US6815739B2 — Radio frequency microelectromechanical systems (M…

Claim 1

Independent Claim 91 words

A radio frequency device compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, a second substrate comprised of a second plurality of LTCC layers forming a second circuit used in the operation of the device, and at least one microelectromechanical (“MEMS”) device between the first and second substrates, wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS device between the first and second substrates.

Claim 2

Dependent Claim 91 words

A radio frequency device compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, a second substrate comprised of a second plurality of LTCC layers forming a second circuit used in the operation of the device, and at least one microelectromechanical (“MEMS”) device between the first and second substrates, wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS device between the first and second substrates.

Claim 3

Dependent Claim 32 words

The radio frequency device recited in claim 1 , wherein the second substrate is bonded to the first substrate to form a hermetically sealed chamber containing the at least one MEMS device.

Claim 4

Dependent Claim 33 words

The radio frequency device recited in claim 1 further comprising a plurality of vertical interconnects extending through and interconnecting the first and second pluralities of LTCC layers comprising the first and second substrates.

Claim 5

Dependent Claim 37 words

The radio frequency device recited in claim 1 wherein the first plurality of LTCC layers comprising the first substrate includes a buffer layer that is a substrate on which the at least one MEMS device is fabricated.

Claim 6

Dependent Claim 21 words

The radio frequency device recited in claim 1 further comprising at least one integrated circuit (“IC”) bonded to the first substrate.

Claim 7

Dependent Claim 33 words

The radio frequency device recited in claim 5 wherein the first plurality of LTCC layers includes an interconnect layer through which the at least one integrated circuit is connected to the first substrate.

Claim 8

Dependent Claim 22 words

The radio frequency device recited in claim 1 further comprising a plurality of discrete components buried-in the first plurality of LTCC layers.

Claim 9

Dependent Claim 21 words

The radio frequency device recited in claim 7 wherein the plurality of buried-in discrete components includes components resistors, capacitors and/or inductors.

Claim 10

Dependent Claim 36 words

The radio frequency device recited in claim 1 wherein the first and second pluralities of LTCC layers each include at least one passive microwave device selected from the group consisting of transmission lines, couplers and dividers.

Claim 11

Dependent Claim 35 words

The radio frequency device recited in claim 5 wherein the first plurality of LTCC layers includes a cavity in which the at least one integrated circuit is bonded to the first plurality of LTCC layers.

Claim 12

Dependent Claim 31 words

The radio frequency device recited in claim 5 wherein the at least one integrated circuit includes at least one circuit from the group consisting of low-frequency analog/digital ICs, MMICS, and RFICs.

Claim 13

Dependent Claim 62 words

The radio frequency device recited in claim 5 wherein the at least one integrated circuit includes at least one circuit from the group consisting of a control circuit for the MEMS device, a power module for the MEMS device, a microprocessor, a signal processor, a high frequency power amplifier, a high frequency low noise amplifier, and high frequency up and down converters.

Claim 14

Dependent Claim 45 words

The radio frequency device recited in claim 5 wherein the second plurality of LTCC layers further comprises includes a ground shielding extending through the second plurality of LTCC layers to shield the at least one MEMS device or IC from radiating components in other layers.

Claim 15

Dependent Claim 27 words

The radio frequency device recited in claim 1 wherein the first and second pluralities of LTCC layers include ground planes for shielding the first and second circuits.

Claim 16

Dependent Claim 19 words

The radio frequency device recited in claim 4 wherein the buffer layer is comprised of a plurality of layers.

Claim 17

Dependent Claim 30 words

The radio frequency device recited in claim 5 wherein the integrated circuits are flip-chip bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 18

Dependent Claim 29 words

The radio frequency device recited in claim 5 wherein the integrated circuits are wire-bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 19

Dependent Claim 30 words

The radio frequency device recited in claim 5 wherein the integrated circuits are flip-chip bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 20

Dependent Claim 29 words

The radio frequency device recited in claim 5 wherein the integrated circuits are wire-bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 21

Dependent Claim 99 words

A radio frequency system compromising: at least one microelectromechanical (“MEMS”) device, at least a first plurality of LTCC layers forming at least one first circuit used in the operation of the MEMS device, at least a second plurality of LTCC layers forming at least one second circuit used in the operation of the MEMS device, the MEMS device being formed between the first and second pluralities of LTCC layers, the second plurality of LTCC layers being bonded to the first plurality of LTCC layers whereby the MEMS device is enclosed between the first and second pluralities of LTCC layers.

