US6744141B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked chip-size package type semiconductor device capable of being decreased in size
Assignee: NEC Electronics Corp
•
Filing: 2002-07-08
•
Granted: 2004-06-01
•
Expires: 2022-07-08
Abstract
Abstract In a semiconductor device including a substrate, a first semiconductor chip directly or indirectly on the substrate, and a second semiconductor chip located on the first semiconductor chip, the second semiconductor chip has a larger dimension than that of the first semiconductor chip.
Inventors
- 👤 Naoto Kimura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:54
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W90/00; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/20; H10W90/231; H10W90/291; H10W90/701; H10W90/731; H10W90/732; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
88 words
A semiconductor device comprising: a substrate; a first semiconductor chip directly or indirectly on said substrate; a second semiconductor chip located on said first semiconductor chip, said second semiconductor chip having a larger dimension than that of said first semiconductor chip; bonding wire connected between said first semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said second semiconductor chip; and an adhesive layer between said first and second semiconductor chips, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 2
Dependent Claim
88 words
A semiconductor device comprising: a substrate; a first semiconductor chip directly or indirectly on said substrate; a second semiconductor chip located on said first semiconductor chip, said second semiconductor chip having a larger dimension than that of said first semiconductor chip; bonding wire connected between said first semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said second semiconductor chip; and an adhesive layer between said first and second semiconductor chips, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 3
Dependent Claim
88 words
A semiconductor device comprising: a substrate; a first semiconductor chip directly or indirectly on said substrate; a second semiconductor chip located on said first semiconductor chip, said second semiconductor chip having a larger dimension than that of said first semiconductor chip; bonding wire connected between said first semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said second semiconductor chip; and an adhesive layer between said first and second semiconductor chips, said adhesive layer having a recess portion encapsulating said bonding wire.
Claim 4
Dependent Claim
88 words
A semiconductor device comprising: a substrate; a first semiconductor chip directly or indirectly on said substrate; a second semiconductor chip located on said first semiconductor chip, said second semiconductor chip having a larger dimension than that of said first semiconductor chip; bonding wire connected between said first semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said second semiconductor chip; and an adhesive layer between said first and second semiconductor chips, said adhesive layer having a recess portion encapsulating said bonding wire.
Claim 5
Dependent Claim
101 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, an upper one of said semiconductor chips being larger than a lower one of said semiconductor chips immediately lower than said upper one of said semiconductor chips; bonding wire connected between said lower one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said upper one of said semiconductor chips; and an adhesive layer provided on a back surface of said upper one of said semiconductor chips, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 6
Dependent Claim
101 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, an upper one of said semiconductor chips being larger than a lower one of said semiconductor chips immediately lower than said upper one of said semiconductor chips; bonding wire connected between said lower one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said upper one of said semiconductor chips; and an adhesive layer provided on a back surface of said upper one of said semiconductor chips, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 7
Dependent Claim
101 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, an upper one of said semiconductor chips being larger than a lower one of said semiconductor chips immediately lower than said upper one of said semiconductor chips; bonding wire connected between said lower one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said upper one of said semiconductor chips; and an adhesive layer provided on a back surface of said upper one of said semiconductor chips, said adhesive layer having a recess portion encapsulating said bonding wire.
Claim 8
Dependent Claim
101 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, an upper one of said semiconductor chips being larger than a lower one of said semiconductor chips immediately lower than said upper one of said semiconductor chips; bonding wire connected between said lower one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said upper one of said semiconductor chips; and an adhesive layer provided on a back surface of said upper one of said semiconductor chips, said adhesive layer having a recess portion encapsulating said bonding wire.
