Integrated circuit package

Claim 2

A computer system comprising: a processor connected to a bus; a memory connected to the bus; an input/output device connected to the bus; and an integrated circuit package in the processor, the memory device, or the input/output device, the integrated circuit package comprising: an integrated circuit formed in a die having an edge; a substrate; and a plurality of non-I/O columns bonded between the substrate and the die a selected distance from the edge of the die.

Claim 3

The computer system of claim 1 wherein each column comprises a stress bearing solder column.

Claim 4

The computer system of claim 1 wherein each column has a center, a diameter and an edge, and the edge of each of the columns is bonded a selected distance from the edge of the die that is less than or equal to the diameter of the column.

Claim 5

The computer system of claim 1 , further comprising: a metal mesh located in the die and connected to the columns and to a reference voltage; and a metal mesh located in the substrate and connected to the columns and to the reference voltage wherein the metal mesh in the die and the substrate and the columns shield the integrated circuit from EMI.

Claim 6

The computer system of claim 1 wherein: the die is located in a body and a plurality of wires are connected between the die and the body to transmit I/O signals between the die and the body; the columns are bonded between the body and the substrate to form a ball grid array package; and further comprising a plurality of I/O columns bonded between the body and the substrate to transmit the I/O signals.

Claim 9

The method of claim 6 wherein: placing a plurality of first deformable adhesive bumps comprises placing a plurality of first solder bumps on the die; placing a plurality of second deformable adhesive bumps comprises placing a plurality of second solder bumps on a surface of a substrate; bonding the die comprises bonding the die to the substrate in a solder reflow procedure for the first and second solder bumps.

Claim 10

The method of claim 6 wherein placing a plurality of first deformable adhesive bumps comprises placing a plurality of first deformable adhesive bumps on the die, each bump having an edge placed a selected distance from the edge of the die that is less than or equal to a diameter of the bump.

Claim 11

The method of claim 6 wherein placing a plurality of first deformable adhesive bumps comprises placing a plurality of first deformable adhesive bumps on the die in contact with an edge region of the die.

Claim 12

The method of claim 6 wherein: placing a plurality of first deformable adhesive bumps comprises placing a plurality of first deformable adhesive bumps on the die in contact with a metal mesh in the die; placing a plurality of second deformable adhesive bumps comprises placing a plurality of second deformable adhesive bumps on a surface of a substrate in contact with a metal mesh in the substrate; and bonding the die comprises bonding the die to the substrate by reforming the first and second deformable adhesive bumps into a plurality of non-I/O columns bonded between the substrate and the die and connected between the metal mesh in the die and the substrate to shield the integrated circuit from EMI.

Claim 13

The method of claim 6 , further comprising forcing an epoxy underfill between the die and the substrate to surround the columns.

Claim 14

The method of claim 11 , further comprising raising and lowering a temperature of the die, the substrate, the non-I/O columns, and the epoxy underfill to generate deformation of the epoxy underfill and strain the die.

Claim 17

The method of claim 13 wherein placing a plurality of deformable adhesive bumps comprises: placing a plurality of solder bumps on the surface of the die a selected distance from the edge, one or more of the solder bumps placed the selected distance from the edge being electrically non-functional; and placing a plurality of solder bumps on the surface of the die at a distance from the edge that is greater than the selected distance.

Claim 18

The method of claim 13 wherein placing a plurality of deformable adhesive bumps comprises placing a center of each of a plurality of deformable adhesive bumps on the surface of the die a selected distance from the edge that is less than or equal to a diameter of the bump.

Claim 19

The method of claim 13 wherein placing a plurality of deformable adhesive bumps comprises placing an edge of each of a plurality of deformable adhesive bumps on the surface of the die a selected distance from the edge that is less than or equal to a diameter of the bump.

Claim 20

The method of claim 13 wherein forming an integrated circuit comprises forming an integrated circuit in a rectangular silicon die having a surface and four edges joined at four corners to define a physical boundary of the silicon die.

Claim 21

The method of claim 17 wherein: forming an integrated circuit further comprises forming the integrated circuit inside an active boundary that is inside the physical boundary of the silicon die to define an edge region in the silicon die between the active boundary and the physical boundary; and wherein placing a plurality of deformable adhesive bumps comprises placing a plurality of deformable adhesive bumps on the surface of the silicon die having portions in contact with the active boundary and the edge region of the silicon die.

Claim 22

The method of claim 17 wherein: forming an integrated circuit further comprises forming the integrated circuit inside an active boundary that is inside the physical boundary of the silicon die to define an edge region in the silicon die between the active boundary and the physical boundary; and wherein placing a plurality of deformable adhesive bumps comprises placing a plurality of deformable adhesive bumps on the surface of the silicon die in contact with the edge region of the silicon die between the active boundary and the physical boundary.

Claim 25

The method of claim 20 wherein placing a plurality of deformable adhesive bumps comprises: placing a plurality of solder bumps on the surface of the die a selected distance from the edge, at least one of the bumps placed a selected distance from the edge being electrically non-functional; and placing a plurality of solder bumps on the surface of the die inside the bumps placed a selected distance from the edge.

Claim 26

The method of claim 20 wherein placing a plurality of deformable adhesive bumps comprises placing a center of each of a plurality of deformable adhesive bumps on the surface of the die a selected distance from the edge that is less than or equal to a diameter of the bump.

Claim 27

The method of claim 20 wherein placing a plurality of deformable adhesive bumps comprises placing an edge of each of a plurality of deformable adhesive bumps on the surface of the die a selected distance from the edge that is less than or equal to a diameter of the bump.

Claim 28

The method of claim 20 wherein: forming an integrated circuit comprises: preparing a wafer of silicon having a surface; forming a plurality of integrated circuits on the surface of the wafer; and forming a repeating rectangular pattern of scribe lines in the surface of the wafer, each integrated circuit being surrounded by a rectangle of scribe lines; placing a plurality of deformable adhesive bumps comprises: placing a plurality of solder bumps inside each rectangle on the surface of the wafer, selected ones of the solder bumps in each rectangle being placed a selected distance from each scribe line of the rectangle; conducting a reflow procedure to reflow the solder bumps; and cutting the wafer along the scribe lines to separate silicon dies from the wafer, each silicon die having four edges corresponding to the scribe lines that define a physical boundary surrounding the integrated circuit in the silicon die, and each silicon die having a plurality of the solder bumps placed a selected distance from the physical boundary; bonding the die to a substrate comprises: aligning the solder bumps on the silicon die with corresponding solder bumps or bonding pads on a plastic substrate; and conducting a reflow procedure to join the solder bumps on the silicon die with the solder bumps or the bonding pads on the plastic substrate to form solder columns connecting the silicon die to the plastic substrate; and placing underfill between the die and the substrate comprises forcing epoxy between the silicon die and the plastic substrate to surround the solder columns with the epoxy.

Claim 29

The method of claim 24 wherein: forming an integrated circuit further comprises forming each integrated circuit inside an active boundary that is inside the rectangle of scribe lines to define an edge region between the active boundary and the rectangle of scribe lines; and wherein placing a plurality of solder bumps comprises placing a plurality of solder bumps inside each rectangle of scribe lines, the solder bumps having portions in contact with the active boundary and the edge region.

Claim 30

The method of claim 24 wherein: forming an integrated circuit further comprises forming each integrated circuit inside an active boundary that is inside the rectangle of scribe lines to define an edge region between the active boundary and the rectangle of scribe lines; and wherein placing a plurality of solder bumps comprises placing a plurality of solder bumps inside each rectangle of scribe lines, the solder bumps being in contact with the edge region between the active boundary and the rectangle of scribe lines.