Claim 22

Dependent Claim 99 words

A radio frequency system compromising: at least one microelectromechanical (“MEMS”) device, at least a first plurality of LTCC layers forming at least one first circuit used in the operation of the MEMS device, at least a second plurality of LTCC layers forming at least one second circuit used in the operation of the MEMS device, the MEMS device being formed between the first and second pluralities of LTCC layers, the second plurality of LTCC layers being bonded to the first plurality of LTCC layers whereby the MEMS device is enclosed between the first and second pluralities of LTCC layers.

Claim 23

Dependent Claim 37 words

The radio frequency system recited in claim 20 wherein the second plurality of LTCC layers is bonded to the first plurality of LTCC layers to form a hermetically sealed chamber containing the at least one MEMS device.

Claim 24

Dependent Claim 34 words

The radio frequency system recited in claim 20 wherein the first plurality of LTCC layers includes a buffer layer that serves as a substrate on which the at least one MEMS device is fabricated.

Claim 25

Dependent Claim 23 words

The radio frequency system recited in claim 20 further comprising at least one integrated circuit bonded to the first plurality of LTCC layers.

Claim 26

Dependent Claim 32 words

The radio frequency system recited in claim 23 further comprising a plurality of integrated circuits including at least one circuit selected from the group consisting of low-frequency analog/digital ICs, MMICs, and RFICs.

Claim 27

Dependent Claim 59 words

The radio frequency system recited in claim 23 further comprising a plurality of integrated circuits including at least one circuit selected from the group consisting of a control circuit for the MEMS device, a power module for the MEMS device, a microprocessor, a signal processor, a high frequency power amplifier, a high frequency low noise amplifier, high frequency down-converters.

Claim 28

Dependent Claim 100 words

A MEMS device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a layer between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch forming at least one phase-shifter, the second ceramic module being bonded to the first ceramic module to thereby form a cavity in which the MEMS switch is located.

Claim 29

Dependent Claim 100 words

A MEMS device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a layer between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch forming at least one phase-shifter, the second ceramic module being bonded to the first ceramic module to thereby form a cavity in which the MEMS switch is located.

Claim 30

Dependent Claim 17 words

The MEMS device of claim 26 , wherein the ceramic modules are formed using an LTCC process.

Claim 31

Dependent Claim 17 words

The MEMS device of claim 26 , wherein the ceramic modules are formed using an HTCC process.

Claim 32

Dependent Claim 17 words

The MEMS device of claim 27 , wherein the ceramic modules are formed from 943 Green Tape™.

Claim 33

Dependent Claim 120 words

A MEMS device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one first circuit layer and the buffer layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, a plurality of radiation layers, and a plurality of interconnections between the second circuit layer, cover layer, and radiation layers; and a layer between the first and second ceramic modules including at least one microelectromechanical switch forming at least one phase-shifter.

Claim 34

Dependent Claim 120 words

A MEMS device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one first circuit layer and the buffer layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, a plurality of radiation layers, and a plurality of interconnections between the second circuit layer, cover layer, and radiation layers; and a layer between the first and second ceramic modules including at least one microelectromechanical switch forming at least one phase-shifter.

Claim 35

Dependent Claim 50 words

The MEMS device of claim 30 further comprising a plurality of integrated circuits mounted on the first ceramic module, and wherein the first plurality of dielectric layers further includes a plurality of interconnecting layers for connecting the integrated circuits to the dielectric layers forming the first and second ceramic modules.

Claim 36

Dependent Claim 17 words

The MEMS device of claim 30 , wherein the ceramic modules are formed using an LTCC process.

Claim 37

Dependent Claim 17 words

The MEMS device of claim 30 , wherein the ceramic modules are formed using an HTCC process.

