US6911814B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method for electromechanical testing and validation of probe cards
Assignee: FormFactor Inc
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Filing: 2003-07-01
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Granted: 2005-06-28
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Expires: 2023-07-01
Abstract
Abstract A method of testing a probe card includes the step of positioning the probe card in a prober over a verification wafer that is placed on a stage. The probe card is brought in contact with a contact region on the verification wafer. The verification wafer includes a shorting plane surrounding the contact region. A test signal is sent through the verification wafer to the probe card. A response signal from the probe card is received and analyzed.
Inventors
- 👤 Charles A. Miller
- 👤 Emad B. Hreish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 15:08
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R35/00; G01R31/00; G01R31/08; G01R31/11; G01R31/28; G01R31/2851; G01R31/2886
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
72 words
A method of testing a probe card comprising the steps of: positioning the probe card in a prober over a verification wafer; bringing the probe card in contact with a contact region on the verification wafer, the verification wafer including a shorting plane surrounding the contact region; sending a test signal through the contact region to the probe card; and receiving a response signal from the probe card through the verification wafer.
Claim 2
Independent Claim
72 words
A method of testing a probe card comprising the steps of: positioning the probe card in a prober over a verification wafer; bringing the probe card in contact with a contact region on the verification wafer, the verification wafer including a shorting plane surrounding the contact region; sending a test signal through the contact region to the probe card; and receiving a response signal from the probe card through the verification wafer.
Claim 3
Dependent Claim
23 words
The method of claim 1 , further including the step of receiving the response signal over a cable attached to the verification wafer.
Claim 4
Dependent Claim
41 words
The method of claim 1 , further including the step of continuously sending test signals through the verification wafer while bringing the verification wafer in contact with the probe card so as to measure height of probes on the probe card.
Claim 5
Dependent Claim
23 words
The method of claim 1 , further including the step of performing a continuity test on a signal path in the probe card.
Claim 6
Dependent Claim
21 words
The method of claim 4 , further including the step of using time domain reflectometry (TDR) to perform the continuity test.
Claim 7
Dependent Claim
21 words
The method of claim 4 , further including the step of using frequency domain reflectometry (FDR) to perform the continuity test.
Claim 8
Dependent Claim
21 words
The method of claim 1 , further including the step of determining impedance of a signal path in the probe card.
Claim 9
Dependent Claim
18 words
The method of claim 1 , further including the step of testing leakage current in the probe card.
Claim 10
Dependent Claim
55 words
The method of claim 1 , further including the step of measuring planarity of the probe card by bringing the probe card and the verification wafer together until probes of the probe card make contact with the verification wafer, and measuring a position of the verification wafer along a direction perpendicular to the verification wafer.
Claim 11
Dependent Claim
19 words
The method of claim 1 , further including the step of verifying location of probes of the probe card.
Claim 12
Dependent Claim
64 words
The method of claim 1 , further including the steps of: bringing the probe card in contact with a plurality of contact regions on the verification wafer during the step of bringing the probe card in contact with the contact region; sending test signals through the contact regions on the verification wafer to the probe card; and receiving response signals from the probe card.
Claim 13
Independent Claim
69 words
A method of testing a probe card comprising the steps of: positioning the probe card having probes in a prober over a blank wafer; bringing the probe card in contact with the blank wafer; making scrub marks on the blank wafer with the probes by moving the blank wafer in an X, Y plane; and examining the scrub marks on the blank wafer to determine location of the probes.
Claim 14
Independent Claim
69 words
A method of testing a probe card comprising the steps of: positioning the probe card having probes in a prober over a blank wafer; bringing the probe card in contact with the blank wafer; making scrub marks on the blank wafer with the probes by moving the blank wafer in an X, Y plane; and examining the scrub marks on the blank wafer to determine location of the probes.
