Patent US6828665B2 successfully refreshed from Google Patents.
US6828665B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Module device of stacked semiconductor packages and method for fabricating the same
Assignee: Siliconware Precision Industries Co Ltd
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Filing: 2002-12-13
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Granted: 2004-12-07
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Expires: 2022-12-13
Abstract
Abstract A module device of stacked semiconductor packages and a method for fabricating the module device are proposed, wherein a first semiconductor package provided, and at least a second semiconductor package is stacked on and electrically connected to the first semiconductor package. The first semiconductor package includes a chip carrier for mounting at least a chip thereon; a circuit board positioned above and electrically connected to the chip carrier by a plurality of conductive elements; and an encapsulant for encapsulating the chip, conductive elements and encapsulant with a top surface of the circuit board being exposed, allowing the second semiconductor package to be electrically connected to the exposed top surface of the circuit board. As the circuit board is incorporated in the first semiconductor package by means of the encapsulant, it provides preferably reliability and workability for electrically connecting the second semiconductor package to the first semiconductor package.
Inventors
- 👤 Han-Ping Pu
- 👤 Chih-Ming Huang
- 👤 Chien-Ping Huang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/401; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K1/144; H10W70/62; H10W70/63; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/01; H10W74/012; H10W74/15; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
183 words
A module device of stacked semiconductor packages, comprising: a first semiconductor package; and at least a second semiconductor package stacked on and electrically connected to the first semiconductor package; wherein the first semiconductor package comprises: a chip carrier; at least a chip mounted on the chip carrier; a plurality of first conductive elements for electrically connecting the chip to the chip carrier; a circuit board having a top surface and a bottom surface, and mounted above the chip; a plurality of second conductive elements disposed on the bottom surface of the circuit board, for supporting and electrically connecting the circuit board to the chip carrier; an encapsulant formed between the chip carrier and the circuit board, for encapsulating the chip and the first and second conductive elements, such that the encapsulant is flush with the top surface of the circuit board, allowing the top surface of the circuit board to be exposed to outside of the encapsulant and electrically connected with the second semiconductor package; and a plurality of third conductive elements for electrically connecting the first semiconductor package to an external device.
Claim 2
Dependent Claim
183 words
A module device of stacked semiconductor packages, comprising: a first semiconductor package; and at least a second semiconductor package stacked on and electrically connected to the first semiconductor package; wherein the first semiconductor package comprises: a chip carrier; at least a chip mounted on the chip carrier; a plurality of first conductive elements for electrically connecting the chip to the chip carrier; a circuit board having a top surface and a bottom surface, and mounted above the chip; a plurality of second conductive elements disposed on the bottom surface of the circuit board, for supporting and electrically connecting the circuit board to the chip carrier; an encapsulant formed between the chip carrier and the circuit board, for encapsulating the chip and the first and second conductive elements, such that the encapsulant is flush with the top surface of the circuit board, allowing the top surface of the circuit board to be exposed to outside of the encapsulant and electrically connected with the second semiconductor package; and a plurality of third conductive elements for electrically connecting the first semiconductor package to an external device.
Claim 3
Dependent Claim
28 words
The module device of stacked semiconductor packages of claim 1 , wherein the first conductive elements are selected from the group consisting of bonding wires and solder bumps.
Claim 4
Dependent Claim
30 words
The module device of stacked semiconductor packages of claim 1 , wherein the second conductive elements are selected from the group consisting of solder balls, solder bumps and metal pins.
Claim 5
Dependent Claim
19 words
The module device of stacked semiconductor packages of claim 1 , wherein the third conductive elements are solder balls.
Claim 6
Dependent Claim
24 words
The module device of stacked semiconductor packages of claim 1 , wherein the second semiconductor package is a BGA (ball grid array) semiconductor package.
Claim 7
Dependent Claim
20 words
The module device of stacked semiconductor packages of claim 1 , wherein the circuit board is a multi-layered circuit board.