Claim 38

Dependent Claim 150 words

A MEMS device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a layer between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch, the second ceramic module being bonded to the first ceramic module, to thereby form a cavity in which the MEMS switch is located, a plurality of integrated circuits mounted on the first ceramic module, a plurality of interconnecting layers extending through the first plurality of dielectric layers for connecting the integrated circuits to the dielectric layers forming the first and second ceramic modules, and a plurality of discrete components buried-in the first and second pluralities of dielectric layers.

Claim 39

Dependent Claim 150 words

A MEMS device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a layer between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch, the second ceramic module being bonded to the first ceramic module, to thereby form a cavity in which the MEMS switch is located, a plurality of integrated circuits mounted on the first ceramic module, a plurality of interconnecting layers extending through the first plurality of dielectric layers for connecting the integrated circuits to the dielectric layers forming the first and second ceramic modules, and a plurality of discrete components buried-in the first and second pluralities of dielectric layers.

Claim 40

Dependent Claim 17 words

The MEMS device of claim 34 , wherein the ceramic modules are formed using an LTCC process.

Claim 41

Dependent Claim 17 words

The MEMS device of claim 35 , wherein the ceramic modules are formed from 943 Green Tape™.

Claim 42

Dependent Claim 17 words

The MEMS device of claim 34 , wherein the ceramic modules are formed using an HTCC process.

Claim 43

Dependent Claim 110 words

An electrical device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one circuit layer and the buffer layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, and a plurality of interconnections between the second circuit layer and the cover layer; and a layer formed between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch.

Claim 44

Dependent Claim 110 words

An electrical device comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one circuit layer and the buffer layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, and a plurality of interconnections between the second circuit layer and the cover layer; and a layer formed between the first and second ceramic modules including at least one microelectromechanical (“MEMS”) switch.

Claim 45

Dependent Claim 45 words

The electrical device of claim 38 further comprising a plurality of integrated circuits mounted on the first ceramic module, the first plurality of dielectric layers further including interconnecting layers for connecting the integrated circuits to the dielectric layers forming the first and second ceramic modules.

Claim 46

Dependent Claim 30 words

The electrical device recited in claim 39 wherein the plurality of integrated circuits includes at least one circuit selected from the group consisting of low-frequency analog/digital ICs, MMICs, and RFICs.

Claim 47

Dependent Claim 58 words

The electrical device recited in claim 39 wherein the plurality of integrated circuits includes at least one circuit selected from the group consisting of a control circuit for the electrical device, a power module for the electrical device, a microprocessor, a signal processor, a high frequency power amplifier, a high frequency low noise amplifier, a high frequency down-converter.

Claim 48

Dependent Claim 17 words

The electrical device of claim 38 , wherein the ceramic modules are formed using an LTCC process.

Claim 49

Dependent Claim 17 words

The electrical device of claim 38 , wherein the ceramic modules are formed using an HTCC process.

Claim 50

Dependent Claim 69 words

A radio frequency device compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers, a second substrate comprised of a second plurality of LTCC layers, and at least one microelectromechanical (“MEMS”) device between the first and second substrates, wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS device between the first and second substrates.

Claim 51

Dependent Claim 69 words

A radio frequency device compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers, a second substrate comprised of a second plurality of LTCC layers, and at least one microelectromechanical (“MEMS”) device between the first and second substrates, wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS device between the first and second substrates.

Claim 52

Dependent Claim 16 words

The radio frequency device as recited in claim 44 wherein said device is a tunable capacitor.

Claim 53

Dependent Claim 15 words

The radio frequency device as recited in claim 44 wherein said device is an attenuator.

Claim 54

Dependent Claim 15 words

The radio frequency device as recited in claim 44 wherein said device is a filter.

Claim 55

Dependent Claim 16 words

The radio frequency device as recited in claim 44 wherein said device is a reconfigurable antenna.

Claim 56

Dependent Claim 17 words

The radio frequency device as recited in claim 44 wherein said device is a reconfigurable power amplifier.

Claim 57

Dependent Claim 16 words

The radio frequency device as recited in claim 44 wherein said device is a low-noise amplifier.

Claim 58

Dependent Claim 17 words

The radio frequency device as recited in claim 44 wherein said device is a variable controlled oscillator.

Claim 59

Dependent Claim 15 words

The radio frequency device as recited in claim 44 wherein said device is a mixer.