Claim 9
Dependent Claim
97 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, one of said semiconductor chips having the largest dimension being not the lowest one of said semiconductor chips; bonding wire connected between another of said semiconductor chips immediately lower than said one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said one of said semiconductor chips; and an adhesive layer provided on a back surface of said one of said semiconductor chips, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 10
Dependent Claim
97 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, one of said semiconductor chips having the largest dimension being not the lowest one of said semiconductor chips; bonding wire connected between another of said semiconductor chips immediately lower than said one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said one of said semiconductor chips; and an adhesive layer provided on a back surface of said one of said semiconductor chips, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 11
Dependent Claim
97 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, one of said semiconductor chips having the largest dimension being not the lowest one of said semiconductor chips; bonding wire connected between another of said semiconductor chips immediately lower than said one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said one of said semiconductor chips; and an adhesive layer provided on a back surface of said one of said semiconductor chips, said adhesive layer having a recess portion encapsulating said bonding wire.
Claim 12
Dependent Claim
97 words
A semiconductor device comprising: a substrate; a plurality of semiconductor chips stacked on said substrate, one of said semiconductor chips having the largest dimension being not the lowest one of said semiconductor chips; bonding wire connected between another of said semiconductor chips immediately lower than said one of said semiconductor chips and said substrate, wherein said bonding wire is located within a perimeter of said one of said semiconductor chips; and an adhesive layer provided on a back surface of said one of said semiconductor chips, said adhesive layer having a recess portion encapsulating said bonding wire.
Claim 13
Dependent Claim
100 words
A semiconductor device comprising: a substrate; n (n=2, 3, . . . ) semiconductor chips stacked on said substrate, wherein an i-th (i=2, . . . , n) one of said semiconductor chips is larger than an (i−1)-th one of said semiconductor chips immediately lower than said i-th semiconductor chip; bonding wire connected between said (i−1)-th semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said i-th semiconductor chip; and one adhesive layer between said i-th semiconductor chip and said (i−1)-th semiconductor chip, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 14
Dependent Claim
100 words
A semiconductor device comprising: a substrate; n (n=2, 3, . . . ) semiconductor chips stacked on said substrate, wherein an i-th (i=2, . . . , n) one of said semiconductor chips is larger than an (i−1)-th one of said semiconductor chips immediately lower than said i-th semiconductor chip; bonding wire connected between said (i−1)-th semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said i-th semiconductor chip; and one adhesive layer between said i-th semiconductor chip and said (i−1)-th semiconductor chip, said adhesive layer having a thin portion encapsulating said bonding wire.
Claim 15
Dependent Claim
100 words
A semiconductor device comprising: a substrate; n (n=2, 3, . . . ) semiconductor chips stacked on said substrate, wherein an i-th (i=2, . . . , n) one of said semiconductor chips is larger than an (i−1)-th one of said semiconductor chips immediately lower than said i-th semiconductor chip; bonding wire connected between said (i−1)-th semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said i-th semiconductor chip; and one adhesive layer between said i-th semiconductor chip and said (i−1)-th semiconductor chip, said adhesive layer having a recess portion encapsulating said bonding wire.
Claim 16
Dependent Claim
100 words
A semiconductor device comprising: a substrate; n (n=2, 3, . . . ) semiconductor chips stacked on said substrate, wherein an i-th (i=2, . . . , n) one of said semiconductor chips is larger than an (i−1)-th one of said semiconductor chips immediately lower than said i-th semiconductor chip; bonding wire connected between said (i−1)-th semiconductor chip and said substrate, wherein said bonding wire is located within a perimeter of said i-th semiconductor chip; and one adhesive layer between said i-th semiconductor chip and said (i−1)-th semiconductor chip, said adhesive layer having a recess portion encapsulating said bonding wire.
References Cited (Backward Citations)
JP2000307057A
Cited
US6353263B1
Cited
US20020004258A1
Cited
US6445594B1
Cited
US6337226B1
Cited
US20010035587A1
Cited
US6448659B1
Cited
US6531784B1
Cited
US6437449B1
Cited
US20030038374A1
Cited
US20030057539A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-06-01 | 2007-12-01 | 2008-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-06-01 | 2011-12-01 | 2012-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-06-01 | 2015-12-01 | 2016-06-01 | $7700.00 | Window Closed / Lapsed |