US5869888A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with lead structure on principal surface of chip
Assignee: Hitachi Microcomputer System Ltd
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Filing: 1996-09-26
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Granted: 1999-02-09
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Expires: 2016-09-26
Abstract
Abstract A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
Inventors
- 👤 Kunihiro Tsubosaki
- 👤 Michio Tanimoto
- 👤 Kunihiko Nishi
- 👤 Masahiro Ichitani
- 👤 Shunji Koike
- 👤 Kazunari Suzuki
- 👤 Ryosuke Kimoto
- 👤 Ichiro Anjoh
- 👤 Taisei Jin
- 👤 Akihiko Iwaya
- 👤 Gen Murakami
- 👤 Masamichi Ishihara
- 👤 Junichi Arita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H10W72/00; H10W72/071; H10W72/075; H10W72/20; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
264 words
A semiconductor device comprising: a semiconductor chip having a rectangular-shaped principal surface having two parallel longer sides and two parallel shorter sides on which a plurality of external terminals and a plurality of semiconductor elements are formed, said plurality of external terminals being arranged in a substantially central area of said principal surface substantially parallel to the two longer sides of said rectangular-shaped principal surface of said semiconductor chip; a sealing material covering said rectangular-shaped principal surface of said semiconductor chip; a plurality of first leads and a plurality of second leads disposed over said rectangular-shaped principal surface, each of said first and second leads having a first portion and a second portion, said first portions of said first and second leads being inside of said sealing material and arranged adjacent to said plurality of external terminals, said second portions of said first and second leads being exposed from said sealing material, said second portions of said first leads being extended from an interior position over said principal surface toward one of said longer sides of said rectangular-shaped principal surface of said semiconductor chip, said second portions of said second leads being extended from an interior position over said principal surface toward the other of said longer sides of said rectangular-shaped principal surface of said semiconductor chip, wherein at least one of said external terminals is connected with a corresponding one of said first and second leads; wherein said second portions of all of said first and second leads connected to said external terminals are over said rectangular-shaped principal surface of said semiconductor chip.
Claim 2
Dependent Claim
264 words
A semiconductor device comprising: a semiconductor chip having a rectangular-shaped principal surface having two parallel longer sides and two parallel shorter sides on which a plurality of external terminals and a plurality of semiconductor elements are formed, said plurality of external terminals being arranged in a substantially central area of said principal surface substantially parallel to the two longer sides of said rectangular-shaped principal surface of said semiconductor chip; a sealing material covering said rectangular-shaped principal surface of said semiconductor chip; a plurality of first leads and a plurality of second leads disposed over said rectangular-shaped principal surface, each of said first and second leads having a first portion and a second portion, said first portions of said first and second leads being inside of said sealing material and arranged adjacent to said plurality of external terminals, said second portions of said first and second leads being exposed from said sealing material, said second portions of said first leads being extended from an interior position over said principal surface toward one of said longer sides of said rectangular-shaped principal surface of said semiconductor chip, said second portions of said second leads being extended from an interior position over said principal surface toward the other of said longer sides of said rectangular-shaped principal surface of said semiconductor chip, wherein at least one of said external terminals is connected with a corresponding one of said first and second leads; wherein said second portions of all of said first and second leads connected to said external terminals are over said rectangular-shaped principal surface of said semiconductor chip.
Claim 3
Dependent Claim
15 words
A semiconductor device according to claim 1, wherein said sealing material is a sealing resin.
Claim 4
Dependent Claim
51 words
A semiconductor device according to claim 1, further comprising: an insulating adhesive film formed between said first portions of said first and second leads and said rectangular-shaped principal surface, wherein said first portions of said first and second leads are fixed on said rectangular-shaped principle surface by said insulating adhesive film.
Claim 5
Dependent Claim
21 words
A semiconductor device according to claim 1, wherein said external terminals are electrically connected with said corresponding leads by bonding wires.
Claim 6
Dependent Claim
24 words
A semiconductor device according to claim 1, wherein said second portion of said first and second leads are joined to a board with solder.
Claim 7
Dependent Claim
37 words
A semiconductor device according to claim 1, further comprising: a radiation fin for dissipating heat, said radiation fin being joined to a rear surface opposing said principal surface of said semiconductor chip with a heat conductive adhesive.
Claim 8
Dependent Claim
32 words
A semiconductor device according to claim 1, wherein side surfaces of said semiconductor chip between said principal surface and a rear surface opposing said principal surface are sealed with said sealing material.
Claim 9
Dependent Claim
41 words
A semiconductor device according to claim 1, wherein a height of said sealing material from said principal surface is lower than a height of ends of said second portions of each of said first and second leads from said principal surface.
Claim 10
Dependent Claim
114 words
A semiconductor device according to claim 1, wherein said plurality of external terminals form a row of external terminals substantially parallel to said two longer sides of said principal surface and are arranged such that a distance between one of said longer sides and said row of external terminals is substantially equal to a distance between the other of said longer sides and said row of external terminals, wherein said first portions of said first leads are arranged between said one of longer sides and said row of external terminals, and further wherein said first portions of said second leads are arranged between the other of longer sides and said row of external terminals.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-08 | 2002-08-10 | 2003-02-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-08 | 2006-08-10 | 2007-02-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-08 | 2010-08-10 | 2011-02-09 | $7700.00 | Window Closed / Lapsed |