Claim 60

Dependent Claim 16 words

The radio frequency device as recited in claim 44 wherein said device is a variable capacitor.

Claim 61

Dependent Claim 17 words

The MEMS device of claim 27 , wherein the ceramic modules are formed from 951 Green Tape™.

Claim 62

Dependent Claim 17 words

The MEMS device of claim 35 , wherein the ceramic modules are formed from 951 Green Tape™.

Claim 63

Independent Claim 102 words

A device which operates at radio frequencies compromising: at least one microelectromechanical (“MEMS”) variable capacitor, a first substrate on which the MEMS variable capacitor is fabricated, the first substrate being comprised of a first plurality of tow-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, and a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device; and wherein the second substrate is bonded to the first substrate so as to enclose the MEMS variable capacitor between the first and second substrates.

Claim 64

Independent Claim 102 words

A device which operates at radio frequencies compromising: at least one microelectromechanical (“MEMS”) variable capacitor, a first substrate on which the MEMS variable capacitor is fabricated, the first substrate being comprised of a first plurality of tow-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, and a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device; and wherein the second substrate is bonded to the first substrate so as to enclose the MEMS variable capacitor between the first and second substrates.

Claim 65

Dependent Claim 27 words

The device recited in claim 56 wherein the second substrate is bonded to the first substrate to form a hermetically sealed chamber containing the MEMS variable capacitor.

Claim 66

Dependent Claim 30 words

The device recited in claim 56 wherein the first and second pluralities of LTCC layers comprising the first and second substrates are interconnected by vertical interconnects extending through the layers.

Claim 67

Dependent Claim 34 words

The device recited in claim 56 wherein the first plurality of LTCC layers comprising the first substrate includes a buffer layer that serves as a substrate on which the MEMS variable capacitor is fabricated.

Claim 68

Dependent Claim 33 words

The device recited in claim 56 wherein the variable capacitor includes a movable electrode and wherein applied electrostatic actuation voltage deflects the movable electrode to thereby change the capacitance of the variable capacitor.

Claim 69

Dependent Claim 31 words

The device recited in claim 56 wherein the variable capacitor includes shaped electrodes whereby the relationship between the applied electrostatic actuation voltage and the capacitance of the variable capacitor is linear.

Claim 70

Dependent Claim 34 words

The device recited in claim 60 wherein the variable capacitor includes mechanical barriers to stop the deflection of the movable electrode at a predefined position to thereby set the tuning range of the device.

Claim 71

Dependent Claim 36 words

The device recited in claim 60 wherein the variable capacitor includes non-linear springs that provide a non-linear mechanical restoring force to the movable electrode so as to compensate for non-linearity in the applied electrostatic actuation voltage.

Claim 72

Dependent Claim 36 words

The device recited in claim 60 wherein the variable capacitor includes at least four electrodes so to provide for a two-port device and thereby de-couple the capacitance of the device from the actuation of said device.

Claim 73

Dependent Claim 18 words

The device recited in claim 56 further comprising at least one integrated circuit bonded to the first substrate.

Claim 74

Dependent Claim 31 words

The device recited in claim 65 wherein the first plurality of LTCC layers includes an interconnect layer through which the at least one integrated circuit is connected to the first substrate.

Claim 75

Dependent Claim 22 words

The device recited in claim 56 wherein the first plurality of LTCC layers includes a plurality of discrete components buried-in said layers.

Claim 76

Dependent Claim 29 words

The device recited in claim 67 wherein the first plurality of buried-in discrete components contains at least one component from the group consisting of is resistors, capacitors and inductors.

Claim 77

Dependent Claim 32 words

The device recited in claim 56 wherein the first and second pluralities of LTCC layers include at least one passive microwave device from the group consisting of transmission lines, couplers and dividers.

Claim 78

Dependent Claim 30 words

The device recited in claim 65 wherein the first plurality of LTCC layers includes a cavity in which the integrated circuits are bonded to the first plurality of LTCC layers.

Claim 79

Dependent Claim 26 words

The device recited in claim 70 wherein the integrated circuits include at least one circuit from a group consisting of low-frequency analog/digital ICs, MMICS, and RFICs.