Claim 8
Dependent Claim
44 words
The module device of stacked semiconductor packages of claim 6 , wherein a plurality of electrical contacts and conductive traces are formed on the top and bottom surfaces of the circuit board, and a plurality of conductive vias are formed through the circuit board.
Claim 9
Independent Claim
212 words
A method for fabricating a module device of stacked semiconductor packages, comprising the steps of: (1) preparing a chip carrier and mounting at least a chip on the chip carrier, allowing the chip to be electrically connected to the chip carrier by a plurality of first conductive elements; (2) providing a circuit board having a top surface and a bottom surface, and formed a plurality of second conductive elements on the bottom surface of the circuit board; (3) mounting the circuit board above the chip carrier incorporated with the chip, and electrically connecting the circuit board to the chip carrier by the second conductive elements; (4) forming an encapsulant between the chip carrier and the circuit board for encapsulating the chip and the first and second conductive elements, such that the encapsulant is flush with the top surface of the circuit board, allowing the top surface of the circuit board to be exposed to outside of the encapsulant, so as to fabricate a first semiconductor package; (5) mounting a plurality of third conductive elements on the chip carrier, for electrically connecting the first semiconductor package to an external device; and (6) electrically connecting at least a second semiconductor package to the top surface of the circuit board of the first semiconductor package.
Claim 10
Independent Claim
212 words
A method for fabricating a module device of stacked semiconductor packages, comprising the steps of: (1) preparing a chip carrier and mounting at least a chip on the chip carrier, allowing the chip to be electrically connected to the chip carrier by a plurality of first conductive elements; (2) providing a circuit board having a top surface and a bottom surface, and formed a plurality of second conductive elements on the bottom surface of the circuit board; (3) mounting the circuit board above the chip carrier incorporated with the chip, and electrically connecting the circuit board to the chip carrier by the second conductive elements; (4) forming an encapsulant between the chip carrier and the circuit board for encapsulating the chip and the first and second conductive elements, such that the encapsulant is flush with the top surface of the circuit board, allowing the top surface of the circuit board to be exposed to outside of the encapsulant, so as to fabricate a first semiconductor package; (5) mounting a plurality of third conductive elements on the chip carrier, for electrically connecting the first semiconductor package to an external device; and (6) electrically connecting at least a second semiconductor package to the top surface of the circuit board of the first semiconductor package.
Claim 11
Dependent Claim
36 words
The method for fabricating a module device of stacked semiconductor packages of claim 8 , wherein in the step (1), the first conductive elements are selected from the group consisting of bonding wires and solder bumps.
Claim 12
Dependent Claim
38 words
The method for fabricating a module device of stacked semiconductor packages of claim 8 , wherein in the step (2), the second conductive elements are selected from the group consisting of solder balls, solder bumps and metal pins.
Claim 13
Dependent Claim
27 words
The method for fabricating a module device of stacked semiconductor packages of claim 8 , wherein in the step (5), the third conductive elements are solder balls.
Claim 14
Dependent Claim
32 words
The method for fabricating a module device of stacked semiconductor packages of claim 8 , wherein in the step (6), the second semiconductor package is a BGA (ball grid array) semiconductor package.
Claim 15
Dependent Claim
28 words
The method for fabricating a module device of stacked semiconductor packages of claim 8 , wherein in the step (2), the circuit board is a double-layered circuit board.
Claim 16
Dependent Claim
52 words
The method for fabricating a module device of stacked semiconductor packages of claim 13 , wherein in the step (2), a plurality of electrical contacts and conductive traces are formed on the top and bottom surfaces of the circuit board, and a plurality of conductive vias are formed through the circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-12-07 | 2008-06-07 | 2008-12-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-12-07 | 2012-06-07 | 2012-12-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-12-07 | 2016-06-07 | 2016-12-07 | $7700.00 | Window Closed / Lapsed |