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US6994612B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Methods for conditioning surfaces of polishing pads after chemical-mechanical polishing

Assignee: Micron Technology Inc
•
Filing: 2002-02-13
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Granted: 2006-02-07
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Expires: 2022-02-13
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Abstract

Abstract The invention includes a method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The method includes exposing the pad surface to steam, and the steam can comprise ammonium citrate. The invention also includes an apparatus for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The apparatus includes a conditioning stone, and a steam outlet port proximate the conditioning stone. The steam outlet port is configured to jet steam onto the pad surface during the conditioning of the pad surface.

Inventors

  • 👤 Brian E. Cron

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 12:21
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 50 words
A method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface, the pad not being a semiconductor substrate, the method comprising exposing the pad surface to cleaning material that is entirely in the vapor phase, the cleaning material comprising steam.
Claim 2
Independent Claim 50 words
A method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface, the pad not being a semiconductor substrate, the method comprising exposing the pad surface to cleaning material that is entirely in the vapor phase, the cleaning material comprising steam.
Claim 3
Dependent Claim 31 words
The method of claim 1 wherein the cleaning material is jetted onto the pad surface to impact the surface with a pressure of from about 10 psig to about 20 psig.
Claim 4
Dependent Claim 23 words
The method of claim 1 wherein the cleaning material has a temperature of at least about 200° F. as it impacts the surface.
Claim 5
Dependent Claim 37 words
The method of claim 1 wherein the cleaning material is jetted onto the pad surface from a head which is displaced relative to the pad surface during the exposure of the pad surface to the cleaning material.
Claim 6
Dependent Claim 44 words
The method of claim 1 wherein the pad has a contaminant associated therewith prior to the conditioning, and wherein a chemical agent suitable for reacting with the contaminant is within the cleaning material during the exposure of the pad surface to the cleaning material.
Claim 7
Dependent Claim 11 words
The method of claim 5 wherein the chemical agent includes ammonium.
Claim 8
Dependent Claim 12 words
The method of claim 6 wherein the chemical agent is ammonium citrate.
Claim 9
Dependent Claim 17 words
The method of claim 6 wherein the chemical-mechanical polishing utilizes the pad to polish a copper-containing material.
Claim 10
Dependent Claim 21 words
The method of claim 1 wherein the pad is rubbed against a conditioning stone during the exposure to the cleaning material.
Claim 11
Dependent Claim 22 words
The method of claim 1 wherein the pad is rubbed against a conditioning stone prior to the exposure to the cleaning material.
Claim 12
Dependent Claim 21 words
The method of claim 1 wherein the pad is rubbed against a conditioning stone after the exposure to the cleaning material.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2009-02-06 2009-08-08 2010-02-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2013-02-06 2013-08-08 2014-02-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2017-02-06 2017-08-08 2018-02-07 $7700.00 Window Closed / Lapsed

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