Claim 80

Dependent Claim 56 words

The device recited in claim 70 wherein the integrated circuits include at least one circuit from a group consisting of a control circuit for the MEMS capacitor, a power module for the MEMS capacitor, a microprocessor, a signal processor, a high frequency power amplifier, a high frequency low noise amplifier, high frequency up and down converters.

Claim 81

Dependent Claim 34 words

The device recited in claim 65 wherein the second plurality of LTCC layers includes a ground shielding extending through said layers to shield the MEMS capacitor or IC from radiating components in other layers.

Claim 82

Dependent Claim 25 words

The device recited in claim 56 wherein the first and second pluralities of LTCC layers include ground planes for shielding the first and second circuits.

Claim 83

Dependent Claim 15 words

The device recited in claim 58 wherein the buffer layer is a plurality of layers.

Claim 84

Dependent Claim 28 words

The device recited in claim 70 wherein the integrated circuits are flip-chip bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 85

Dependent Claim 27 words

The device recited in claim 70 wherein the integrated circuits are wire-bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 86

Dependent Claim 28 words

The device recited in claim 70 wherein the integrated circuits are flip-chip bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 87

Dependent Claim 27 words

The device recited in claim 70 wherein the integrated circuits are wire-bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 88

Dependent Claim 30 words

The device recited in claim 70 wherein the integrated circuits are connected to the variable capacitor so as to provide electrical control and closed-loop control of the variable capacitor value.

Claim 89

Dependent Claim 87 words

A microelectromechanical variable capacitor device which operates at radio frequencies compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, and a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device; and wherein the second substrate is bonded to the first substrate so as to enclose the MEMS variable capacitor device between the first and second substrates.

Claim 90

Dependent Claim 87 words

A microelectromechanical variable capacitor device which operates at radio frequencies compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, and a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device; and wherein the second substrate is bonded to the first substrate so as to enclose the MEMS variable capacitor device between the first and second substrates.

Claim 91

Dependent Claim 29 words

The MEMS device recited in claim 81 wherein the second substrate is bonded to the first substrate to form a hermetically sealed chamber containing the MEMS variable capacitor device.

Claim 92

Dependent Claim 31 words

The MEMS device recited in claim 81 wherein the first and second pluralities of LTCC layers comprising the first and second substrates are interconnected by vertical interconnects extending through the layers.

Claim 93

Dependent Claim 37 words

The MEMS device recited in claim 81 wherein the first plurality of LTCC layers comprising the first substrate includes a buffer layer that serves as a substrate on which that the MEMS variable capacitor device is fabricated.

Claim 94

Dependent Claim 28 words

The MEMS device recited in claim 81 wherein the variable capacitor device employs electrostatic actuation to deflect the movable electrode and thereby change the capacitance of the device.

Claim 95

Dependent Claim 31 words

The MEMS device recited in claim 85 wherein the variable capacitor device employs electrodes that are shaped so as to linearize the applied electrostatic voltage versus capacitance relationship of the device.

Claim 96

Dependent Claim 36 words

The MEMS device recited in claim 81 wherein the variable capacitor device employs mechanical barriers to stop the deflection of the movable electrode at a predefined location and thereby set the tuning range of the device.

Claim 97

Dependent Claim 45 words

The MEMS device recited in claim 81 wherein the variable capacitor device uses non-linear springs so as to provide a non-linear mechanical restoring force to the movable electrode of the variable capacitor whereby the non-linear spring compensates for the non-linearity of the electrostatic actuation force.

Claim 98

Dependent Claim 38 words

The MEMS device recited in claim 81 wherein the variable capacitor device employs at least four electrodes so to provide for a two-port device and thereby de-couple the capacitance of the device from the actuation of said device.

Claim 99

Dependent Claim 21 words

The MEMS variable capacitor device recited in claim 81 further comprising at least one integrated circuit bonded to the first substrate.

Claim 100

Dependent Claim 34 words

The MEMS variable capacitor device recited in claim 90 wherein the first plurality of LTCC layers includes an interconnect layer through which the at least one integrated circuit is connected to the first substrate.

Claim 101

Dependent Claim 25 words

The MEMS variable capacitor device recited in claim 81 wherein the first plurality of LTCC layers includes a plurality of discrete components buried-in said layers.