Claim 15
Independent Claim
92 words
A method of testing a probe card comprising the steps of: placing a verification wafer in a prober, the verification wafer having a contact region, a shorting plane surrounding the contact region, and an electrical connection to a tester; positioning the probe card in the prober over the verification wafer; bringing the probe card in contact with the contact region; generating a test signal in the tester; transmitting the test signal to the probe card through the contact region; and receiving a response signal from the probe card over the electrical connection.
Claim 16
Independent Claim
92 words
A method of testing a probe card comprising the steps of: placing a verification wafer in a prober, the verification wafer having a contact region, a shorting plane surrounding the contact region, and an electrical connection to a tester; positioning the probe card in the prober over the verification wafer; bringing the probe card in contact with the contact region; generating a test signal in the tester; transmitting the test signal to the probe card through the contact region; and receiving a response signal from the probe card over the electrical connection.
Claim 17
Dependent Claim
18 words
The method of claim 13 , wherein the electrical connection includes a cable attached to the verification wafer.
Claim 18
Dependent Claim
41 words
The method of claim 13 , further including the step of continuously sending test signals through the verification wafer while bringing the verification wafer in contact with the probe card so as to measure height of probes on the probe card.
Claim 19
Dependent Claim
28 words
The method of claim 13 , further including the step of performing a continuity test on a signal path between a test signal generator and the probe card.
Claim 20
Dependent Claim
21 words
The method of claim 16 , further including the step of using time domain reflectometry (TDR) to perform the continuity test.
Claim 21
Dependent Claim
21 words
The method of claim 16 , further including the step of using frequency domain reflectometry (FDR) to perform the continuity test.
Claim 22
Dependent Claim
26 words
The method of claim 13 , further including the step of determining impedance of a signal path between a test signal generator and the probe card.
Claim 23
Dependent Claim
18 words
The method of claim 13 , further including the step of testing leakage current in the probe card.
Claim 24
Dependent Claim
55 words
The method of claim 13 , further including the step of measuring planarity of the probe card by bringing the probe card and the verification wafer together until probes of the probe card make contact with the verification wafer, and measuring a position of the verification wafer along a direction perpendicular to the verification wafer.
Claim 25
Dependent Claim
19 words
The method of claim 13 , further including the step of verifying location of probes of the probe card.
Claim 26
Dependent Claim
60 words
The method of claim 13 , further including the steps of: bringing the probe card in contact with a plurality of contact regions on the verification wafer during the step of bringing the probe card in contact with the contact region; sending test signals through the contact regions to the probe card; and receiving response signals from the probe card.
Claim 27
Independent Claim
72 words
A system for testing a probe card comprising: a prober including means for moving a verification wafer in at least a vertical direction; a verification wafer positioned on means for moving and having a contact region surrounded by a shorting plane; an electrical connection from the contact region to a test signal generator, wherein signals generated by the test signal generator are transmitted to a probe on a probe card under test.
Claim 28
Independent Claim
72 words
A system for testing a probe card comprising: a prober including means for moving a verification wafer in at least a vertical direction; a verification wafer positioned on means for moving and having a contact region surrounded by a shorting plane; an electrical connection from the contact region to a test signal generator, wherein signals generated by the test signal generator are transmitted to a probe on a probe card under test.
Claim 29
Dependent Claim
31 words
The system of claim 24 , wherein the verification wafer includes a plurality of contact regions surrounded by the shorting plane for testing multiple probes on the probe card under test.
Claim 30
Dependent Claim
20 words
The system of claim 24 , wherein the electrical connection is one of a coaxial cable and a flex cable.
Claim 31
Dependent Claim
16 words
The system of claim 24 , wherein the test generator includes a time domain reflectometry apparatus.
Claim 32
Dependent Claim
16 words
The system of claim 24 , wherein the test generator includes a frequency domain reflectometry apparatus.
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 2008-06-27 | 2008-12-27 | 2009-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-06-27 | 2012-12-27 | 2013-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-06-27 | 2016-12-27 | 2017-06-28 | $7700.00 | Window Closed / Lapsed |