaukatullah
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-06 13:17
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
120 words
A method of making an electronic package, said method comprising the steps of: providing a leadframe (1) of a single layer of material, said leadframe including a semiconductor chip support, a plurality of signal leads (13), and a common ground portion substantially surrounding said chip support portion; positioning a semiconductor chip having a plurality of signal sites and a plurality of ground sites on said semiconductor chip support of said leadframe; electrically connecting selected ones of said signal sites to respective ones of said signal leads and selective ones of said ground sites to said common ground portion of said leadframe; and electrically isolating each of said signal leads from each other and said common ground portion of said leadframe.
Claim 2
Dependent Claim
40 words
A method according to claim 1, further comprising the step of: providing a protective enclosure substantially about said semiconductor device, said semiconductor chip support, said common ground portion of said leadframe, and at least a portion of said signal leads.
Claim 3
Dependent Claim
28 words
A method according to claim 1 or 2, wherein said leadframe is formed of a metal selected from the group consisting of copper, copper alloys, and nickel-iron alloys.
Claim 4
Independent Claim
27 words
A method according to any one of claims 1 to 3, wherein said ground, leads, and support are formed by stamping or etching them in said leadframe.
Claim 5
Independent Claim
35 words
A method according to any one of claims 1 to 4, wherein said chip is positioned with a method selected from the group consisting of adhesive, and solder, gold/silicon eutectic, and other metallurgical bonding techniques.
Claim 6
Independent Claim
49 words
A method according to any one of claims 1 to 5, wherein said selected ones of said signal sites are electrically connected to respective ones of said signal leads and selective ones of said ground sites are electrically connected to said common ground portion of said leadframe by wire-bonding.
Claim 7
Independent Claim
45 words
A method according to any one of claims 2 to 6, wherein said enclosure comprises a first base part and a cover part and said leadframe is positioned on said base part and said cover part is applied over said base part and said leadframe.
Claim 8
Independent Claim
32 words
A method according to any one of claims 2 to 7, wherein said protective enclosure is made of at least one material selected from the group consisting of metal, ceramic, and plastic.
Claim 9
Independent Claim
27 words
A method according to any one of the preceding claims, further comprising the step of encapsulating said leadframe and said semiconductor chip within an electrically insulating material.
Claim 10
Dependent Claim
58 words
A leadframe, comprising: a single layer of an electrically conducting material; a semiconductor chip support; a common ground portion substantially surrounding said semiconductor chip support and electrically connected thereto; a plurality of signal leads electrically isolated from each other and from said common ground portion; and a plurality of ground leads electrically connected to said common ground portion.
Claim 11
Dependent Claim
44 words
A leadframe according to claim 10, further comprising tie bars for connecting said common ground portion to said semiconductor chip support, said tie bars both supporting said semiconductor chip support and providing electrical connection between said common ground portion and said semiconductor chip portion.
Claim 12
Dependent Claim
132 words
An electronic package, comprising: a leadframe according to claim 3, 10 or 11, comprising a single layer of an electrically conducting material, a semiconductor chip support, a common ground portion substantially surrounding said semiconductor chip support and electrically connected thereto, a plurality of signal leads electrically isolated from each other and from said common ground portion, and a plurality of ground leads electrically connected to said common ground portion; a semiconductor chip including a plurality of signal sites and a plurality of ground sites, said semiconductor chip being mounted on said semiconductor chip support of said leadframe; and a plurality of electrical connections between selected ones of said signal sites to respective ones of said signal leads and between selected ones of said ground sites to respective ones of said ground leads.
Claim 13
Dependent Claim
41 words
An electronic package according to claim 12, further comprising: a protective enclosure according to claim 8 substantially about said semiconductor device, said semiconductor chip support, said common ground portion of said leadframe, and at least a portion of said signal leads.
Claim 14
Dependent Claim
23 words
An electronic package according to claim 12, wherein said ground, leads, and support are formed by stamping or etching them in said leadframe.
Claim 15
Dependent Claim
33 words
An electronic package according to claim 13 or 14, wherein said chip is positioned with a method selected from the group consisting of adhesive, and solder, gold/silicon eutectic, and other metallurgical bonding techniques.
Claim 16
Dependent Claim
50 words
An electronic package according to any one of claims 13 to 15, wherein said selected ones of said signal sites are electrically connected to respective ones of said signal leads and selective ones of said ground sites are electrically connected to said common ground portion of said leadframe by wire-bonding.
Claim 17
Dependent Claim
47 words
An electronic package according to any one of claims 13 to 16, wherein said protective enclosure comprises a first base part and a cover part and said leadframe is positioned on said base part and said cover part is applied over said base part and said leadframe.
Claim 18
Dependent Claim
26 words
An electronic package according to any one of claims 13 to 17, wherein said leadframe and said semiconductor chip are encapsulated within an electrically insulating material.
Claim 19
Independent Claim
32 words
A method according to any one of claims 13 to 18, further comprising a step of attaching slug to the die bond pad on a surface opposite where said chip is attached.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.