Claim 102

Dependent Claim 33 words

The MEMS variable capacitor device recited in claim 92 wherein the first plurality of buried-in discrete components contains at least one component from the group consisting of is resistors, or capacitors and inductors.

Claim 103

Dependent Claim 35 words

The MEMS variable capacitor device recited in claim 92 wherein the first and second pluralities of LTCC layers include at least one passive microwave device from the group consisting of transmission lines, couplers and dividers.

Claim 104

Dependent Claim 33 words

The MEMS variable capacitor device recited in claim 92 wherein the first plurality of LTCC layers includes a cavity in which the integrated circuits are bonded to the first plurality of LTCC layers.

Claim 105

Dependent Claim 29 words

The MEMS variable capacitor device recited in claim 92 wherein the integrated circuits include at least one circuit from a group consisting of low-frequency analog/digital ICs, MMICS, and RFICs.

Claim 106

Dependent Claim 43 words

The MEMS variable capacitor device recited in claim 92 wherein the integrated circuits include at least one circuit from a group consisting of a control circuit for the MEMS variable capacitor device, a power module for the MEMS variable capacitor device, a microprocessor.

Claim 107

Dependent Claim 39 words

The MEMS variable capacitor device recited in claim 92 wherein the second plurality of LTCC layers includes a ground shielding extending through said layers to shield the variable capacitor MEMS device or IC from radiating components in other layers.

Claim 108

Dependent Claim 28 words

The MEMS variable capacitor device recited in claim 92 wherein the first and second pluralities of LTCC layers include ground planes for shielding the first and second circuits.

Claim 109

Dependent Claim 18 words

The MEMS variable capacitor device recited in claim 89 wherein the buffer layer is a plurality of layers.

Claim 110

Dependent Claim 31 words

The MEMS variable capacitor device recited in claim 91 wherein the integrated circuits are flip-chip bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 111

Dependent Claim 30 words

The MEMS variable capacitor device recited in claim 91 wherein the integrated circuits are wire-bonded to screen-printed surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 112

Dependent Claim 31 words

The MEMS variable capacitor device recited in claim 93 wherein the integrated circuits are flip-chip bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 113

Dependent Claim 30 words

The MEMS variable capacitor device recited in claim 93 wherein the integrated circuits are wire-bonded to photo-patterned surface metal patterns on a layer of the first plurality of LTCC layers.

Claim 114

Dependent Claim 26 words

The MEMS variable capacitor device recited in claim 81 wherein the capacitance of the device is adjusted by application of an electrical signal to said device.

Claim 115

Dependent Claim 16 words

The MEMS variable capacitor device recited in claim 105 wherein the variable capacitor is actuated electrostatically.

Claim 116

Dependent Claim 31 words

The MEMS variable capacitor device recited in claim 105 wherein the variable capacitor is electrostatically and zipper actuated so as to increase the tuning range of said MEMS variable capacitor device.

Claim 117

Dependent Claim 31 words

The MEMS device recited in claim 107 wherein the variable capacitor device includes electrodes that are shaped so as to linearize the applied electrostatic voltage versus capacitance relationship of the device.

Claim 118

Dependent Claim 36 words

The MEMS device recited in claim 107 wherein the variable capacitor device includes mechanical barriers to stop the deflection of the movable electrode at a predefined location and thereby set the tuning range of the device.

Claim 119

Dependent Claim 38 words

The MEMS device recited in claim 107 wherein the variable capacitor device includes at least four electrodes so to provide for a two-port device and thereby de-couples the capacitance of the device from the actuation of said device.

Claim 120

Dependent Claim 23 words

The MEMS variable capacitor device recited in claim 107 wherein the variable capacitor includes mechanical stops that prevent shorting of the capacitor electrodes.

Claim 121

Dependent Claim 112 words

A microelectromechanical (MEMS) tunable inductor device which operates at radio frequencies compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device; a plurality of radio frequency (“RF”) microelectromechanical switches fabricated on the first substrate, a network of parallel inductors also fabricated on the first substrate, and wherein the second substrate is bonded to the first substrate so as to enclose the RF MEMS switches and inductors between the first and second substrates.

