US6438504B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins
Assignee: NEC Corp
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Filing: 2001-03-28
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Granted: 2002-08-20
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Expires: 2021-03-28
Abstract
Abstract The thermal resistance of an entire semiconductor package with a semiconductor chip and radiation fins is calculated based on thermal resistance of resin between the semiconductor chip and case, thermal resistance of the radiation fins, and thermal resistance of three heat radiation paths in the semiconductor package. One of said three heat radiation paths is passing through the bottom surface of the case. The other of said three radiation paths is passing through the leadframe. The other of three radiation paths is passing through sides of the case other than the leadframe.
Inventors
- 👤 Kazuyuki Mikubo
- 👤 Sakae Kitajo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 11:23
CPC Classifications
G; G01; G01N; G01N25/00; G01N25/18; G01K; G01K7/00; G01K7/42; H; H10; H10W; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
106 words
A recording medium on which is stored a program for carrying out by computer a thermal resistance calculation method comprising the step of finding thermal resistance of a semiconductor package in which radiation fins are mounted on the surface of a case based on thermal resistance of a heat radiation path passing through the bottom surface of said case, thermal resistance of a heat radiation path passing through a leadframe, thermal resistance of a heat radiation path passing through sides of said case other than said leadframe, thermal resistance between a semiconductor chip and the surface of said case, and thermal resistance of said radiation fins.
Claim 2
Dependent Claim
106 words
A recording medium on which is stored a program for carrying out by computer a thermal resistance calculation method comprising the step of finding thermal resistance of a semiconductor package in which radiation fins are mounted on the surface of a case based on thermal resistance of a heat radiation path passing through the bottom surface of said case, thermal resistance of a heat radiation path passing through a leadframe, thermal resistance of a heat radiation path passing through sides of said case other than said leadframe, thermal resistance between a semiconductor chip and the surface of said case, and thermal resistance of said radiation fins.
Claim 3
Dependent Claim
81 words
A recording medium on which is stored a program for carrying out by computer a method of calculating thermal resistance of a semiconductor package accommodating a semiconductor chip within a case, and comprising the step of finding thermal resistance between said semiconductor chip and the surface of said case based on thermal conductivity of a material interposed between said semiconductor chip and the surface of said case and thermal conductivity of a material interposed between said semiconductor chip and a leadframe.
Claim 4
Dependent Claim
81 words
A recording medium on which is stored a program for carrying out by computer a method of calculating thermal resistance of a semiconductor package accommodating a semiconductor chip within a case, and comprising the step of finding thermal resistance between said semiconductor chip and the surface of said case based on thermal conductivity of a material interposed between said semiconductor chip and the surface of said case and thermal conductivity of a material interposed between said semiconductor chip and a leadframe.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-19 | 2006-02-18 | 2006-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-19 | 2010-02-18 | 2010-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-19 | 2014-02-18 | 2014-08-20 | $7700.00 | Window Closed / Lapsed |