Patent US6781226B2 successfully refreshed from Google Patents.
US6781226B2
Expired / Lapsed
US
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Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
Assignee: Arbor Global Strategies LLC
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Filing: 2003-06-02
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Granted: 2004-08-24
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Expires: 2023-06-02
Abstract
Abstract A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
Inventors
- 👤 Jon M. Huppenthal
- 👤 D. James Guzy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:26
CPC Classifications
G; G06; G06F; G06F15/00; G06F15/76; G06F15/78; G06F15/7867; H; H10; H10B; H10B10/00; H10B20/00; H10W; H10W72/00; H10W72/30; H10W90/00; Y; Y10; Y10S; Y10S257/00; Y10S257/922
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
67 words
A processor module comprising: at least one field programmable gate array integrated circuit die element including a programmable array; and at least one microprocessor integrated circuit die element stacked with and electrically coupled to said programmable array of said at least one field programmable gate array integrated circuit die element, such that processing of data shared between the microprocessor and the field programmable gate array is accelerated.
Claim 2
Dependent Claim
67 words
A processor module comprising: at least one field programmable gate array integrated circuit die element including a programmable array; and at least one microprocessor integrated circuit die element stacked with and electrically coupled to said programmable array of said at least one field programmable gate array integrated circuit die element, such that processing of data shared between the microprocessor and the field programmable gate array is accelerated.
Claim 3
Dependent Claim
42 words
The processor module of claim 1 further comprising: at least one memory integrated circuit die element stacked with and electrically coupled to either said at least one of field programmable gate array or said at least one microprocessor integrated circuit die elements.
Claim 4
Dependent Claim
16 words
The processor module of claim 1 wherein said programmable array is configurable as a processing element.
Claim 5
Dependent Claim
42 words
The processor module of claim 1 wherein said at least one field programmable gate array and said at least one microprocessor integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements.
Claim 6
Dependent Claim
18 words
The processor module of claim 4 wherein said contact points traverse said die elements through a thickness thereof.
Claim 7
Dependent Claim
27 words
The processor module of claim 5 wherein said die elements are thinned to a point at which said contact points traverse said thickness of said die elements.
Claim 8
Dependent Claim
88 words
A processor module comprising: at least one field programmable gate array integrated circuit die element including a programmable array; and, at least one microprocessor integrated circuit die element stacked with and electrically coupled to said programmable array of said at least one field programmable gate array integrated circuit die element, the at least one field programmable gate array integrated circuit die element being configured to provide test stimulus to the at least one microprocessor integrated circuit die element during manufacture and prior to completion of the module packaging.
Claim 9
Dependent Claim
88 words
A processor module comprising: at least one field programmable gate array integrated circuit die element including a programmable array; and, at least one microprocessor integrated circuit die element stacked with and electrically coupled to said programmable array of said at least one field programmable gate array integrated circuit die element, the at least one field programmable gate array integrated circuit die element being configured to provide test stimulus to the at least one microprocessor integrated circuit die element during manufacture and prior to completion of the module packaging.
Claim 10
Dependent Claim
37 words
The processor module of claim 7 further comprising: at least one memory integrated circuit die element stacked with and electrically coupled to either said at least one field programmable gate array or microprocessor integrated circuit die elements.
Claim 11
Dependent Claim
16 words
The processor module of claim 7 wherein said programmable array is configurable as a processing element.
Claim 12
Dependent Claim
42 words
The processor module of claim 7 wherein said at least one field programmable gate array and said at least one microprocessor integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements.
Claim 13
Dependent Claim
18 words
The processor module of claim 10 wherein said contact points traverse said die elements through a thickness thereof.
Claim 14
Dependent Claim
27 words
The processor module of claim 11 wherein said die elements are thinned to a point at which said contact points traverse said thickness of said die elements.
Claim 15
Dependent Claim
87 words
A processor module comprising: at least a first integrated circuit die element including a programmable array; at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element; at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively; and means for reconfiguring the programmable array within one clock cycle.
Claim 16
Dependent Claim
87 words
A processor module comprising: at least a first integrated circuit die element including a programmable array; at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element; at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively; and means for reconfiguring the programmable array within one clock cycle.
Claim 17
Dependent Claim
16 words
The processor module of claim 13 wherein the reconfiguring means comprises a wide configuration data port.
Claim 18
Dependent Claim
23 words
The processor module of claim 13 wherein said programmable array of said first integrated circuit die element comprises a field programmable gate array.
Claim 19
Dependent Claim
19 words
The processor module of claim 13 wherein said processor of said second integrated circuit die element comprises a microprocessor.
Claim 20
Dependent Claim
20 words
The processor module of claim 13 wherein said memory of said third integrated circuit die element comprises a memory array.
Claim 21
Dependent Claim
16 words
The processor module of claim 13 wherein said programmable array is configurable as a processing element.
Claim 22
Dependent Claim
33 words
The processor module of claim 13 wherein said first, second and third integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements.
Claim 23
Dependent Claim
18 words
The processor module of claim 19 wherein said contact points traverse said die elements through a thickness thereof.
Claim 24
Dependent Claim
27 words
The processor module of claim 20 wherein said die elements are thinned to a point at which said contact points traverse said thickness of said die elements.
Claim 25
Dependent Claim
97 words
A processor module comprising: at least a first integrated circuit die element including a programmable array and a plurality of configuration logic cells; at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element; at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively; and means for updating the plurality of configuration logic cells within one clock cycle.
Claim 26
Dependent Claim
97 words
A processor module comprising: at least a first integrated circuit die element including a programmable array and a plurality of configuration logic cells; at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element; at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively; and means for updating the plurality of configuration logic cells within one clock cycle.
Claim 27
Dependent Claim
16 words
The processor module of claim 22 wherein the updating means comprises a wide configuration data port.
Claim 28
Dependent Claim
23 words
The processor module of claim 22 wherein said programmable array of said first integrated circuit die element comprises a field programmable gate array.
Claim 29
Dependent Claim
19 words
The processor module of claim 22 wherein said processor of said second integrated circuit die element comprises a microprocessor.
Claim 30
Dependent Claim
20 words
The processor module of claim 22 wherein said memory of said third integrated circuit die element comprises a memory array.
Claim 31
Dependent Claim
16 words
The processor module of claim 22 wherein said programmable array is configurable as a processing element.
Claim 32
Dependent Claim
33 words
The processor module of claim 22 wherein said first, second and third integrated circuit die elements are electrically coupled by a number of contact points distributed throughout the surfaces of said die elements.
Claim 33
Dependent Claim
18 words
The processor module of claim 28 wherein said contact points traverse said die elements through a thickness thereof.
Claim 34
Dependent Claim
27 words
The processor module of claim 29 wherein said die elements are thinned to a point at which said contact points traverse said thickness of said die elements.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-08-24 | 2008-02-23 | 2008-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-08-24 | 2012-02-23 | 2012-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-08-24 | 2016-02-23 | 2016-08-24 | $7700.00 | Window Closed / Lapsed |