Claim 122

Dependent Claim 112 words

A microelectromechanical (MEMS) tunable inductor device which operates at radio frequencies compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device, a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device; a plurality of radio frequency (“RF”) microelectromechanical switches fabricated on the first substrate, a network of parallel inductors also fabricated on the first substrate, and wherein the second substrate is bonded to the first substrate so as to enclose the RF MEMS switches and inductors between the first and second substrates.

Claim 123

Dependent Claim 31 words

The MEMS device recited in claim 112 wherein the second substrate is bonded to the first substrate to form a hermetically sealed chamber containing the plurality of MEMS switches and inductors.

Claim 124

Dependent Claim 31 words

The MEMS device recited in claim 112 wherein the first and second pluralities of LTCC layers comprising the first and second substrates are interconnected by vertical interconnects extending through the layers.

Claim 125

Dependent Claim 39 words

The MEMS device recited in claim 112 wherein the first plurality of LTCC layers comprising the first substrate includes a buffer layer that serves as a substrate on which a plurality of MEMS switches and inductors devices are fabricated.

Claim 126

Dependent Claim 31 words

The MEMS device recited in claim 112 wherein the plurality of MEMS switch devices are actuated by the application of an electrostatic voltage to select the desired inductor in the network.

Claim 127

Dependent Claim 130 words

A microelectromechanical systems (MEMS) tunable inductor-capacitor network device which operates at radio frequencies compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device or system, a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device, a plurality of RF microelectromechanical switches fabricated on the first substrate, a network of parallel inductor devices formed on the first substrate, and at least one variable capacitor device formed on the first substrate, wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS switches and inductor and capacitor devices between the first and second substrates.

Claim 128

Dependent Claim 130 words

A microelectromechanical systems (MEMS) tunable inductor-capacitor network device which operates at radio frequencies compromising: a first substrate comprised of a first plurality of low-temperature co-fired ceramic (“LTCC”) layers forming a first circuit used in the operation of the device or system, a second substrate comprised of a second plurality of LTCC layers forming at least a second circuit used in the operation of the device, a plurality of RF microelectromechanical switches fabricated on the first substrate, a network of parallel inductor devices formed on the first substrate, and at least one variable capacitor device formed on the first substrate, wherein the second substrate is bonded to the first substrate so as to enclose the at least one MEMS switches and inductor and capacitor devices between the first and second substrates.

Claim 129

Dependent Claim 33 words

The MEMS device recited in claim 117 wherein the second substrate is bonded to the first substrate to form a hermetically sealed chamber containing the plurality of MEMS switches and MEMS variable capacitors.

Claim 130

Dependent Claim 31 words

The MEMS device recited in claim 117 wherein the first and second pluralities of LTCC layers comprising the first and second substrates are interconnected by vertical interconnects extending through the layers.

Claim 131

Dependent Claim 39 words

The MEMS device recited in claim 117 wherein the first plurality of LTCC layers comprising the first substrate includes a buffer layer that serves as a substrate on which a plurality of MEMS switches and inductors devices are fabricated.

Claim 132

Dependent Claim 25 words

The MEMS device recited in claim 117 wherein the plurality of MEMS switch devices employ electrostatic actuation to select the desired inductor in the network.

Claim 133

Dependent Claim 26 words

The MEMS device recited in claim 117 wherein the plurality of MEMS variable capacitor devices employ electrostatic actuation to select the desired inductor in the network.

Claim 134

Dependent Claim 17 words

The MEMS device recited in claim 117 wherein the tunable inductor-capacitor network is used a tunable filter.

Claim 135

Dependent Claim 99 words

An array antenna comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a layer between the first and second ceramic modules including at least one microelectromechanical switch (“MEMS”) forming at least one phase-shifter, a second ceramic module being bonded to the first ceramic module and thereby forming a cavity on top of the MEMS switch.

Claim 136

Dependent Claim 99 words

An array antenna comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a layer between the first and second ceramic modules including at least one microelectromechanical switch (“MEMS”) forming at least one phase-shifter, a second ceramic module being bonded to the first ceramic module and thereby forming a cavity on top of the MEMS switch.

Claim 137

Dependent Claim 17 words

The array antenna of claim 124 , wherein the ceramic modules are formed using an LTCC process.

