Patent US6751781B2 successfully refreshed from Google Patents.
US6751781B2
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Thermal data automatic service system
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2002-01-18
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Granted: 2004-06-15
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Expires: 2022-01-18
Abstract
Abstract An internet thermal data analysis system comprises a processing unit to process an information sent by a user via a network, wherein the information comprises a package information. A job database is coupled to the processing unit to store the package information sent by the user, a thermal analysis module is coupled to the processing unit to analysis the information sent by the user. A thermal data report generator is coupled to the processing unit to generate a thermal data simulation in accordance with the information sent by the user. A forwarding module is responsive to the thermal data report generator to forward the thermal data simulation to the user.
Inventors
- 👤 I-Liang Lin
- 👤 Chun-Min Chuang
- 👤 Yung-I Yeh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 10:01
CPC Classifications
G; G06; G06F; G06F30/00; G06F30/20; G06F30/23; G06F2111/00; G06F2111/02
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
131 words
An Internet thermal data analysis system comprising: user end interface to retrieve requests of package parameters from a far-end user requesting thermal package analysis via a network; a storage media; a job database containing several job forms and providing at least one of said job forms for the far-end user to input said package parameters; a thermal analysis module containing at least one application software to analyze said package parameters; a package parameter database having package related data stored therein; a process unit access package parameters, said package related data and executing said application software, so as to generate a thermal data simulation report based on said package data; and a file transfer software responsive to thermal data simulation report and forwarding said thermal data simulation report to said far-end user.
Claim 2
Dependent Claim
131 words
An Internet thermal data analysis system comprising: user end interface to retrieve requests of package parameters from a far-end user requesting thermal package analysis via a network; a storage media; a job database containing several job forms and providing at least one of said job forms for the far-end user to input said package parameters; a thermal analysis module containing at least one application software to analyze said package parameters; a package parameter database having package related data stored therein; a process unit access package parameters, said package related data and executing said application software, so as to generate a thermal data simulation report based on said package data; and a file transfer software responsive to thermal data simulation report and forwarding said thermal data simulation report to said far-end user.
Claim 3
Dependent Claim
52 words
The system of claim 1 , wherein said thermal data simulation report includes Θja={Tj−Ta}/P, wherein said Θja is a temperature variance from a junction temperature to an ambient temperature per unit power dissipation, said Tj indicates the junction temperature, said Ta indicates the ambient temperature and said P indicates the power dissipation.
Claim 4
Dependent Claim
56 words
The system of claim 1 , wherein said thermal data simulation report includes ψjt=(Tj−Tt)/P, wherein said ψjt is a temperature variance from a junction temperature to a package top center temperature per unit power dissipation, said Tt indicates the package top center temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
Claim 5
Dependent Claim
52 words
The system of claim 1 , wherein said thermal data simulation report includes ψjc=(Tj−Tc)/P, wherein said Θjc is a temperature variance from a junction temperature to a case temperature per unit power dissipation, said Tc indicates the case temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
Claim 6
Dependent Claim
28 words
The system of claim 1 , wherein said thermal data simulation report includes parameters of the percentage of heat dissipated from PCB (print circuit board) and package top.
Claim 7
Dependent Claim
52 words
The system of claim 1 , wherein said thermal data simulation report includes Θjc=(Tj−Tc)/P, wherein said Θjc is a temperature variance from a junction temperature to a case temperature per unit power dissipation, said Tc indicates the case temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
Claim 8
Independent Claim
74 words
A method for automatically providing thermal data of a semiconductor package comprising the steps of: inputting parameters that relates to a semiconductor package by a user; recording said parameters in a job database; retrieving an information from said job database; analyzing a thermal data of a package based on said parameters sent by said user; generating a thermal data simulation report; and forwarding said thermal data simulation report to said user through a network.
Claim 9
Independent Claim
74 words
A method for automatically providing thermal data of a semiconductor package comprising the steps of: inputting parameters that relates to a semiconductor package by a user; recording said parameters in a job database; retrieving an information from said job database; analyzing a thermal data of a package based on said parameters sent by said user; generating a thermal data simulation report; and forwarding said thermal data simulation report to said user through a network.
Claim 10
Dependent Claim
18 words
The method of claim 7 , wherein said thermal data simulation is analyzed by a thermal analysis module.
Claim 11
Dependent Claim
51 words
The method of claim 7 , wherein said thermal data simulation report includes Θja=(Tj−Ta)/P, said Θja is a temperature variance from a junction temperature to an ambient temperature per unit power dissipation, said Tj indicates the junction temperature, said Ta is the ambient temperature and said P indicates the power dissipation.
