US6696748B1
Expired / Lapsed
US
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Stress balanced semiconductor packages, method of fabrication and modified mold segment
Assignee: Micron Technology Inc
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Filing: 2002-08-23
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Granted: 2004-02-24
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Expires: 2022-08-23
Abstract
Abstract Stress balanced semiconductor device packages, a method of forming, and a method of modifying a mold segment for use in the method. A semiconductor die is attached to one side of a substrate having discrete conductive elements such as a ball grid array (BGA) on the opposing side thereof. An envelope of encapsulant material is disposed over the semiconductor die on one side of the substrate while a stress balancing structure comprising at least one stem member and at least one transversely extending branch member formed of encapsulant material is disposed over the opposing side of the substrate in an arrangement which does not interfere with the discrete conductive elements. The envelope and the stress balancing structure may be simultaneously formed.
Inventors
- 👤 Blaine J. Thurgood
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:46
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W74/121; H10W74/15; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
98 words
A semiconductor package comprising: a substrate; at least one semiconductor die disposed on a first side of the substrate; a plurality of discrete conductive elements disposed on an opposing side of the substrate and operably coupled to the at least one semiconductor die; a die encapsulation region extending over the at least one semiconductor die; and at least one stem member and at least one branch member extending substantially transversely to the at least one stem member, the at least one stem member and the at least one branch member disposed on the opposing side of the substrate.
Claim 2
Dependent Claim
98 words
A semiconductor package comprising: a substrate; at least one semiconductor die disposed on a first side of the substrate; a plurality of discrete conductive elements disposed on an opposing side of the substrate and operably coupled to the at least one semiconductor die; a die encapsulation region extending over the at least one semiconductor die; and at least one stem member and at least one branch member extending substantially transversely to the at least one stem member, the at least one stem member and the at least one branch member disposed on the opposing side of the substrate.
Claim 3
Dependent Claim
27 words
The semiconductor package of claim 1 , wherein the at least one stem member and the at least one branch member are substantially perpendicular to each other.
Claim 4
Dependent Claim
24 words
The semiconductor package of claim 1 , wherein the at least one stem member and the at least one branch member are substantially contiguous.
Claim 5
Dependent Claim
44 words
The semiconductor package of claim 1 , wherein the at least one stem member is disposed between portions of the plurality of discrete conductive elements and the at least one branch member is disposed at an end of the plurality of discrete conductive elements.
Claim 6
Dependent Claim
30 words
The semiconductor package of claim 4 , wherein the at least one branch member comprises two branch members, each disposed at an end of the plurality of discrete conductive elements.
Claim 7
Dependent Claim
45 words
The semiconductor package of claim 1 , wherein the at least one stem member is disposed at one side of the plurality of discrete conductive elements and the at least one branch member is disposed at an end of the plurality of discrete conductive elements.
Claim 8
Dependent Claim
53 words
The semiconductor package of claim 1 , wherein the at least one stem member comprises two stem members, each disposed at one side of the plurality of discrete conductive elements and the at least one branch member comprises two branch members, each disposed at one end of the plurality of discrete conductive elements.
Claim 9
Dependent Claim
27 words
The semiconductor package of claim 1 , wherein the at least one stem member and the at least one branch member are made from a polymer material.
Claim 10
Dependent Claim
17 words
The semiconductor package of claim 8 , wherein the polymer material comprises a silicon particle-filled thermoplastic polymer.
Claim 11
Dependent Claim
25 words
The semiconductor package of claim 8 , wherein the polymer material is selected from the group consisting of epoxies, silicones, silicone-carbon resins, polyimides, and polyurethanes.
Claim 12
Dependent Claim
33 words
The semiconductor package of claim 8 , wherein the die encapsulation region is formed of the same polymer material as the at least one stem member and the at least one branch member.
Claim 13
Dependent Claim
21 words
The semiconductor package of claim 1 , wherein the at least one semiconductor die includes an active surface facing the substrate.
Claim 14
Dependent Claim
23 words
The semiconductor package of claim 1 , wherein the at least one semiconductor die includes an active surface facing away from the substrate.
Claim 15
Dependent Claim
30 words
The semiconductor package of claim 1 , wherein the at least one semiconductor die is operably coupled to the plurality of discrete conductive elements at least partially through bond wires.
Claim 16
Dependent Claim
18 words
The semiconductor package of claim 14 , wherein the bond wires extend through a slot in the substrate.
Claim 17
Dependent Claim
23 words
The semiconductor package of claim 1 , wherein the package includes a neutral axis at least proximate to a center of the substrate.
Claim 18
Dependent Claim
19 words
The semiconductor package of claim 16 , wherein the neutral axis lies substantially in a plane of the substrate.
Claim 19
Dependent Claim
35 words
The semiconductor package of claim 1 , wherein the at least one stem member is substantially longitudinally oriented on the substrate and the at least one branch member is substantially laterally oriented on the substrate.
Claim 20
Dependent Claim
37 words
The semiconductor package of claim 1 , wherein a volume of material of the die encapsulation region and combined volumes of the at least one stem member and the at least one branch member are substantially equal.
Claim 21
Dependent Claim
19 words
The semiconductor package of claim 1 , wherein the at least one stem member comprises a wire bond cap.
Claim 22
Dependent Claim
110 words
A memory module, comprising: a printed circuit board; at least one semiconductor package, comprising: a substrate; at least one semiconductor memory die disposed on a first side of the substrate; a plurality of discrete conductive elements disposed on an opposing side of the substrate and operably coupled to the at least one semiconductor memory die; an encapsulation region extending over the at least one semiconductor memory die; and at least one stem member and at least one branch member extending substantially transversely to the at least one stem member, the at least one stem member and the at least one branch member disposed on the opposing side of the substrate.
Claim 23
Dependent Claim
110 words
A memory module, comprising: a printed circuit board; at least one semiconductor package, comprising: a substrate; at least one semiconductor memory die disposed on a first side of the substrate; a plurality of discrete conductive elements disposed on an opposing side of the substrate and operably coupled to the at least one semiconductor memory die; an encapsulation region extending over the at least one semiconductor memory die; and at least one stem member and at least one branch member extending substantially transversely to the at least one stem member, the at least one stem member and the at least one branch member disposed on the opposing side of the substrate.
Claim 24
Dependent Claim
20 words
The memory module of claim 21 , wherein the at least one semiconductor package comprises a plurality of semiconductor packages.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-02-23 | 2007-08-25 | 2008-02-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-02-23 | 2011-08-25 | 2012-02-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-02-23 | 2015-08-25 | 2016-02-24 | $7700.00 | Window Closed / Lapsed |