US6566422B1
Expired / Lapsed
US
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Connecting material
Assignee: Dexerials Corp
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Filing: 2000-09-15
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Granted: 2003-05-20
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Expires: 2020-09-15
Abstract
Abstract A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (alpha1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (alpha2) of 110 ppm/° C. or less at temperatures above the Tg, wherein the difference (alpha2-alpha1) does not exceed over 60 ppm/° C.
Inventors
- 👤 Hidekazu Yagi
- 👤 Motohide Takeichi
- 👤 Junji Shinozaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 22:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; C; C09; C09J; C09J9/00; C09J9/02; C08; C08G; C08G59/00; C08G59/18; C08G59/40; C08G59/50; C08G59/5046; C08G59/5053; C08G59/5073; C09J163/00; C09J7/00; C09J7/10; C08G2650/00; C08G2650/28; C08G2650/56; C09J2301/00; C09J2301/30; C09J2301/314; C09J2463/00; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/06; H05K2201/068; H10; H10W; H10W72/00; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; Y; Y10; Y10S; Y10S525/00; Y10S525/903
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
103 words
A connecting material for bonding and connecting elements having electrodes thereon in a correspondingly confronting relation to each other, comprising an adhesive component comprising an epoxy resin and silica, the material having, after having been cured, characteristic features comprising a modulus of elasticity in the range of 1-12 GPa, a glass transition temperature (Tg) in the range of 120-200° C., a coefficient of linear expansion (α1) of 50 ppm/° C. or lower at temperatures below Tg and a coefficient of linear expansion (α2) of 110 ppm/° C. or lower at temperatures above Tg, wherein the difference (α2−α1) does not exceed 60 ppm/° C.
Claim 2
Dependent Claim
103 words
A connecting material for bonding and connecting elements having electrodes thereon in a correspondingly confronting relation to each other, comprising an adhesive component comprising an epoxy resin and silica, the material having, after having been cured, characteristic features comprising a modulus of elasticity in the range of 1-12 GPa, a glass transition temperature (Tg) in the range of 120-200° C., a coefficient of linear expansion (α1) of 50 ppm/° C. or lower at temperatures below Tg and a coefficient of linear expansion (α2) of 110 ppm/° C. or lower at temperatures above Tg, wherein the difference (α2−α1) does not exceed 60 ppm/° C.
Claim 3
Dependent Claim
34 words
The connecting material as claimed in claim 1 , wherein the adhesive component comprises 20-75% by weight of the epoxy resin, 25-80% by weight of silica and 0-40% by weight of a thermoplastic resin.
Claim 4
Dependent Claim
17 words
The connecting material as claimed in claim 2 , wherein the thermoplastic resin is a phenoxy resin.
Claim 5
Dependent Claim
33 words
The connecting material as claimed in claim 3 , wherein it further comprises 0-30%, based on the volume of the adhesive component, of electroconductive articles having an average particle size of 1-10 μm.
Claim 6
Dependent Claim
72 words
A connecting material for bonding and connecting elements having electrodes thereon in a correspondingly confronting relation to each other, comprising an adhesive component comprising an epoxy resin and silica, the material having, after having been cured, characteristic features comprising a linear contraction of 0.25% or less and a coefficient of linear expansion (α1) of 35 ppm/° C. or lower at temperatures below the glass transition temperature (Tg) of the cured connecting material.
Claim 7
Dependent Claim
72 words
A connecting material for bonding and connecting elements having electrodes thereon in a correspondingly confronting relation to each other, comprising an adhesive component comprising an epoxy resin and silica, the material having, after having been cured, characteristic features comprising a linear contraction of 0.25% or less and a coefficient of linear expansion (α1) of 35 ppm/° C. or lower at temperatures below the glass transition temperature (Tg) of the cured connecting material.
Claim 8
Dependent Claim
34 words
The connecting material as claimed in claim 5 , wherein the adhesive component comprises 20-75% by weight of the epoxy resin, 25-80% by weight of silica and 0-40% by weight of a thermoplastic resin.
Claim 9
Dependent Claim
17 words
The connecting material as claimed in claim 6 , wherein the thermoplastic resin is a phenoxy resin.
Claim 10
Dependent Claim
33 words
The connecting material as claimed in claim 7 , wherein it further comprises 0-30%, based on the volume of the adhesive component, or electroconductive particles having an average particle size of 1-10 μm.
Claim 11
Dependent Claim
23 words
The connecting material as claimed in claim 7 , wherein it has, after having been cured, a moisture absorbability of 2% or lower.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-05-19 | 2006-11-18 | 2007-05-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-05-19 | 2010-11-18 | 2011-05-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-05-19 | 2014-11-18 | 2015-05-20 | $7700.00 | Window Closed / Lapsed |