Claim 12
Dependent Claim
56 words
The method of claim 7 , wherein said thermal data simulation report includes ψjt=(Tj−Tt)/P, wherein said ψjt is a temperature variance from a junction temperature to a package top center temperature per unit power dissipation, said Tt indicates the package top center temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
Claim 13
Dependent Claim
52 words
The method of claim 7 , wherein said thermal data simulation report includes Θjc=(Tj−Tc)/P, wherein said Θjc is a temperature variance from a junction temperature to a case temperature per unit power dissipation, said Tc indicates the case temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
Claim 14
Dependent Claim
28 words
The method of claim 7 , wherein said thermal data simulation report includes parameters of the percentage of heat dissipated from PCB (print circuit board) and package top.
Claim 15
Dependent Claim
153 words
An Internet thermal data analysis system comprising: an user end interface to retrieve requests of package parameters from a far-end user requesting thermal package analysis via a network; a storage media; a job database containing several job forms and providing at least one of said job forms for the far-end user to input said package parameters; a thermal analysis module containing at least one application software to analyze said package parameters; a package parameter database having package related data stored therein; a process unit access package parameters, said package related data and executing said application software, so as to generate a thermal data simulation report based on said package data, said thermal data simulation report includes parameters of the percentage of heat dissipated from PCB (print circuit board) and package top; and a file transfer software responsive to said thermal data simulation report and forwarding said thermal data simulation to said far-end user.
Claim 16
Dependent Claim
153 words
An Internet thermal data analysis system comprising: an user end interface to retrieve requests of package parameters from a far-end user requesting thermal package analysis via a network; a storage media; a job database containing several job forms and providing at least one of said job forms for the far-end user to input said package parameters; a thermal analysis module containing at least one application software to analyze said package parameters; a package parameter database having package related data stored therein; a process unit access package parameters, said package related data and executing said application software, so as to generate a thermal data simulation report based on said package data, said thermal data simulation report includes parameters of the percentage of heat dissipated from PCB (print circuit board) and package top; and a file transfer software responsive to said thermal data simulation report and forwarding said thermal data simulation to said far-end user.
Claim 17
Dependent Claim
52 words
The system of claim 13 , wherein said thermal data simulation report includes Θja={Tj−Ta}/P, wherein said Θja is a temperature variance from a junction temperature to an ambient temperature per unit power dissipation, said Tj indicates the junction temperature, said Ta indicates the ambient temperature and said P indicates the power dissipation.
Claim 18
Dependent Claim
56 words
The system of claim 14 , wherein said thermal data simulation report includes ψjt=(Tj−Tt)/P, wherein said ψjt is a temperature variance from a junction temperature to a package top center temperature per unit power dissipation, said Tt indicates the package top center temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
Claim 19
Independent Claim
95 words
A method for automatically providing thermal data of a semiconductor package comprising the steps of: inputting parameters that relates to a semiconductor package by a user; recording said parameters in a job database; retrieving an information from said job database; analyzing a thermal data of a package based on said parameters sent by said user; generating a thermal data simulation report, said thermal data simulation report includes parameters of the percentage of heat dissipated from PCB (print circuit board) and package top; and forwarding said thermal data simulation report to said user through a network.
Claim 20
Independent Claim
95 words
A method for automatically providing thermal data of a semiconductor package comprising the steps of: inputting parameters that relates to a semiconductor package by a user; recording said parameters in a job database; retrieving an information from said job database; analyzing a thermal data of a package based on said parameters sent by said user; generating a thermal data simulation report, said thermal data simulation report includes parameters of the percentage of heat dissipated from PCB (print circuit board) and package top; and forwarding said thermal data simulation report to said user through a network.
Claim 21
Dependent Claim
18 words
The method of claim 16 , wherein said thermal data simulation is analyzed by a thermal analysis module.
Claim 22
Dependent Claim
52 words
The method of claim 16 , wherein said thermal data simulation report includes Θja=(Tj−Ta)/P, wherein said Θja is a temperature variance from a junction temperature to an ambient temperature per unit power dissipation, said Tj indicates the junction temperature, said Ta is the ambient temperature and said P indicates the power dissipation.
Claim 23
Dependent Claim
56 words
The method of claim 16 , wherein said thermal data simulation report includes ψjt=(Tj−Tt)/P, wherein said ψjt is a temperature variance from a junction temperature to a package top center temperature per unit power dissipation, said Tt indicates the package top center temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
Claim 24
Dependent Claim
52 words
The method of claim 16 , wherein said thermal data simulation report includes Θjc=(Tj−Tc)/P, wherein said Θjc is a temperature variance from a junction temperature to a case temperature per unit power dissipation, said Tc indicates the case temperature, said Tj indicates the junction temperature and said P indicates the power dissipation.
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