Claim 138

Dependent Claim 17 words

The array antenna of claim 124 , wherein the ceramic modules are formed using an HTCC process.

Claim 139

Dependent Claim 121 words

An array antenna comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one first circuit layer and the buffer layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, a plurality of radiation layers, and a plurality of interconnections between the second circuit layer, cover layer, and radiation layers; and a layer between the first and second ceramic modules including at least one microelectromechanical switch (“MEMS”) forming at least one phase-shifter.

Claim 140

Dependent Claim 121 words

An array antenna comprising: a first ceramic module formed from of a first plurality of dielectric layers, the first plurality of dielectric layers including at least one first circuit layer, a buffer layer, and a plurality of interconnections between the at least one first circuit layer and the buffer layer; a second ceramic module formed from of a second plurality of dielectric layers, the second plurality of dielectric layers including at least one second circuit layer, a cover layer, a plurality of radiation layers, and a plurality of interconnections between the second circuit layer, cover layer, and radiation layers; and a layer between the first and second ceramic modules including at least one microelectromechanical switch (“MEMS”) forming at least one phase-shifter.

Claim 141

Dependent Claim 45 words

The array antenna of claim 127 further comprising a plurality of integrated circuits mounted on the first ceramic module, the first plurality of dielectric layers further including interconnecting layers for connecting the integrated circuits to the dielectric layers forming the first and second ceramic modules.

Claim 142

Dependent Claim 17 words

The array antenna of claim 127 , wherein the ceramic modules are formed using an LTCC process.

Claim 143

Dependent Claim 17 words

The array antenna of claim 127 , wherein the ceramic modules are formed using an HTCC process.

Claim 144

Dependent Claim 118 words

A radio frequency system compromising: a plurality of modules formed on a low-temperature co-fired ceramic (“LTCC”) wafer, each of the modules including: at least one microelectromechanical (“MEMS”) device, at least a first plurality of LTCC layers forming at least one first circuit used in the operation of the MEMS device, and at least a second plurality of LTCC layers forming at least one second circuit used in the operation of the MEMS device, Wherein the MEMS device is formed between the first and second plurality of LTCC layers, the second plurality of LTCC layers being bonded to the first plurality of LTCC layers whereby the MEMS device is enclosed between the first and second pluralities of LTCC layers.

Claim 145

Dependent Claim 118 words

A radio frequency system compromising: a plurality of modules formed on a low-temperature co-fired ceramic (“LTCC”) wafer, each of the modules including: at least one microelectromechanical (“MEMS”) device, at least a first plurality of LTCC layers forming at least one first circuit used in the operation of the MEMS device, and at least a second plurality of LTCC layers forming at least one second circuit used in the operation of the MEMS device, Wherein the MEMS device is formed between the first and second plurality of LTCC layers, the second plurality of LTCC layers being bonded to the first plurality of LTCC layers whereby the MEMS device is enclosed between the first and second pluralities of LTCC layers.

Claim 146

Dependent Claim 17 words

The MEMS device of claim 32 , wherein the ceramic modules are formed from 943 Green Tape™.

Claim 147

Dependent Claim 17 words

The MEMS device of claim 32 , wherein the ceramic modules are formed from 951 Green Tape™.

Claim 148

Dependent Claim 17 words

The MEMS device of claim 42 , wherein the ceramic modules are formed from 943 Green Tape™.

Claim 149

Dependent Claim 17 words

The MEMS device of claim 42 , wherein the ceramic modules are formed from 951 Green Tape™.

Claim 150

Dependent Claim 17 words

The MEMS device of claim 125 , wherein the ceramic modules are formed from 943 Green Tape™.

Claim 151

Dependent Claim 17 words

The MEMS device of claim 125 , wherein the ceramic modules are formed from 951 Green Tape™.

Claim 152

Dependent Claim 17 words

The MEMS device of claim 129 , wherein the ceramic modules are formed from 943 Green Tape™.

Claim 153

Dependent Claim 17 words

The MEMS device of claim 129 , wherein the ceramic modules are formed from 951 Green Tape™.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2007-11-09	2008-05-10	2008-11-09	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2011-11-09	2012-05-10	2012-11-09	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2015-11-09	2016-05-10	2016-11-09	$7700.00	Window Closed / Lapsed

Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates

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