US6744133B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Adhesive film for semiconductor, lead frame and semiconductor device using the same
Assignee: Resonac Corp
•
Filing: 2002-08-06
•
Granted: 2004-06-01
•
Expires: 2022-08-06
Abstract
Abstract An adhesive film for semiconductor comprises a support film, and adhesive layers formed on both surfaces of the support film, in which each adhesive layer comprises an adhesive having a glass transition temperature of 200° C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 mum. A lead frame for semiconductor comprises a lead frame and an adhesive film for semiconductor according to the present invention. A semiconductor device comprises a lead frame and a semiconductor element, in which the lead frame and the semiconductor element are adhered to each other via an adhesive film for semiconductor according to the present invention.
Inventors
- 👤 Yoshiyuki Tanabe
- 👤 Hidekazu Matsuura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 19:56
CPC Classifications
C; C09; C09J; C09J7/00; C09J7/20; C09J7/22; H; H10; H10W; H10W70/00; H10W70/40; C09J163/00; C09J7/30; C09J7/38; H10W70/411; H10W70/415; H10W70/417; C09J2301/00; C09J2301/10; C09J2301/12; C09J2301/124; C09J2479/00; C09J2479/08; C09J2479/086; H10W72/00; H10W72/071; H10W72/073; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T428/00; Y10T428/28; Y10T428/2848
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
79 words
An adhesive film for semiconductor, comprising: a support film; and adhesive layers formed on both surfaces of the support film, wherein each one of the adhesive layers comprises an adhesive containing a thermoplastic resin and having a glass transition temperature of 200° C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 μm.
Claim 2
Dependent Claim
79 words
An adhesive film for semiconductor, comprising: a support film; and adhesive layers formed on both surfaces of the support film, wherein each one of the adhesive layers comprises an adhesive containing a thermoplastic resin and having a glass transition temperature of 200° C. or less, a coefficient of linear expansion of 70 ppm or less, and a storage elastic modulus of 3 GPa or less, and the adhesive film has a total thickness of between 43 and 57 μm.
Claim 3
Dependent Claim
20 words
An adhesive film for semiconductor according to claim 1 , wherein the glass transition temperature is 120° C. or more.
Claim 4
Dependent Claim
21 words
An adhesive film for semiconductor according to claim 1 , wherein the coefficient of linear expansion is 30 ppm or more.
Claim 5
Dependent Claim
20 words
An adhesive film for semiconductor according to claim 1 , wherein the storage elastic modulus is 1 GPa or more.
Claim 6
Dependent Claim
25 words
An adhesive film for semiconductor according to claim 1 , wherein each one of the adhesive layers has a thickness of 1 to 30 μm.
Claim 7
Dependent Claim
22 words
An adhesive film for semiconductor according to claim 1 , wherein the support film has a thickness of 5 to 50 μm.
Claim 8
Dependent Claim
28 words
A lead frame with an adhesive film for semiconductor, comprising: a lead frame, and an adhesive film for semiconductor according to claim 1 adhered to the lead frame.
Claim 9
Dependent Claim
37 words
A semiconductor device, comprising a lead frame and a semiconductor element, wherein the lead frame and the semiconductor element are adhered to each other by means of an adhesive film for semiconductor according to claim 1 .
Claim 10
Dependent Claim
137 words
An adhesive film for semiconductor according to claim 1 , wherein an overflow length of the adhesive is 2 mm or less; the overflow length of the adhesive being a length of the adhesive that overflows from a longitudinal side of an adhesive film sample in a perpendicular direction, being measured at a midpoint of the longitudinal side of the adhesive film sample, after the adhesive film sample is pressed at a pressure of 3 MPa and at a temperature of 350° C. for 1 minute; the adhesive film sample having a total thickness of 50 μm, a width of 19 mm, and a length of 50 mm, which comprises a support film having a thickness of 25 μm and two adhesive layers each having a thickness of 12.5 μm on both sides of the support film.
Claim 11
Dependent Claim
19 words
An adhesive film for semiconductor according to claim 9 , wherein said overflow length is 0.5 mm or less.
Claim 12
Dependent Claim
17 words
An adhesive film for semiconductor according to claim 1 , wherein said total thickness is 45-55 μm.
Claim 13
Dependent Claim
17 words
An adhesive film for semiconductor according to claim 11 , wherein said total thickness is 47-53 μm.
Claim 14
Dependent Claim
40 words
An adhesive film for semiconductor according to claim 1 , wherein said glass transition temperature is 120° C.-200° C., the coefficient of linear expansion is 30 ppm to 70 ppm, and the storage elastic modulus is 1 to 2.8 GPa.
Claim 15
Dependent Claim
41 words
An adhesive film for semiconductor according to claim 13 , wherein said glass transition temperature is 160° C. to 185° C., the coefficient of linear expansion is 50 to 68 ppm, and the storage elastic modulus is 1.5 to 2.5 GPa.
Claim 16
Dependent Claim
28 words
An adhesive film for semiconductor according to claim 1 , wherein said thermoplastic resin is a heat-resistant thermoplastic resin selected from the group consisting of polyimides and polyamides.
Claim 17
Dependent Claim
40 words
An adhesive film for semiconductor according to claim 15 , wherein said heat-resistant thermoplastic resin includes 10 mol % to 90 mol % amide group, based on the total amount of amide group and amide group after amide ring closure.
Claim 18
Dependent Claim
40 words
An adhesive film for semiconductor according to claim 16 , wherein said heat-resistant thermoplastic resin includes 30 mol % to 50 mol % amide group, based on the total amount of amide group and amide group after amide ring closure.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-06-01 | 2007-12-01 | 2008-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-06-01 | 2011-12-01 | 2012-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-06-01 | 2015-12-01 | 2016-06-01 | $7700.00 | Window Closed / Lapsed |