EP0893484A2
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EP
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Multilayer anisotropic electroconductive adhesive and method for manufacturing same
Assignee: Dexerials Corp
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Filing: 1998-07-23
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Granted: —
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Expires: 2018-07-23
Abstract
Abstract A multilayer anisotropic electroconductive adhesive, comprises an anisotropic electroconductive adhesive layer and laminated to at least one side thereof an insulating adhesive layer. The anisotropic electroconductive adhesive layer comprises a film-forming resin and electroconductive particles and has a melt viscosity at 150°C of 100 poise or higher, and the insulating adhesive layer comprises a latent curing agent and a resin having a functional group and has a melt viscosity at 150°C of less than 100 poise.
Inventors
- 👤 Yukio c/o Sony Chemicals Corporation Yamada
- 👤 Masao c/o Sony Chemicals Corporation Saito
- 👤 Junji c/o Sony Chemicals Corporation Shinozaki
- 👤 Motohide c/o Sony Chemicals Corporation Takeichi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-27 23:24
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; C; C09; C09J; C09J9/00; C09J9/02; C09J7/00; C09J7/10; H10; H10W; H10W72/00; H10W72/30; C09J2203/00; C09J2203/326; C09J2301/00; C09J2301/10; C09J2301/12; C09J2301/124; C09J2301/1242; C09J2301/20; C09J2301/208; C09J2301/30; C09J2301/314; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2203/00; H05K2203/11; H05K2203/1189; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/25; Y10T428/256; Y10T428/28; Y10T428/2852; Y10T428/287; Y10T428/29; Y10T428/2982; Y10T428/2991
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
77 words
A multilayer anisotropic electroconductive
adhesive, comprising an anisotropic electroconductive
adhesive layer and laminated to at least one side thereof
an insulating adhesive layer, wherein said anisotropic electroconductive adhesive
layer comprises a film-forming resin and electroconductive
particles and has a melt viscosity at 150°C of 100 poise or
higher, and the insulating adhesive layer comprises a
latent curing agent and a resin having a functional group
and has a melt viscosity at 150°C of less than 100 poise.
Claim 2
Dependent Claim
53 words
A multilayer anisotropic electroconductive
adhesive according to Claim 1, wherein the anisotropic
electroconductive adhesive layer has a melt viscosity at
150°C of 100 poise or higher but no more than 300 poise,
and the insulating adhesive layer has a melt viscosity at
150°C of 30 poise or higher but less than 100 poise.
Claim 3
Dependent Claim
49 words
A multilayer anisotropic electroconductive
adhesive according to Claim 1, wherein the
electroconductive particles are coated with an insulating
resin that is insoluble in the anisotropic
electroconductive adhesive, and have a diameter of 2-7 µm
and are contained in the anisotropic electroconductive
adhesive layer in an amount of 5-60 vol%.
Claim 4
Dependent Claim
118 words
A multilayer anisotropic electroconductive
adhesive according to Claim 1, wherein, in a connected structure obtained by connecting the
electrodes of an IC chip and the electrodes of a circuit
board by means of the multilayer anisotropic
electroconductive adhesive, the thickness of the insulating adhesive layer is 0.7-1.5
times the thickness of the electrodes of the IC chip
and the electrodes of the circuit board, the thickness of
the anisotropic electroconductive adhesive layer is 0.5-3
times the diameter of the electroconductive particles
dispersed in the anisotropic electroconductive adhesive,
and the thickness of the multilayer anisotropic
electroconductive adhesive is 0.8-2 times the thickness of
the electrodes of the IC chip and the thickness of the
electrodes of the circuit board.
Claim 5
Independent Claim
75 words
A method for manufacturing a multilayer
anisotropic electroconductive adhesive, comprising: a step of applying an anisotropic electroconductive
adhesive containing a film-forming resin and
electroconductive particles to a first release film,
followed by drying to form an anisotropic electroconductive
adhesive layer; and a step of applying an insulating adhesive containing a
latent curing agent and a resin having functional groups to
the anisotropic electroconductive adhesive layer, followed
by drying to form a first insulating adhesive layer.
Claim 6
Independent Claim
168 words
A method for manufacturing a multilayer
anisotropic electroconductive adhesive, comprising: a step of an anisotropic electroconductive adhesive
containing a film-forming resin and electroconductive
particles to a first release film, followed by drying to
form an anisotropic electroconductive adhesive layer, where
the electroconductive particles are coated with an
insulating resin that is insoluble in the anisotropic
electroconductive adhesive; a step of an insulating adhesive containing a latent
curing agent and a resin having functional groups to the
anisotropic electroconductive adhesive layer, followed by
drying to form a first insulating adhesive; a step of laminating a second release film having a
greater peel force than the first release film to the first
insulating adhesive layer; a step of peeling off the first release film to make
the anisotropic electroconductive adhesive layer exposed;
and a step of applying an insulating adhesive having the
same latent curing agent and resin as the insulating
adhesive layer to the exposed anisotropic electroconductive
adhesive layer, followed by drying to form a second
insulating adhesive layer.
Claim 7
Independent Claim
169 words
A method for manufacturing a multilayer
anisotropic electroconductive adhesive, comprising: a step of an anisotropic electroconductive adhesive
containing a film-forming resin and electroconductive
particles to a first release film, followed by drying to
form an anisotropic electroconductive adhesive layer, where
the electroconductive particles are coated with an
insulating resin that is insoluble in the anisotropic
electroconductive adhesive; a step of an insulating adhesive containing a latent
curing agent and a resin having functional groups to the
anisotropic electroconductive adhesive layer, followed by
drying to form a first insulating adhesive; a step of laminating a second release film having a
greater peel force than the first release film to the first
insulating adhesive layer; a step of peeling off the first release film to make
the anisotropic electroconductive adhesive layer exposed;
and a step of laminating the second insulating adhesive
layer, which has been obtained by applying an insulating
adhesive having the same latent curing agent and resin as
the insulating adhesive layer, to the exposed anisotropic
electroconductive adhesive layer.
Claim 8
Dependent Claim
50 words
A connected structure comprising an IC chip and a
circuit board, the electrodes of the IC chip and the
electrodes of the circuit board being connected each other
by means of the multilayer anisotropic electroconductive
adhesive obtained by a manufacturing method according to
any one of Claims 5 through 7.
References Cited (Backward Citations)
No citation records indexed.
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