EP0824270A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A method of mounting a plurality of electronic parts on a circuit board
Assignee: Resonac Corp
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Filing: 1997-08-06
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Granted: —
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Expires: 2017-08-06
Abstract
Abstract A method of mounting electronic parts (1) on a circuit board (9) comprises: an adhesive layer formation step of forming, on an electrode surface of each electronic part (1) on which electrodes are formed, a film-like thermosetting adhesive layer (4) having an area substantially equal to that of the corresponding electrode surface, to obtain adhesive-coated electronic parts; a positioning step of placing the electrodes on which the adhesive layer is formed so as to face corresponding electrodes of the circuit board (9) and positioning the electrodes (12) relative to each other; and a heat-pressure bonding step of applying heat and pressure to the electrodes of the electronic parts (1) and the electrodes of the circuit board to fix the electrodes to each other after the electrodes are positioned. Almost no adhesive superfluously comes out of the electrode surfaces. Accordingly, when mounting the electronic parts (1) on the circuit board (9), it is unnecessary to remove superfluous adhesive, unlike conventional process, whereby the efficiency is improved and also the cost can be cut down.
Inventors
- 👤 Tsukagoshi Isao
- 👤 Fukushima Naoki
- 👤 Kobayashi Kouji
- 👤 Koide Jyunichi
- 👤 Matsuda Kazuya
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-03 00:00
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H10; H10P; H10P72/00; H10P72/70; H10P72/74; H10W; H10W72/00; H10W72/01; H10W72/013; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/03; H05K2203/0338; H10W72/011; H10W72/0113; H10W72/071; H10W72/0711; H10W72/07125; H10W72/072; H10W72/07251; H10W72/073; H10W72/07331; H10W72/074; H10W72/20; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; Y; Y10; Y10S; Y10S428/00; Y10S428/914; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1054; Y10T156/1062; Y10T156/1066; Y10T156/108; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24851; Y10T428/2486; Y10T428/28; Y10T428/2852; Y10T428/287
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
166 words
A method of mounting a plurality of electronic parts
(1) on a circuit board by bonding and fixing electrodes of the
electronic parts (1) to the circuit board (9) to electrically
connect the individual electronic parts to the circuit board,
said method characterized in that comprises: an adhesive layer formation step of forming, on an electrode
surface of each of the electronic parts (1) on which the
electrodes (12) are formed, a film-like thermosetting adhesive
layer (4) having an area substantially equal to that of the
corresponding electrode surface, to obtain adhesive-coated
electronic parts; a positioning step of placing the electrodes (12) on which
the adhesive layer (4) is formed so as to face corresponding
electrodes of the circuit board (9) and positioning the
electrodes (12) relative to each other; and a heat-pressure bonding step of applying heat and pressure
to the electrodes of the electronic parts and the electrodes of
the circuit board to fix the electrodes to each other after the
electrodes are positioned.
Claim 2
Independent Claim
187 words
A method of mounting a plurality of electronic parts
(1) on a circuit board (9) by bonding and fixing the electronic
parts (1) to the circuit board (9) to electrically connect the
individual electronic parts (1) to the circuit board (9), said
method characterized in that comprises: an adhesive layer formation step of forming, on an electrode
surface of each of the electronic parts (1) on which electrodes
are formed, a film-like thermosetting adhesive layer having an
area substantially equal to that of the corresponding electrode
surface, to obtain adhesive-coated electrodes; a temporary fixing step of positioning the electrodes of
the electronic parts (1) on which the adhesive layer (4) is formed
so as to face corresponding electrodes of the circuit board (9),
and increasing cohesive strength of the adhesive to such an
extent that connection of the electrodes can be maintained; and heat-pressure bonding step of applying heat and pressure
to the temporarily fixed electrodes to fix the electrodes to each
other, said heat-pressure bonding step including simultaneously
heating a plurality of electronic parts in an autoclave with a
static pressure applied thereto within the autoclave.
