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US6756671B2
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Microelectronic device with a redistribution layer having a step shaped portion and method of making the same
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 2002-07-05
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Granted: 2004-06-29
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Expires: 2022-07-05
Abstract
Abstract A method of making a microelectronic device providing a base substrate having a bond pad, a first passivation layer overlying the base substrate and a portion of the bond pad, and a second passivation layer overlying the first passivation layer; forming a first sacrificial layer over the second passivation layer, wherein the first sacrificial layer includes an opening therethrough; etching the exposed portion of the second passivation layer to provide a recess therein; trimming a portion of the first sacrificial layer to enlarge the opening; etching the exposed portion of the second passivation layer to provide an enlarged recess and a first riser, a second tread, a second riser and a second tread; removing the first sacrificial layer; depositing a redistribution layer into the enlarged recess in the second passivation layer and over the first riser, first tread, second riser, and second tread.
Inventors
- 👤 Chu-Sheng Lee
- 👤 Chu-We Hu
- 👤 Yu-Lung Yeh
- 👤 Sheng-Hung Chou
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 07:34
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W20/00; H10W20/01; H10W20/071; H10W20/081; H10W20/082; H10W20/40; H10W20/41; H10W20/42; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/62; H10W70/65; H10W72/251; H10W72/29; H10W72/90; H10W72/931; H10W72/934; H10W72/941; H10W72/9415; H10W72/942
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
131 words
A microelectronic device comprising: a base substrate having a bond pad; an electrically conductive redistribution layer having a first portion electrically connected to the bond pad and having a first staircase shaped portion adjacent from the bond pad, and wherein the first staircase shaped portion of the redistribution layer includes at, least a first, second and third step and the wherein each of the first, second and third stop includes a riser and a tread, the trend of each step being vertically displaced from the tread of each of the other steps in the first staircase shaped portion, and an electrically conductive bump electrically connected to a second portion of the redistribution layer, the second portion of the redistribution layer is vertically displaced from the first portion of the redistribution layer.
Claim 2
Dependent Claim
131 words
A microelectronic device comprising: a base substrate having a bond pad; an electrically conductive redistribution layer having a first portion electrically connected to the bond pad and having a first staircase shaped portion adjacent from the bond pad, and wherein the first staircase shaped portion of the redistribution layer includes at, least a first, second and third step and the wherein each of the first, second and third stop includes a riser and a tread, the trend of each step being vertically displaced from the tread of each of the other steps in the first staircase shaped portion, and an electrically conductive bump electrically connected to a second portion of the redistribution layer, the second portion of the redistribution layer is vertically displaced from the first portion of the redistribution layer.
Claim 3
Dependent Claim
96 words
A microelectronic device as set forth in claim 1 further comprising a passivation layer overlying the base substrate and an opening formed in the passivation layer defined at least in part by a side wall having a second staircase shaped portion formed therein comprising at least a fourth and a fifth step immediately adjacent each other and wherein each of the fourth and fifth step comprises a riser and a tread, the trend of each step of the second staircase portion being vertically displaced from the tread of each other step in the second staircases portion.
Claim 4
Dependent Claim
18 words
A microelectronic device as set forth in claim 2 wherein the electrically conductive bump comprises a molder bump.
Claim 5
Dependent Claim
60 words
A microelectronic device as set forth in claim 2 wherein the second staircase portion further comprises a sixth step including a riser and a tread, and wherein the tread of the sixth step is vertically displaced from the tread of the fifth step, and wherein the redistribution layer includes a portion overlying the riser and tread of the sixth step.
Claim 6
Dependent Claim
29 words
A microelectronic device as set forth in claim 1 further comprising and under bump metallurgy interposed between the electrically conductive bump and the other portion of the redistribution layer.
Claim 7
Dependent Claim
18 words
A microelectronic device as set forth in claim 1 further comprising a passivation layer overlying the redistribution layer.
Claim 8
Dependent Claim
35 words
A microelectronic device as set forth in claim 6 wherein the passivation layer overlying the redistribution layer includes a recess therein, and further comprising a planarizing layer overlying the passivation layer overlying the redistribution layer.
Claim 9
Dependent Claim
24 words
A microelectronic device as set forth in claim 7 further comprising an electrically conductive bump electrically connected to another portion of the redistribution layer.
Claim 10
Dependent Claim
47 words
A microelectronic device as set forth in claim 8 further comprising an under bump metallurgy interposed between the electrically conductive bump and the other portion of the redistribution layer and the under bump metallurgy extending through the planarizing layer and the passivation layer overlying the redistribution layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-06-29 | 2007-12-29 | 2008-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-06-29 | 2011-12-29 | 2012-06-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-06-29 | 2015-12-29 | 2016-06-29 | $7700.00 | Window Closed / Lapsed |