US6630373B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ground plane for exposed package
Assignee: Stats Chippac Pte Ltd
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Filing: 2002-02-26
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Granted: 2003-10-07
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Expires: 2022-02-26
Abstract
Abstract A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.
Inventors
- 👤 Jeffrey D. Punzalan
- 👤 Hien Boon Tan
- 👤 Zheng Zheng
- 👤 Jae Hak Yee
- 👤 Byung Joon Han
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 10:42
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
229 words
A method of creating a semiconductor device package, comprising the steps of: providing a semiconductor device; providing a leadframe, conductive traces having been provided over the surface of said lead frame; providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame; depositing a layer of die attach paste over the surface of said die attach paddle; mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle; providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame; providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane; and providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 2
Independent Claim
229 words
A method of creating a semiconductor device package, comprising the steps of: providing a semiconductor device; providing a leadframe, conductive traces having been provided over the surface of said lead frame; providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame; depositing a layer of die attach paste over the surface of said die attach paddle; mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle; providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame; providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane; and providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 3
Dependent Claim
25 words
The method of claim 1 , said first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires.
Claim 4
Dependent Claim
13 words
The method of claim 1 , said second conductive interconnects comprising ground wires.
Claim 5
Dependent Claim
45 words
The method of claim 1 , said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
Claim 6
Dependent Claim
34 words
The method of claim 1 , said ground plane comprising an uninterrupted frame spatially surrounding said die attach paddle, said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 7
Dependent Claim
35 words
The method of claim 1 , said ground plane comprising separated layers of metal spatially surrounding said die attach paddle, said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 8
Independent Claim
247 words
A method of creating a semiconductor device package, comprising the steps of: providing a semiconductor device; providing a leadframe, conductive traces having been provided over the surface of said lead frame; providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame; depositing a layer of die attach paste over the surface of said die attach paddle; mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle; providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane; and providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 9
Independent Claim
247 words
A method of creating a semiconductor device package, comprising the steps of: providing a semiconductor device; providing a leadframe, conductive traces having been provided over the surface of said lead frame; providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame; depositing a layer of die attach paste over the surface of said die attach paddle; mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle; providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane; and providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 10
Dependent Claim
13 words
The method of claim 7 , said second conductive interconnects comprising ground wires.
Claim 11
Dependent Claim
45 words
The method of claim 7 , said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
Claim 12
Dependent Claim
34 words
The method of claim 7 , said ground plane comprising an uninterrupted frame spatially surrounding said die attach paddle, said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 13
Dependent Claim
35 words
The method of claim 7 , said ground plane comprising separated layers of metal spatially surrounding said die attach paddle, said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 14
Independent Claim
254 words
A method of creating a semiconductor device package, comprising the steps of: providing a semiconductor device; providing a leadframe, conductive traces having been provided over the surface of said lead frame; providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame; depositing a layer of die attach paste over the surface of said die attach paddle; mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle; providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane, said second conductive interconnects comprising ground wires; and providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 15
Independent Claim
254 words
A method of creating a semiconductor device package, comprising the steps of: providing a semiconductor device; providing a leadframe, conductive traces having been provided over the surface of said lead frame; providing a ground plane, said ground plane forming a physical and thereto connected interface between said die attach paddle and said lead frame, a plane of said ground plane being interposed between a plane of said die attach paddle and a plane of said lead frame, a plane of said ground plane being parallel with a plane of said die attach paddle, a plane of said ground plane further being parallel with a plane of said lead frame; depositing a layer of die attach paste over the surface of said die attach paddle; mounting said semiconductor device over said layer of die attach paste, thereby mounting said semiconductor device over said die attach paddle; providing first conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said conductive traces having been provided over the surface of said lead frame, first conductive interconnects being selected from the group consisting of signal wires and ground wires and power wires; providing second conductive interconnects between points of electrical contact on an active surface of the semiconductor die and said ground plane, said second conductive interconnects comprising ground wires; and providing a mold compound overlying said die attach paddle, further enclosing said ground plane, further enclosing said first and second conductive interconnects, further enclosing said lead frame by a measurable amount.
Claim 16
Dependent Claim
45 words
The method of claim 12 , said physical and thereto connected interface between said die attach paddle and said lead frame comprising metal interconnects in metal strip form, a plane of said metal interconnects intersecting a plane of said die attach paddle under an angle.
Claim 17
Dependent Claim
34 words
The method of claim 12 , said ground plane comprising an uninterrupted frame spatially surrounding said die attach paddle, said ground plane comprising a square or rectangular geometric shape when viewed in top view.
Claim 18
Dependent Claim
35 words
The method of claim 12 , said ground plane comprising separated layers of metal spatially surrounding said die attach paddle, said ground plane comprising a square or rectangular geometric shape when viewed in top view.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-10-06 | 2007-04-07 | 2007-10-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-10-06 | 2011-04-07 | 2011-10-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-10-06 | 2015-04-07 | 2015-10-07 | $7700.00 | Window Closed / Lapsed |