Claim 3
Dependent Claim
35 words
The method according to claim 1 or 2, characterized in
that the film-like adhesive layer (4) has an area falling within
a range of ±30% with respect to the area of the corresponding
electrode surface.
Claim 4
Independent Claim
37 words
The method according to any one of claims 1 to 3, characterized in
that further includes an inspection step of inspecting
electrical connection between the electrodes after said
temporary fixing step and before said heat-pressure bonding
step.
Claim 5
Dependent Claim
80 words
A group of adhesive-coated electronic parts each having
an electrode surface coated with a film-like adhesive layer (4),
characterized in that comprises: a connection sheet (6) including a film-like adhesive layer
(4) and a separator (5) from which the film-like adhesive layer
can be peeled; and a plurality of electronic parts (1) arranged on the
film-like adhesive layer (4) of said connection sheet (6), each
of said electronic parts being affixed to the adhesive layer at
an electrode surface thereof.
Claim 6
Dependent Claim
22 words
The group of adhesive-coated electronic parts
according to claim 5, characterized in that said adhesive layer
(4) contains electrically conducting particles (14).
Claim 7
Independent Claim
187 words
A method of producing an adhesive-coated electronic
part (1) having an electrode surface coated with a film-like
adhesive layer (4), characterized in that comprises: a connection sheet (6) placement step of arranging a
connection sheet including a film-like adhesive layer (4) and
a separator (5) from which the adhesive layer can be peeled, the
connection sheet having a size greater than that of an electrode
surface of an electronic part on which electrodes are formed; a contacting step of bringing the electrode surface of the
electronic part into contact with the adhesive layer; a heating step of heating the electrode surface to form a
cohesion reduction line (10) across which cohesive strength of
the adhesive lowers, at a location between a region of the
adhesive layer corresponding to the electrode surface and a
region of the adhesive layer surrounding the electrode surface;
and a separating step of separating the electronic part (1) from
the connection sheet (6) such that part of the adhesive layer
(4) having a size substantially identical with that of the
electrode surface is separated from the separator and adheres
to the electrode surface.
Claim 8
Dependent Claim
36 words
The method according to claim 7, characterized in that
in said heating step, the electronic part is heated by a heating
head (2) arranged at a rear surface of the electronic part
opposite the electrode surface.
Claim 9
Independent Claim
151 words
A method of producing an adhesive-coated electronic
part having an electrode surface coated with a film-like adhesive
layer, characterized in that comprises: a connection sheet (6) placement step of arranging a
connection sheet including a film-like adhesive layer (4) and
a separator (5) from which the adhesive layer can be peeled, the
connection sheet having a size greater than that of an electronic
part; a contacting step of bringing an electrode surface of the
electronic part (1) on which electrodes (12) are formed into
contact with the adhesive layer; a cutting step of pressing the electrode surface against
the adhesive layer and cutting at least part of the adhesive layer
along a periphery of the electronic part; and a separating step of separating the electronic part from
the connection sheet (6) such that part of the adhesive layer
(4) is separated from the separator (5) and adheres to the
electrode surface.
Claim 10
Dependent Claim
43 words
The method according to claim 9, characterized in that
in said cutting step, the adhesive layer (4) is cut with a cutter
(7) which is arranged at a pressure head for pressing the
electrode surface of the electronic part against the connection
sheet.
Claim 11
Dependent Claim
25 words
The method according to claim 9, characterized in that
in said cutting step, the adhesive layer (4) is cut by means of
a heating wire.
Claim 12
Independent Claim
32 words
The method according to any one of claims 9 to 11, characterized in that
the connection sheet (6) is placed on a surface plate with a
cushioning member (1) interposed there between.
Claim 13
Independent Claim
27 words
The method according to any one of claims 1 to 4 and 7 to 12, characterized
in that the adhesive layer (4) contains electrically conducting
particles (14).
References Cited (Backward Citations)
No citation records indexed.
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